A conductive pathway mounted on an electrically insulating sheet having an upper face and an opposed lower face, said sheet having a plurality of pairs of apertures; a plurality of electrically conductive clips, each clip being separated spatially from an adjacent said clip; each electrically conductive clip comprising a first body portion and first and second depending legs defining a sheet-receiving recess therebetween, said first body portion being disposed in contacting relation with said upper face of said sheet and said legs being disposed in contacting relation with said lower face of said sheet; each leg of one of said electrically conductive clips extending through one of said apertures of a pair of said apertures from said upper face to said lower face; and a plurality of electrical components each mounted in conductive relationship to two adjacent said conductive clips and bridging said insulating sheet.

A conductive pathway mounted on an electrically insulating sheet having an upper face and an opposed lower face, said sheet having a plurality of pairs of apertures; a plurality of electrically conductive clips, each clip being separated spatially from an adjacent said clip; each electrically conductive clip comprising a first body portion and first and second depending legs defining a sheet-receiving recess therebetween, said first body portion being disposed in contacting relation with said upper face of said sheet and said legs being disposed in contacting relation with said lower face of said sheet; each leg of one of said electrically conductive clips extending through one of said apertures of a pair of said apertures from said upper face to said lower face; and a plurality of electrical components each mounted in conductive relationship to two adjacent said conductive clips and bridging said insulating sheet.

A conductive pathway mounted on an electrically insulating sheet having an upper face and an opposed lower face, said sheet having a plurality of pairs of apertures; a plurality of electrically conductive clips, each clip being separated spatially from an adjacent said clip; each electrically conductive clip comprising a first body portion and first and second depending legs defining a sheet-receiving recess therebetween, said first body portion being disposed in contacting relation with said upper face of said sheet and said legs being disposed in contacting relation with said lower face of said sheet; each leg of one of said electrically conductive clips extending through one of said apertures of a pair of said apertures from said upper face to said lower face; and a plurality of electrical components each mounted in conductive relationship to two adjacent said conductive clips and bridging said insulating sheet.

A conductive pathway mounted on an electrically insulating sheet having an upper face and an opposed lower face, said sheet having a plurality of pairs of apertures; a plurality of electrically conductive clips, each clip being separated spatially from an adjacent said clip; each electrically conductive clip comprising a first body portion and first and second depending legs defining a sheet-receiving recess therebetween, said first body portion being disposed in contacting relation with said upper face of said sheet and said legs being disposed in contacting relation with said lower face of said sheet; each leg of one of said electrically conductive clips extending through one of said apertures of a pair of said apertures from said upper face to said lower face; and a plurality of electrical components each mounted in conductive relationship to two adjacent said conductive clips and bridging said insulating sheet.

Provided is a semiconductor device including a conductive member including a main surface facing one side in a thickness direction; a semiconductor element including a plurality of pads facing the main surface of the conductive member; and a plurality of electrodes protruding from the plurality of pads toward the other side in the thickness direction. The conductive member includes a plurality of recessed portions recessed from the main surface toward the other side in the thickness direction. The semiconductor device further includes a bonding layer that is conductive and that is arranged in each of the plurality of recessed portions. The plurality of electrodes are separately inserted into the plurality of recessed portions. The conductive member and the plurality of electrodes are bonded through the bonding layers.

In one embodiment, a semiconductor package includes a semiconductor die having conductive pads. A lead frame is directly connected to the conductive pads using an electrochemically formed layer or a conductive adhesive layer thereby facilitating an electrical connection between the conductive pads of the semiconductor die and the lead frame without using separate wire bonds or conductive bumps.

In one embodiment, a semiconductor package includes a semiconductor die having conductive pads. A lead frame is directly connected to the conductive pads using an electrochemically formed layer or a conductive adhesive layer thereby facilitating an electrical connection between the conductive pads of the semiconductor die and the lead frame without using separate wire bonds or conductive bumps.

Semiconductor devices with controllers under stacks of semiconductor packages and associated systems and methods are disclosed herein. In one embodiment, a semiconductor device includes a package substrate, a controller attached to the package substrate, and at least two semiconductor packages disposed over the controller. Each semiconductor package includes a plurality of semiconductor dies. The semiconductor device further includes an encapsulant material encapsulating the controller and the at least two semiconductor packages.

Semiconductor devices with controllers under stacks of semiconductor packages and associated systems and methods are disclosed herein. In one embodiment, a semiconductor device includes a package substrate, a controller attached to the package substrate, and at least two semiconductor packages disposed over the controller. Each semiconductor package includes a plurality of semiconductor dies. The semiconductor device further includes an encapsulant material encapsulating the controller and the at least two semiconductor packages.

A method of making an electronic device includes forming an electrically conductive pattern on a substrate, forming a cover layer on the substrate and the electrically conductive pattern, and forming openings in the cover layer and being aligned with the electrically conductive pattern. The method also includes positioning an IC on the cover layer so that bond pads of the IC are aligned with the openings, and heating under pressure the cover layer to both mechanically secure and electrically interconnect the IC.