The present invention relates to the field of solar cells, and in particular to a main-gate-free and high-efficiency back-contact solar cell module, a main-gate-free and high-efficiency back-contact solar cell assembly, and a preparation process thereof. The solar cell module, comprising cells and an electrical connection layer, a backlight side of the cells having P-electrodes connected to a P-type doping layer and N-electrodes connected to a N-type doping layer, is characterized in that the electrical connection layer comprises a number of parallel leads each electrically connected to the P-electrodes or the N-electrodes. The present invention has the beneficial effect that a main-gate-free and high-efficiency back-contact solar cell module, a main-gate-free and high-efficiency back-contact solar cell assembly, and a preparation process thereof are provided, which can effectively the short-circuiting of the P-electrodes and the N-electrodes and has the advantages of low cost, high hidden-cracking resistance, high efficiency and high stability.

A method for the production of a photovoltaic module comprising back-contact solar cells. A lower encapsulating layer, followed by an alignment and an application of the lower encapsulating layer to the inner surface of the back-contact back-sheet. The lower encapsulating layer, comprises a lower surface facing the back-contact back-sheet and an upper surface opposite the lower surface. The method includes adhesion of one or more predetermined portions of the lower surface of the encapsulating layer to the back-contact back-sheet, having each portion a predetermined superficial area which is lower than the total area of the lower surface of the lower encapsulating layer. The adhesion of the lower encapsulating layer is followed by the application of the lower encapsulating layer to the back-contact back-sheet.

The disclosure provides a solar cell encapsulating module including a first substrate, a first encapsulating material layer, a metal particle layer, multiple solar cells, a routing layer, a second encapsulating material layer and a second substrate. The first substrate is formed from a light transmittance material. The first encapsulating material layer is formed on the first substrate. The metal particle layer is formed on the first encapsulating material layer. The solar cells are disposed on the metal particle layer. The routing layer is disposed on the solar cells for being electrically connected to the plurality of solar cells. The second encapsulating material layer is formed on the routing layer. The second substrate is disposed on the second encapsulating material layer. The routing layer is disposed on only one side of the solar cells.

A solar cell module and a method for manufacturing the same are disclosed. The method for manufacturing the solar cell module includes applying a low melting point metal on an electrode included in each of a plurality of solar cells, melting the low melting point metal to form a contact layer on the electrode, generating an ultrasonic vibration in the contact layer to remove a surface oxide layer formed on a surface of the electrode, melting a surface metal of the electrode and the contact layer to form a metal connection layer on the surface of the electrode, and connecting the metal connection layer to an interconnector.

A solar cell in a stack structure having no step may include a solar cell, and an electrode formed on one surface of the solar cell, in which the solar cell is/are stacked on a center portion of a substrate with the electrode interposed therebetween, and the electrode is/are in contact with an electrode line coated on an edge portion of the substrate.

An apparatus for the manufacture of at least two arrangements of solar cell pieces is provided. The apparatus includes at least one positioning device configured for positioning two or more solar cell pieces on a support device for forming the at least two arrangements, wherein the apparatus is configured to allocate the two or more solar cell pieces to a respective arrangement of the at least two arrangements based on one or more properties of the two or more solar cell pieces.

A solar cell module includes a plurality of solar cells and includes first and second solar cells positioned adjacent to each other in a first direction, the solar cell module further comprises a connector for connecting hole terminals of the first solar cell to electron terminals of the second solar cell, the hole terminals being positioned on the first solar cell and being separated from each other and the electron terminals being positioned on the second solar cell and being separated from each other. The hole terminals and the electron terminals of each solar cell are positioned parallel to a first side of each solar cell, the connector is positioned parallel to a second side crossing the first side of each solar cell, and the connector is positioned on the same side of the first and second solar cells.

An apparatus including a carrier substrate configured to move a microelectronic device. The apparatus further includes a rotatable body configured to receive the microelectronic device. Additionally, the apparatus includes a second substrate configured to receive the microelectronic device from the rotatable body.

The present disclosure relates to a solar cell and a solar cell panel including the same, and more particularly, to a solar cell with an improved structure and an improved manufacturing process and a solar cell panel including the same.

Solar cells having a plurality of sub-cells coupled by metallization structures, and singulation approaches to forming solar cells having a plurality of sub-cells coupled by metallization structures, are described. In an example, a solar cell, includes a plurality of sub-cells, each of the sub-cells having a singulated and physically separated semiconductor substrate portion. Adjacent ones of the singulated and physically separated semiconductor substrate portions have a groove there between. The solar cell also includes a monolithic metallization structure. A portion of the monolithic metallization structure couples ones of the plurality of sub-cells. The groove between adjacent ones of the singulated and physically separated semiconductor substrate portions exposes a portion of the monolithic metallization structure.