An integrated circuit comprising a surrounding gate transistor (SGT) MOSFET and a super barrier rectifier (SBR) is disclosed. The SBR horizontally disposed in different areas to the SGT MOSFET on single chip creates a low potential barrier for majority carrier in MOS channel, therefore has lower forward voltage and reverse leakage current than conventional Schottky Barrier Rectifier. Moreover, in some preferred embodiment, a multiple stepped oxide (MSO) structure is applied to the shielded gate structure to further reduce the on-resistance.

An integrated circuit comprising a SGT MOSFET and a SBR is disclosed. The SBR horizontally disposed in different areas to the SGT MOSFET on single chip creates a low potential barrier for majority carrier in MOS channel, therefore has lower forward voltage and reverse leakage current than conventional Schottky Barrier Rectifier. Moreover, in some preferred embodiment, a MSO structure is applied to the shielded gate structure to further reduce the on-resistance.

A sensor includes a first electrode and a second electrode, and a photo-active layer between the first electrode and the second electrode. The photo-active layer includes a light absorbing semiconductor configured to form a Schottky junction with the first electrode. The photo-active layer has a charge carrier trapping site configured to capture photo-generated charge carriers generated based on the light absorbing semiconductor absorbing incident light that enters at least the photo-active layer at a position adjacent to the first electrode. The sensor is configured to have an external quantum efficiency (EQE) that is adjusted based on a voltage bias being applied between the first electrode and the second electrode.

A radiation detector comprises an antenna structure; and a field effect transistor structure having a source region, a gate region, and a drain region, arranged on a substrate and forming mutually independent electrically conductive electrode structures through metallization, wherein the gate electrode structure completely encloses the source electrode structure or the drain electrode structure in a first plane; the enclosed electrode structure extends up to above the gate electrode structure and there overlaps the enclosure in a second plane above the first plane at least in sections in a planar manner; wherein an electrically insulating region for forming a capacitor with a metal-insulator-metal structure is arranged between the regions of the gate electrode structure overlapped by the enclosed electrode structure.

A radiation detector comprises an antenna structure; and a field effect transistor structure having a source region, a gate region, and a drain region, arranged on a substrate and forming mutually independent electrically conductive electrode structures through metallization, wherein the gate electrode structure completely encloses the source electrode structure or the drain electrode structure in a first plane; the enclosed electrode structure extends up to above the gate electrode structure and there overlaps the enclosure in a second plane above the first plane at least in sections in a planar manner; wherein an electrically insulating region for forming a capacitor with a metal-insulator-metal structure is arranged between the regions of the gate electrode structure overlapped by the enclosed electrode structure.

A radiation detection device includes a plurality of field effect transistors (FETs) arranged to form a resonant cavity. The cavity includes a first end and a second end. The plurality of FETs provide an electromagnetic field defining an standing wave oscillating at a resonant frequency defined by a characteristic of the cavity. A radiation input passing through the cavity induces a perturbation of the electromagnetic field.

An UV photodetector includes: a substrate, a template layer formed on the substrate, an intrinsic AlGaN layer formed on the template layer, a first n-type AlGaN layer and a second n-type AlGaN layer formed on the intrinsic AlGaN layer side-by-side and separated by a gap, wherein the gap exposes the intrinsic AlGaN layer. Another UV photodetector includes: an UV transparent substrate, an UV transparent template layer formed on the substrate, a first UV transparent n-type AlGaN layer formed on the UV transparent template layer, an intrinsic AlGaN layer formed on the first UV transparent n-type AlGaN layer, a second n-type AlGaN layer formed on the intrinsic AlGaN layer, and a p-type layer formed on the second n-type AlGaN layer.

An UV photodetector includes: a substrate, a template layer formed on the substrate, an intrinsic AlGaN layer formed on the template layer, a first n-type AlGaN layer and a second n-type AlGaN layer formed on the intrinsic AlGaN layer side-by-side and separated by a gap, wherein the gap exposes the intrinsic AlGaN layer. Another UV photodetector includes: an UV transparent substrate, an UV transparent template layer formed on the substrate, a first UV transparent n-type AlGaN layer formed on the UV transparent template layer, an intrinsic AlGaN layer formed on the first UV transparent n-type AlGaN layer, a second n-type AlGaN layer formed on the intrinsic AlGaN layer, and a p-type layer formed on the second n-type AlGaN layer.

An UV photodetector includes: a substrate, a template layer formed on the substrate, an intrinsic AlGaN layer formed on the template layer, a first n-type AlGaN layer and a second n-type AlGaN layer formed on the intrinsic AlGaN layer side-by-side and separated by a gap, wherein the gap exposes the intrinsic AlGaN layer. Another UV photodetector includes: an UV transparent substrate, an UV transparent template layer formed on the substrate, a first UV transparent n-type AlGaN layer formed on the UV transparent template layer, an intrinsic AlGaN layer formed on the first UV transparent n-type AlGaN layer, a second n-type AlGaN layer formed on the intrinsic AlGaN layer, and a p-type layer formed on the second n-type AlGaN layer.

Certain embodiments of the present invention may be directed to a transistor structure. The transistor structure may include a semiconductor substrate. The semiconductor substrate may include a drift region, a collector region, an emitter region, and a lightly-doped/undoped region. The lightly-doped/undoped region may be lightly-doped and/or undoped. The transistor structure may also include a heterostructure. The heterostructure forms a heterojunction with the lightly-doped/undoped region. The transistor structure may also include a collector terminal. The collector terminal is in contact with the collector region. The transistor structure may also include a gate terminal. The gate terminal is in contact with the heterostructure. The transistor structure may also include an emitter terminal. The emitter terminal is in contact with the lightly-doped/undoped region and the emitter region.