A display device includes a first electrode and a second electrode disposed on a substrate, the first and second electrodes extending in a first direction in parallel to each other, a first insulating layer disposed on the first and second electrodes, light-emitting elements disposed on the first insulating layer, the light-emitting elements including first end portions disposed on the first electrode and second end portions disposed on the second electrode, an oxide semiconductor layer disposed on the first insulating layer and the light-emitting elements, the oxide semiconductor layer including a first conductive portion electrically contacting the first end portions of the light-emitting elements, a second conductive portion electrically contacting the second end portions of the light-emitting elements, and a semiconductive portions disposed between the first and second conductive portions, and a second insulating layer disposed on the oxide semiconductor layer.

Disclosed are methods and systems of controlling the placement of micro-objects on the surface of a micro-assembler. Control patterns may be used to cause electrodes of the micro-assembler to generate dielectrophoretic (DEP) and electrophoretic (EP) forces which may be used to manipulate, move, position, or orient one or more micro-objects on the surface of the micro-assembler. The control patterns may be part of a library of control patterns.

Discussed is a display device, including a substrate having an assembly region and a non-assembly region, semiconductor light emitting devices arranged on the substrate, a first wiring electrode and a second wiring electrode extended from each of the semiconductor light emitting devices, respectively, to supply an electric signal to the semiconductor light emitting devices, pair electrodes arranged on the substrate to generate an electric field when an electric current is supplied, and provided with first and second pair electrodes disposed on an opposite side to the first and second wiring electrodes with respect to the semiconductor light emitting devices, a dielectric layer disposed on the pair electrodes, and bus electrodes electrically connected to the pair electrodes, wherein the pair electrodes are arranged in parallel to each other along a direction in the assembly region, and wherein the bus electrodes are disposed in the non-assembly region.

A display device includes a first electrode disposed on a substrate, a second electrode disposed on the substrate, and spaced apart from and facing the first electrode, at least one light emitting element disposed between the first electrode and the second electrode, a first conductive contact pattern disposed on the first electrode and electrically contacting the first electrode and an end of the at least one light emitting element, and a second conductive contact pattern disposed on the second electrode and electrically contacting the second electrode and another end of the at least one light emitting element.

A light emitting device may include a substrate. A light emitting element layer may be disposed on the substrate and may include light emitting elements having a rod shape. A color conversion layer may be disposed on the light emitting element layer and may include color conversion elements having a rod shape. A first alignment direction of the light emitting elements and a second alignment direction of the color conversion elements may be substantially parallel to each other or intersect at a predetermined angle.

A display device and a manufacturing method thereof are provided. The display device comprises: a substrate in which a first region and a second region that is a region other than the first area, are defined; a first electrode and a second electrode that are at least partially spaced apart from each other in the first area on the substrate; a coating layer disposed on the substrate so as to cover at least a portion of the first electrode and the second electrode; and at least one light-emitting element disposed between the first electrode and the second electrode in the first region, wherein the coating layer comprises: an opening exposing at least portion of the first electrode and the second electrode in the first region, wherein the coating layer comprises: an opening exposing at least portion of the first electrode and the second electrode; and a first coating layer disposed in a region other than the opening and including a material having a first polarity.

The present disclosure provides a display device, including a substrate, a plurality of semiconductor light emitting devices arranged on the substrate, a first wiring electrode and a second wiring electrode extended from the semiconductor light emitting devices, respectively, to supply an electric signal to the semiconductor light emitting devices, a plurality of pair electrodes arranged on the substrate to generate an electric field when an electric current is supplied, and provided with first and second pair electrodes formed on an opposite side to the first and second wiring electrodes with respect to the semiconductor light emitting devices, and a dielectric layer formed to cover the pair electrodes, wherein the plurality of pair electrodes are arranged in parallel to each other along a direction.

A display device includes a first substrate; a first conductive pattern, a first voltage line and a second voltage line on the first substrate; an insulating layer on the first conductive pattern and the second voltage line; a plurality of first light-emitting elements on the insulating layer; a first electrode on the insulating layer and connected to the first conductive pattern, the first electrode overlapping the first voltage line; and a second electrode on the insulating layer and connected to the second voltage line, wherein the plurality of first light-emitting elements are in contact with the first electrode and the second electrode, and wherein a part of an upper surface of the first electrode that overlaps the first conductive pattern and a part of the upper surface of the first electrode that overlaps the first voltage line are located on the same plane.

The present application discloses a method for transferring a plurality of micro light emitting diodes (micro LEDs) to a target substrate. The method includes providing a first substrate having an array of the plurality of micro LEDs; providing a target substrate having a bonding layer having a plurality of bonding contacts; applying the plurality of bonding contacts with an electrical potential; aligning the plurality of micro LEDs with the plurality of bonding contacts having the electrical potential; and transferring the plurality of micro LEDs in the first substrate onto the target substrate.

An apparatus for manufacturing a light emitting display device includes a substrate transfer stage including a plurality of support plates arranged at an interval in a first direction, each of the plurality of support plates extending in a second direction; and at least one electric-field application module disposed on at least one side of the substrate transfer stage. The at least one electric-field application module includes a probe head including at least one probe pin; and a driver connected to the probe head to move the probe head at least up and down.