A high density coupling panel of the present disclosure presents a compact grouping of coupler wherein each of the couplers couples a first free connector with a second free connector wherein each of the free connectors is coupled to exactly two electrical conductors. The high density coupling panel can be manufactured in a shielded (e.g., metal) or non-shielded (e.g. non-metal) form as appropriate to a specific application. In the shielded configuration, a bonding strip is used to connect all metal components (e.g., shielded free connectors, shielded couplers, and metal panel of the high density coupling panel) to ground via a shielding tab.

A high density coupling panel of the present disclosure presents a compact grouping of coupler wherein each of the couplers couples a first free connector with a second free connector wherein each of the free connectors is coupled to exactly two electrical conductors. The high density coupling panel can be manufactured in a shielded (e.g., metal) or non-shielded (e.g. non-metal) form as appropriate to a specific application. In the shielded configuration, a bonding strip is used to connect all metal components (e.g., shielded free connectors, shielded couplers, and metal panel of the high density coupling panel) to ground via a shielding tab.

A connector assembly includes an insulative housing, first and second conductive ground wafers (see e.g., 661 and 663) and a plurality of grounding links. The insulative housing has a plurality of conductive signal terminals disposed therein (see e.g., 662). The insulative housing has opposite side surfaces and a plurality of openings therein extending between the side surfaces. The second ground wafer is spaced from and parallel to the first ground wafer. The grounding links are electrically connected to one of the ground wafers and extend towards another of the ground wafers and extend through the openings in the housing.

A connector assembly includes an insulative housing, first and second conductive ground wafers (see e.g., 661 and 663) and a plurality of grounding links. The insulative housing has a plurality of conductive signal terminals disposed therein (see e.g., 662). The insulative housing has opposite side surfaces and a plurality of openings therein extending between the side surfaces. The second ground wafer is spaced from and parallel to the first ground wafer. The grounding links are electrically connected to one of the ground wafers and extend towards another of the ground wafers and extend through the openings in the housing.

A component for an electrical connector, comprising a housing and a plurality of electrical contact elements, the ends of which are accessible at one end of the housing for connection to a mating connector component. The electrical contact elements are arranged in at least two segments which are separated from and shielded against each other. The outer contour of each of the at least two segments has at least two legs and a base side extending from one end of one leg to one end of the other leg, at least one leg of each segment forming an interior angle of 30° to 80° or 100° to 150° with the base side. The segments are arranged in a row with a shielding being provided between the legs of neighbouring segments.

A board connector including plural terminal units each including an inner terminal, an outer terminal covering the inner terminal, and a terminal unit-side dielectric body provided between the inner terminal and the outer terminal and supporting the inner terminal. The plural terminal units are arranged in a row along one direction in a state in which adjacent of the plural terminal units contact each other.

A connector assembly includes an adapter connector and two end-connectors. Each connector includes a high-speed differential area and a low-speed area. The high-speed differential area of each end-connector includes an end differential unit. The high-speed differential area of the adapter connector includes an adapter differential module. Each end differential unit and a corresponding adapter differential unit include a signal contact and a ground shielding member. The plug-in parts of the two end-connectors, which are adapted with the adapter connector, are the same in structure, and of the end differential unit and the adapter differential unit, one is a male unit and the other is a female unit in corresponding plug-in fit. Due to the fact that the plug-in parts of the two end-connectors are the same in structure, when the end-connectors are plugged into the adapter connector, identification can be saved, and blind plugging operation can be directly performed.

A wafer includes a number of conductive terminals and an insulating frame. The conductive terminals include differential signal terminals, a first ground terminal and a second ground terminal. Each conductive terminal includes a connection portion and a contact portion. The connection portions of the differential signal terminals, the first ground terminal and the second ground terminal are located in a first plane. The first ground terminal includes a first torsion portion and the second ground terminal includes a second torsion portion. The contact portion of the first ground terminal and the contact portion of the second ground terminal are both perpendicular to the first plane. This present disclosure can provide better shielding effect, reduce crosstalk and improve the quality of signal transmission. In addition, the present disclosure also relates to a backplane connector having the wafer.

A wafer includes a number of conductive terminals and an insulating frame. The conductive terminals include differential signal terminals, a first ground terminal and a second ground terminal. Each conductive terminal includes a connection portion and a contact portion. The connection portions of the differential signal terminals, the first ground terminal and the second ground terminal are located in a first plane. The first ground terminal includes a first torsion portion and the second ground terminal includes a second torsion portion. The contact portion of the first ground terminal and the contact portion of the second ground terminal are both perpendicular to the first plane. This present disclosure can provide better shielding effect, reduce crosstalk and improve the quality of signal transmission. In addition, the present disclosure also relates to a backplane connector having the wafer.

In a connector assembly in which a connector that includes a first terminal, a second terminal, a ground terminal including a shielding portion (plate portion) positioned between the first terminal and the second terminal, and a shell having conductivity and a frame-like shape and a mating connector that includes a first mating terminal and a second mating terminal that are connected with the first terminal and the second terminal respectively, a mating ground terminal including a mating shielding portion (mating plate portion) positioned between the first mating terminal and the second mating terminal, and a mating shell having conductivity and a frame-like shape are fitted to each other, the ground terminal and the shell are integrally formed through bending processing for metal plate. The ground terminal and the mating ground terminal are connected with each other through elastic contact between the shielding portion and the mating shielding portion.