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Patent classifications
H
ELECTRICITY
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H01
ELECTRIC ELEMENTS
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H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/80
Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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H01L2224/81
using a bump connector
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H01L2224/819
with the bump connector not providing any mechanical bonding
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H01L2224/81901
Pressing the bump connector against the bonding areas by means of another connector
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H01L2224/81904
by means of an encapsulation layer or foil
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