A method of bonding semiconductor devices utilizing self-alignment. A pair of device features metallic bumps that protrude through their respective dielectric layers, exposing the end surfaces of the bumps. Solder is applied to these exposed surfaces, and the devices are aligned so that the solder on the first device comes into contact with the solder on the second device. During reflow, surface tension forces of the molten solder self-aligns the devices. After reflow, exposed surfaces of the dielectric layers of the two devices are bonded together.