The present invention provides a bonding wire which can satisfy bonding reliability, spring performance, and chip damage performance required in high-density packaging. A bonding wire contains one or more of In, Ga, and Cd for a total of 0.05 to 5 at %, and a balance being made up of Ag and incidental impurities.

The present invention provides a bonding wire which can satisfy bonding reliability, spring performance, and chip damage performance required in high-density packaging. A bonding wire contains one or more of In, Ga, and Cd for a total of 0.05 to 5 at %, and a balance being made up of Ag and incidental impurities.

A method and system suitable for supporting various wireless services on a Distributed Antenna System (DAS). The DAS can provide wireless services including voice and data services using the same equipment. The DAS can include one or more active antenna units controlled by an access point, and includes control channels for transferring control and status information between the access point and the antenna. The control channels can be transferred over a separate cable, or transferred using one or more intermediate frequency signals transferred over existing cables. The control channels can be used to configure and control and receive status from the managed components of the DAS including active antennas, control the amplifiers used to process TDD signals, and control the switching of diversity antenna systems.

A method and system suitable for supporting various wireless services on a Distributed Antenna System (DAS). The DAS can provide wireless services including voice and data services using the same equipment. The DAS can include one or more active antenna units controlled by an access point, and includes control channels for transferring control and status information between the access point and the antenna. The control channels can be transferred over a separate cable, or transferred using one or more intermediate frequency signals transferred over existing cables. The control channels can be used to configure and control and receive status from the managed components of the DAS including active antennas, control the amplifiers used to process TDD signals, and control the switching of diversity antenna systems.

A semiconductor package includes a metallic pad and leads spaced from the metallic pad by a gap, the metallic pad including a roughened surface. The semiconductor package further includes a semiconductor die including bond pads, and an adhesive between the roughened surface of the metallic pad and the semiconductor die, therein bonding the semiconductor die to the metallic pad, wherein the adhesive includes a resin. The metallic pad further includes a groove surrounding the semiconductor die on the roughened surface, the groove having a surface roughness less than a surface roughness of the roughened surface of the metallic pad.