A wire bonder has a rotatable capillary for forming a stitch bond on a bonding surface of a connection point. When the stitch bond is formed, a bond head of the wire bonder causes the capillary to rotate in a XY plane. Rotation of the capillary causes at least a portion of the stitch bond to contact one or more side walls of the connection point. As a result, an entire surface area of the stitch bond contacts one or more surfaces of the connection point.

This wire bonding apparatus has a capillary, a movement mechanism moving the capillary, and a control unit controlling driving of the movement mechanism. The control unit at least causes execution of: a first process (trajectory a) of lowering the capillary, after a FAB is formed, to pressure bonding height at a first bonding point to form a pressure bonded ball and a column part at the first bonding point; a second process (trajectory b) of moving the capillary horizontally at the pressure bonding height after execution of the first process to scarp off the column part by the capillary; and a third process (trajectory c-k) of repeating a pressing operation at least once after execution of the second process, the pressing operation involving moving the capillary forward and lowering the capillary temporarily during movement so that the capillary presses down on a wire portion positioned over the pressure bonded ball.