A method for fault isolation includes: acquiring a thermal imaging picture of a surface of a to-be-tested chip, the thermal imaging picture being obtained by scanning the to-be-tested chip to which a test signal is applied through an infrared thermal imaging device, and analyzing the thermal imaging picture to obtain a phase angle of each point on the surface of the to-be-tested chip; acquiring a three-dimensional image of the surface of the to-be-tested chip, the three-dimensional image being obtained by scanning the to-be-tested chip to which the test signal is applied through an image scanning device, and analyzing the three-dimensional image to obtain a three-dimensional coordinate of each point on the surface of the to-be-tested chip; calculating a three-dimensional coordinate of the fault in the to-be-tested chip according to the phase angle and the three-dimensional coordinate of each point on the surface of the to-be-tested chip.

A light emitting apparatus includes: a mount substrate; one or more light emitting devices located above the mount substrate; a light conversion member located above the one or more light emitting devices; and a covering member that contains a light reflective material and covers the one or more light emitting devices. The light conversion member includes: a light emission surface facing upward, a lateral surface facing laterally, and a light receiving surface facing downward. The covering member covers the lateral surface of the light conversion member, and is interposed between the mount substrate and the one or more light emitting devices.

A light emitting apparatus includes: a mount substrate; a light emitting device located above the mount substrate, the light emitting device having a lateral surface; a light conversion member located above the light emitting device, the light conversion member having a lateral surface located outward of the lateral surface of the light emitting device in a top plan view; and a covering member that contains a light reflective material and covers the lateral surface of the light conversion member.

The restriction of a lead-out position of a wire from a chip is relaxed. A package includes a first chip, a second chip, and an extended rewiring layer. A first wiring layer is formed on a front surface of the first chip. The second chip has a front surface on which a second wiring layer is formed, and is shorter in length at least in a lateral direction than the first chip. The extended rewiring layer is extended in the lateral direction from the second chip and is electrically connected to the first wiring layer and the second wiring layer. A size of the extended rewiring layer may be equal to a size of the front surface of the first chip. The extended rewiring layer may be directly bonded to the first wiring layer.