A method and apparatus for flip chip bonding using conductive and inductive heating to heat a plurality of solder bumps located between a chip carrier and a chip.

A device includes a porous substrate that include a plurality of pores and a plurality of nanodevices dispersed in at least a portion of the plurality of pores. Each of the plurality of nanodevices includes a magnetic nanowire and a solder nanoparticle. The magnetic nanowires are configured to generate heat in response to an alternating magnetic field. The solder nanoparticles are configured to receive a portion of the heat and reflow to connect to one or more devices or surfaces.

A bonding apparatus includes a plurality of units each having a first holder configured to support a substrate and a second holder above the first holder that is configured to mount a semiconductor chip on the substrate. The plurality of units are arranged in adjacent spaced apart relationship along a first direction. An induction heating system includes an induction coil and an alternating current supplying unit configured to apply an alternating current to the induction coil so as to heat a junction between a substrate and a semiconductor chip at each of the plurality of units by inducing a magnetic field around the induction coil. A transferring unit is configured to position the induction coil adjacent to each of the plurality of units, and the induction heating system is configured to sequentially heat the junction between a substrate and semiconductor chip at each of the plurality of units.