A method of making an assembly can include forming a circuit structure defining front and rear surfaces, and forming a substrate onto the rear surface. The forming of the circuit structure can include forming a first dielectric layer coupled to the carrier. The first dielectric layer can include front contacts configured for joining with contacts of one or more microelectronic elements, and first traces. The forming of the circuit structure can include forming rear conductive elements at the rear surface coupled with the front contacts through the first traces. The forming of the substrate can include forming a dielectric element directly on the rear surface. The dielectric element can have first conductive elements facing the rear conductive elements and joined thereto. The dielectric element can include second traces coupled with the first conductive elements. The forming of the substrate can include forming terminals at a surface of the substrate.

Provided is a method of manufacturing a semiconductor device, for suppressing channeling that may occur during ion implantation to a polycrystalline silicon layer (4), the method including: exposing, in an opening portion formed in a second photoresist layer (8), a first photoresist layer (5) that has been used for patterning the polycrystalline silicon layer (4); and implanting impurities by ion implantation with the first photoresist layer (5) being a mask for a gate electrode (4-1) formed of the polycrystalline silicon layer (4).