Various embodiments of the present technology may comprise a method and apparatus for improved bonding and may operate in conjunction with a main platform configured to support a substrate. Movable members may allow the substrate to be positioned on the main platform when rotated to a first position and apply a force to a predetermined area on an upward facing surface of the substrate when rotated to the second position.

A method of connecting a wire with a terminal including a plurality of conductors is provided. The method includes: positioning the terminal by holding a part of the terminal between an upper side jig and a lower side jig; and connecting the wire and one of a plurality of conductors, which is exposed on a surface of the positioned terminal. The terminal includes a laminate structure that includes an insulator interposed between a first conductor and a second conductor. The part of the terminal held in the positioning of the terminal includes a pressure receiving area, where a contact area between the upper side jig and an upper surface of the terminal and a contact area between the lower side jig and a lower surface of the terminal overlap. The laminate structure exists outside of the pressure receiving area, and does not exist in the pressure receiving area.