A method of forming a chip assembly may include forming a plurality of cavities in a carrier; The method may further include arranging a die attach liquid in each of the cavities; arranging a plurality of chips on the die attach liquid, each chip comprising a rear side metallization and a rear side interconnect material disposed over the rear side metallization, wherein the rear side interconnect material faces the carrier; evaporating the die attach liquid; and after the evaporating the die attach liquid, fixing the plurality of chips to the carrier.

A method of forming a chip assembly may include forming a plurality of cavities in a carrier; The method may further include arranging a die attach liquid in each of the cavities; arranging a plurality of chips on the die attach liquid, each chip comprising a rear side metallization and a rear side interconnect material disposed over the rear side metallization, wherein the rear side interconnect material faces the carrier; evaporating the die attach liquid; and after the evaporating the die attach liquid, fixing the plurality of chips to the carrier.

Methods and systems for inhibiting bonding materials from entering a vacuum system of a semiconductor processing tool are disclosed herein. A semiconductor processing tool configured in accordance with a particular embodiment includes a bondhead having a first port, a second port, a first channel fluidly coupled to the first port, and a second channel fluidly coupled to the second port. The first port and first channel together comprise a first opening extending through the bondhead, and the second port and second channel together comprise a second opening extending through the bondhead. The second opening at least partially surrounds the first opening. A first flow unit is coupled to the first port and is configured to withdraw air from the first opening. A second flow unit is coupled to the second port and is configured to provide fluid to or withdraw fluid from the second opening.

A method of forming a chip assembly may include forming a plurality of cavities in a carrier; The method may further include arranging a die attach liquid in each of the cavities; arranging a plurality of chips on the die attach liquid, each chip comprising a rear side metallization and a rear side interconnect material disposed over the rear side metallization, wherein the rear side interconnect material faces the carrier; evaporating the die attach liquid; and after the evaporating the die attach liquid, fixing the plurality of chips to the carrier.

A method of forming a chip assembly may include forming a plurality of cavities in a carrier; The method may further include arranging a die attach liquid in each of the cavities; arranging a plurality of chips on the die attach liquid, each chip comprising a rear side metallization and a rear side interconnect material disposed over the rear side metallization, wherein the rear side interconnect material faces the carrier; evaporating the die attach liquid; and after the evaporating the die attach liquid, fixing the plurality of chips to the carrier.

A substrate bonding apparatus includes a substrate susceptor to support a first substrate, a substrate holder over the substrate susceptor to hold a second substrate, the substrate holder including a plurality of independently moveable holding fingers, and a chamber housing to accommodate the substrate susceptor and the substrate holder.

A production of voids between substrates is prevented when the substrates are bonded together, and the substrates are bonded together at a high positional precision while suppressing a strain. A method for bonding a first substrate and a second substrate includes a step of performing hydrophilization treatment to cause water or an OH containing substance to adhere to bonding surface of the first substrate and the bonding surface of the second substrate, a step of disposing the first substrate and the second substrate with the respective bonding surfaces facing each other, and bowing the first substrate in such a way that a central portion of the bonding surface protrudes toward the second substrate side relative to an outer circumferential portion of the bonding surface, a step of abutting the bonding surface of the first substrate with the bonding surface of the second substrate at the respective central portions, and a step of abutting the bonding surface of the first substrate with the bonding surface of the second substrate across the entirety of the bonding surfaces, decreasing a distance between the outer circumferential portion of the first substrate and an outer circumferential portion of the second substrate with the respective central portions abutting each other at a pressure that maintains a non-bonded condition.

A chip mounting system (1) includes: a chip supplying unit (11) for supplying a chip (CP); a stage (31) for holding a substrate (WT) in an orientation in which a mounting face (WTf) for mounting the chip (CP) faces vertically downward (Z direction); a head (33H) for holding the chip (CP) from the vertically downward direction (Z direction); and a head drive unit (36) for, by causing vertically upward (+Z direction) movement of the head (33H) holding the chip (CP), causes the head (33H) to approach the stage (31) to mount the chip (CP) on the mounting face (WTf) of the substrate (WT).

A stacked wafer assembly is made by forming a grid of grooves corresponding to projected dicing lines in a face side of each of two wafers, thereby forming demarcated areas on the face side of each of the two wafers. One of the wafers is installed with demarcated areas face upwardly, and thereafter liquid is supplied to the demarcated areas in a quantity just enough to stay on upper surfaces of the demarcated areas without overflowing. The other wafer is placed over the one wafer with demarcated areas of the other wafer facing the respective demarcated areas of the one wafer, thereby bringing respective central positions of the facing demarcated areas of the wafers into self-alignment with each other under the surface tension of the liquid sandwiched between the facing demarcated areas. The liquid is removed to bring the wafers into intimate contact with each other.

A bonder includes a first chuck unit 1A, a second chuck unit 1B, a first base 21A, a second base 21B, and a first floating mechanism 3A. The first chuck unit 1A and the second chuck unit 1B are chuck units in a pair including respective suction surfaces for suction of bonding targets and are arranged while respective suction surfaces 11a and 11b face each other. The first base 21A and the second base 21B support the first chuck unit 1A and the second chuck unit 1B respectively. The first floating mechanism 3A applies gas pressure to a back surface 12a of the first chuck unit 1A to float the first chuck unit 1A from the first base 21A, thereby moving the suction surface 11a of the first chuck unit 1A toward the suction surface 11b of the second chuck unit 1B.