A die package having a plurality of connection pads, a die substrate supporting a plurality of connection elements, a first lead having a first metal core with a first core diameter, and a dielectric layer surrounding the first metal core, the dielectric layer having a first dielectric thickness that varies along its length and/or the dielectric layer having an outer metal layer at least partially surrounding the dielectric layer, for selectively modifying the electrical characteristics of the lead.

Apparatus and method for tool mark free stich bonding. In some embodiments, a method for wire bonding can include feeding a wire through a capillary tip and attaching a first end of the wire to a first location, thereby forming a ball bond. The method can further include moving the capillary tip towards a second location while the wire feeds out of the capillary tip. The method can further include attaching a second end of the wire to the second location while preventing contact between the capillary tip and the second location, thereby forming a stitch bond without a tool mark at the second location.

A capillary for performing ball bonding includes a body defining a lumen, a first blade defined in a lower tip of the body, and a second blade defined in the lower tip of the body for increasing reliability of a ball bonding procedure performed using the capillary.

According to one embodiment, a semiconductor device includes: a substrate; a first electrode provided on the substrate; a second electrode provided on the substrate distant from the first electrode; and a sheet-like conductive sheet configured to connect the first electrode and the second electrode, in which the conductive sheet includes a first fixing portion connected to the first electrode, a second fixing portion connected to the second electrode, and a wiring portion positioned between the first fixing portion and the second fixing portion, having a length in a first direction from the substrate toward the first electrode that is longer than a length of the first fixing portion in the first direction, and having a convex shape with its central part is curving away from the second fixing portion at a first end that is connected to the first fixing portion.