A cable system component includes a nut having a seal-grasping surface portion and a seal having an elastically deformable tubular body attached to the nut. The body has a posterior sealing surface that cooperatively engages the seal-grasping surface portion of the nut and a forward sealing surface configured to cooperatively engage an interface port. The seal includes a nonconductive elastomer overlying a conductive elastomer in a radial dimension of the seal. The conductive elastomer is configured to make an electrical ground connection with the interface port before a center conductor of the coaxial cable makes an electrical connection with an internal contact of the interface port when the nut is coupled with the interface port.

A connector includes a contact connected to a flexible conductor, a housing that is attached to a flexible substrate and retains the contact, and a protection sheet that is constituted of an insulating film having a pressure-sensitive adhesive layer formed on one surface thereof and is disposed between the housing and the flexible substrate such that the pressure-sensitive adhesive layer faces the flexible substrate, the protection sheet being disposed so as to cover at least a front surface part of the flexible substrate on which the flexible conductor is formed, and is adhered to the flexible substrate with the pressure-sensitive adhesive layer, the housing having a flat surface facing the flexible substrate, an adhesive layer bonding the housing to the protection sheet being disposed between the flat surface and the protection sheet.

Systems and methods of securing an integrated circuit assembly includes: arranging a plurality of securing elements within a plurality of orifices fabricated within one or more layer components of a plurality of layer components of an integrated circuit assembly; applying a mechanical compression load against the integrated circuit assembly that uniformly compresses together the plurality of layer components of the integrated circuit assembly; after applying the mechanical compression load to the integrated circuit assembly, fastening the plurality of securing elements while the integrated circuit assembly is in a compressed state based on the mechanical compression load; and terminating the application of the mechanical compression load against the integrated circuit assembly based on the fastening of the plurality of securing elements.

An electrical ground connector for use as part of a test connector in an integrated circuit (IC) device testing apparatus having a resilient connector for electrical grounding and comprising a dual elastomer contact stacked vertically above a rigid ground block. The height of the ground block can be adjusted to compensate for the lack of height of the dual elastomer contacts, so that the entire connector has enough height to maintain electrical connection between a load board of the testing apparatus and the IC device.

Provided is a data signal transmission connector configured to electrically connect a first electronic component and a second electronic component includes a first base frame and a second base frame having a structure which are mirror-symmetrical, the first base frame and the second base frame being disposed to face each other and to be spaced apart from each other.

An electric assembly includes a carrier device having an electrical conductor element and a contact body including an elastically flexible and electrically conductive material. The contact body is connected to the electrical conductor element.

An anisotropic conductive film which suppresses occurrence of short circuit at the time of anisotropic conductive connection, prevents reduction in capturing capability of electrically conductive particles, enables favorable pushing of electrically conductive particles and exhibits not only favorable initial conductivity but also favorable conduction reliability, contains a first electrically conductive particle group and a second electrically conductive particle group, each including a plurality of electrically conductive particles, in an insulating binder. The first electrically conductive particle group and the second electrically conductive particle group are present in a first region and a second region, respectively, which differ from each other in the thickness direction of the anisotropic conductive film and are parallel to the plane direction. Moreover, the first electrically conductive particle group and the second electrically conductive particle group differ from each other in an existence state of the electrically conductive particles.

A terminal structure of a high-frequency signal connector and a manufacturing method thereof, in which multiple first terminals and multiple second terminals, multiple excavation areas and multiple trimming lines are trimmed from a tape, the first terminals and the second terminals are arranged alternately, each of the trimming lines is located between one of the first terminals and one of the second terminals that are disposed next to each other, followed by stamping the first terminals and the second terminals to form a first terminal set and a second terminal set. The first terminals and the second terminals are formed simultaneously on a single tape, and in turn, the period for fabricating dies and developing dies may be reduced, and less metal tapes is wasted after blanking of the first terminals and the second terminals, in order to decrease processes and reduce a manufacturing cost of the connector effectively.

A anisotropic conductive film includes: an electrically insulating adhesive layer; electrically conductive particles disposed in lattice form in the electrically insulating adhesive layer; a reference electrically conductive particle defined, an electrically conductive particle closest to the reference electrically conductive particle defined as a first electrically conductive particle, an electrically conductive particle equally close or next closest to the reference electrically conductive particle regarding the first electrically conductive particle defined as a second electrically conductive particle. The second electrically conductive particle absent from lattice form axis including the reference electrically conductive particle and first electrically conductive particle. A projection image in the anisotropic conductive film longitudinal direction of the reference electrically conductive particle and first electrically conductive particle or second electrically conductive particle overlap and the anisotropic conductive film projection image in a short-side direction the reference electrically conductive particle and second electrically conductive particle or first electrically conductive particle overlap.

An anisotropic electrically conductive film that is suitable for use in fine-pitch FOG connections and COG connections and that also can reduce increases in production costs associated with increasing the electrically conductive particle density. The anisotropic electrically conductive film includes an electrically insulating adhesive layer and electrically conductive particles disposed within the electrically insulating adhesive layer. The anisotropic electrically conductive film has electrically conductive particle disposition regions that are disposed in a manner corresponding to the arrangement of terminals of electronic components to be connected. The electrically conductive particle disposition regions are formed periodically in the longitudinal direction of the anisotropic electrically conductive film. The anisotropic electrically conductive film also has buffer regions in which no electrically conductive particles are disposed that are formed between adjacent electrically conductive particle disposition regions for connection.