A bonding wire for connecting a first pad to a second pad is provided. The bonding wire includes a ball part bonded to the first pad, a neck part formed on the ball part, and a wire part extending from the neck part to the second pad. Less than an entire portion of a top surface of the neck part is covered by the wire part, and the wire part is in contact with the neck part, the ball part, and the first pad.

An embodiment method includes encapsulating a semiconductor die in an encapsulant, planarizing the encapsulant, and depositing a polymer material on the encapsulant. The method further includes planarizing the polymer material and forming a metallization pattern on the polymer material. The metallization pattern electrically connects a die connector of the semiconductor die to a conductive feature disposed outside of the semiconductor die.

An embodiment method includes encapsulating a semiconductor die in an encapsulant, planarizing the encapsulant, and depositing a polymer material on the encapsulant. The method further includes planarizing the polymer material and forming a metallization pattern on the polymer material. The metallization pattern electrically connects a die connector of the semiconductor die to a conductive feature disposed outside of the semiconductor die.

A circuit element is formed on a substrate made of a compound semiconductor. A bonding pad is disposed on the circuit element so as to at least partially overlap the circuit element. The bonding pad includes a first metal film and a second metal film formed on the first metal film. A metal material of the second metal film has a higher Young's modulus than a metal material of the first metal film.

A capillary for performing ball bonding includes a body defining a lumen, a first blade defined in a lower tip of the body, and a second blade defined in the lower tip of the body for increasing reliability of a ball bonding procedure performed using the capillary.

A capillary for performing ball bonding includes a body defining a lumen, a first blade defined in a lower tip of the body, and a second blade defined in the lower tip of the body for increasing reliability of a ball bonding procedure performed using the capillary.

In an apparatus, effective pixels of CA-number composed of pixel rows of A-number and pixel columns of C-number or composed of the pixel rows of the C-number and the pixel columns of the A-number are arrayed in an effective pixel area of a chip, and images of a number not more than B-number are output from the chip for one second, wherein A, B and C are positive integers. The adhesive includes first, second, third, and fourth portions placed between a base body and the chip. The first and second portions are positioned between the third and fourth portions in the array direction of the pixel rows or columns. A gap is provided between the first and second portions, between the second and third portions, and between the first and fourth portions. The first and second portions are positioned between the effective pixel area and the base body.

In an apparatus, effective pixels of CA-number composed of pixel rows of A-number and pixel columns of C-number or composed of the pixel rows of the C-number and the pixel columns of the A-number are arrayed in an effective pixel area of a chip, and images of a number not more than B-number are output from the chip for one second, wherein A, B and C are positive integers. The adhesive includes first, second, third, and fourth portions placed between a base body and the chip. The first and second portions are positioned between the third and fourth portions in the array direction of the pixel rows or columns. A gap is provided between the first and second portions, between the second and third portions, and between the first and fourth portions. The first and second portions are positioned between the effective pixel area and the base body.

A floating die package including a cavity formed through sublimation of a sacrificial die encapsulant and sublimation or separation of die attach materials after molding assembly. A pinhole vent in the molding structure is provided as a sublimation path to allow gases to escape, whereby the die or die stack is released from the substrate and suspended in the cavity by the bond wires only.

Electronic packages and related methods are disclosed. An example electronic package apparatus includes a substrate and an electronic component. A protective material is positioned on a first surface, a second surface and all side surfaces of the electronic component to encase the electronic component. An enclosure is coupled to the substrate to cover the protective material and the electronic component.