A connecting strip of conductive elastic material having an arched shape having a concave side and a convex side. The connecting strip is fixed at the ends to a support carrying a die with the convex side facing the support. During bonding, the connecting strip undergoes elastic deformation and presses against the die, thus electrically connecting the at least one die to the support.

An integrated circuit semiconductor die is arranged on a substrate having electrically conductive leads. Electrical coupling of the semiconductor die is provided via electrically conductive ribbons having a first end portion electrically coupled to the semiconductor die and a second end portion electrically coupled to the lead. The first end portion of the electrically conductive ribbon is ultrasonically coupled (bonded) to the semiconductor die. The second end portion of the electrically conductive ribbon is coupled to the lead via electrically conductive material, such as film or tape or glue/solder paste added at the second end portion of the electrically conductive ribbon.

A connecting strip of conductive elastic material having an arched shape having a concave side and a convex side. The connecting strip is fixed at the ends to a support carrying a die with the convex side facing the support. During bonding, the connecting strip undergoes elastic deformation and presses against the die, thus electrically connecting the at least one die to the support.