A mounting device and a mounting method is provided with which, after lowering a mounting head holding a chip component in a direction perpendicular to a substrate to bring the chip component into close contact with the substrate subsequent to positioning the chip component and the substrate, a control unit causes a recognition mechanism to start a parallel recognition operation of a chip recognition mark and a substrate recognition mark and recognize the chip recognition mark and the substrate recognition mark through the mounting head in a mounted state in which the chip component is in close contact with the substrate, and calculates mounting position accuracy of the chip component and the substrate.

This chip mounting system simultaneously images an alignment mark disposed on a substrate (WT) and an alignment mark disposed on a chip (CP), with the alignment marks disposed on the substrate (WT) and the chip (CP) being separated by a first distance at which the alignment marks fall within a depth-of-field range of imaging devices. The chip mounting system calculates a relative positional deviation amount between the substrate (WT) and the chip (CP) from the imaged images of the alignment marks imaged by the imaging devices and, based on the calculated positional deviation amount, relatively moves the chip (CP) with respect to the substrate (WT) in a direction in which the positional deviation amount therebetween decreases.