A method for transferring an electronic device includes steps as follows. A flexible carrier having a first surface on which the electronic device to be transferred is disposed and a second surface, a target substrate, a target substrate, and a light-transmissible pin having a pressing end are provided. The flexible carrier is spaced from the target substrate with the first surface thereof facing the target substrate. The flexible carrier is deformed by exerting the pin to press the second surface with the pressing end thereof at a position corresponding to the electronic device until the electronic device is in contact with the target substrate. An energy beam emitted from a light source standing outside the pin and then traveling through the pin and going out from the pressing end to bond the electronic device onto the target substrate is applied. The pin is released from pressing the flexible carrier.

Apparatus and associated components and methods for bonding electronics structures. First and second electronics structures are directly bonded using a plurality of light pulses from a flashlamp. In some examples, light from the flashlamp passes into and is absorbed by at least one of the first or second electronics structures to heat a bonding interface between the first and second electronics structures to cause the direct bond to form.