Disclosed is an electromagnetic wave shielding structure. The electromagnetic wave shielding structure comprises: a printed circuit board having a plurality of elements mounted therein and having a ground pad surrounding the plurality of elements; an insulation member made of a pre-molded insulating material and attached to the printed circuit board to surround the plurality of elements; and a conductive coating layer covering an exterior surface of the insulation member, wherein the conductive coating layer is connected to the ground pad.

A thermal conductive device includes a first conductive plate, a second conductive plate, a plurality of wicks and a fluid. The first conductive plate has a first portion adjacent to edges of the first conductive plate and a second portion far away from the edges. The second conductive plate has a first portion adjacent to edges of the first conductive plate and a second portion far away from the edges. The first portion and the second portion of the first conductive plate are respectively connected to the first portion and the second portion of the second conductive plate to define a chamber. The plurality of wicks are disposed within the chamber. The fluid is disposed within the chamber.

An optical device package comprises a carrier having a first surface and a second surface recessed with respect to the first surface and a lid disposed on the second surface of the carrier.

An integrated circuit (IC) module includes a carrier and multiple IC devices. A heterogenous seal band connects a lid to the carrier. A perimeter wall of the lid is joined to a low modulus seal band and an inner wall of the lid is joined to a high modulus seal band. The low modulus seal band is located around the perimeter of the lid and a perimeter of the multiple IC devices. The high modulus seal band is located between the multiple IC devices. The low modulus seal band has a low resistance to being deformed elastically and the high modulus seal band has a high resistance to being deformed elastically. The low modulus seal band allows for dimensional fluctuations between the lid and carrier. The high modulus seal band allows for adequate joining of the lid and the carrier with relatively less seal band material.

The present invention discloses a wearable device with combined sensing capabilities, which includes a wearable assembly and at least one multi-function sensor module. The wearable assembly is suitable to be worn on apart of a user's body. The wearable assembly includes at least one light-transmissible window. The multi-function sensor module is located inside the wearable assembly, for performing an image sensing function and an infrared temperature sensing function. The multi-function sensor module includes an image sensor module for sensing a physical or a biological feature of an object through the light-transmissible window by way of image sensing; and an infrared temperature sensor module for sensing temperature through the light-transmissible window by way of infrared temperature sensing.

A semiconductor structure includes a first die, a molding at least partially surrounding the first die, a via extended through the molding, a second die disposed over the molding, a connector dispose between the second die and the via, and an underfill at least partially surrounding the connector. The first die includes a first surface and a second surface opposite to the first surface. The second die includes a third surface facing the first die, a fourth surface opposite to the third surface, and a sidewall between the third surface and the fourth surface. The connector is in contact with the third surface of the second die and the via. The second die is electrically connected to the via. The underfill covers a portion of the sidewall of the second die and a portion of the second surface of the first die.

Embodiments disclosed herein include electronic packages with thermal solutions. In an embodiment, an electronic package comprises a package substrate, a first die electrically coupled to the package substrate, and an integrated heat spreader (IHS) that is thermally coupled to a surface of the first die. In an embodiment, the IHS comprises a main body having an outer perimeter, and one or more legs attached to the outer perimeter of the main body, wherein the one or more legs are supported by the package substrate. In an embodiment, the electronic package further comprises a thermal block between the package substrate and the main body of the IHS, wherein the thermal block is within the outer perimeter of the main body.

An electronic module includes: a plurality of heat generating members provided over a first surface of a board; a frame joined to the first surface of the board and provided between the plurality of heat generating members that are arranged; and a lid configured to cover the first surface of the board and thermally coupled to each of the plurality of heat generating members, the frame being a grid-shaped frame or a mesh-shaped frame.

The present disclosure relates to a semiconductor device package, which includes a carrier, a lid, a first adhesive layer and a constraint structure. The carrier includes a surface and a first conductive pad on the surface of the carrier. The lid includes a first portion and a second portion separated from the first portion on the surface of the carrier. The first conductive pad is disposed between the first portion of the lid and the surface of the carrier. The first adhesive layer includes a first portion between the first portion of the lid and the first conductive pad. The constraint structure surrounds the first adhesive layer.

Disclosed herein are integrated circuit (IC) packages with solder thermal interface materials (STIM), as well as related methods and devices. For example, in some embodiments, an IC package may include a package substrate, a lid, a die between the package substrate and the lid, and a STIM between the die and the lid. The STIM may have a thickness that is less than 200 microns.