The invention relates to a method for producing a semiconductor assembly, in particular connecting a semiconductor chip to a heat sink. A first metal layer consisting of Pb, Cd, In or Sn is made so thin that it is bonded by means of an opposing second metal layer consisting of another metal, for example gold, in a layer consisting of intermetallic phases. This can prevent migration of the soft metals. The brittle intermetallic layer is prevented from fracturing by a continuous pressing force.

The invention relates to a method for producing a semiconductor assembly, in particular connecting a semiconductor chip to a heat sink. A first metal layer consisting of Pb, Cd, In or Sn is made so thin that it is bonded by means of an opposing second metal layer consisting of another metal, for example gold, in a layer consisting of intermetallic phases. This can prevent migration of the soft metals. The brittle intermetallic layer is prevented from fracturing by a continuous pressing force.

An optical sub-assembly includes a diode submount structure, a diode mounted to the diode submount, and a thermoelectric cooler (TEC). The TEC is in thermal contact with the diode, and the diode is positioned between the diode submount structure and the TEC.

A laser connection module including: multiple superposed electrodes connected in alternating order with opposite electricity supply poles; at least one laser diode mounted between the opposite surfaces of consecutive electrodes, making contact with them; an external structure delimiting an open space located along a light-emitting area of the laser diodes and suitable for containing the set of superposed electrodes and laser diodes; at least one tightener mounted on a first end of the external structure and which presses the set of electrodes and laser diodes against a second opposite end of the structure, establishing the fixation and mutual contact thereof; and an intermediate protective plate disposed between the at least one tightener and the end electrode closest to the at least one tightener.

A laser connection module including: multiple superposed electrodes connected in alternating order with opposite electricity supply poles; at least one laser diode mounted between the opposite surfaces of consecutive electrodes, making contact with them; an external structure delimiting an open space located along a light-emitting area of the laser diodes and suitable for containing the set of superposed electrodes and laser diodes; at least one tightener mounted on a first end of the external structure and which presses the set of electrodes and laser diodes against a second opposite end of the structure, establishing the fixation and mutual contact thereof; and an intermediate protective plate disposed between the at least one tightener and the end electrode closest to the at least one tightener.

In various embodiments, laser devices feature means, such as fasteners, for attaching a laser package to a cooling plate, which allow motion of the laser package in response to thermal cycles resulting from operation of a beam emitter therewithin. Embodiments of the invention additionally or instead include laser devices featuring segmented barrier layers for electrically isolating the laser package from the cooling plate.

An optical crystal can be mounted to a mounting block configured to receive the crystal. A base portion on the mounting block utilizes two walls forming a corner and a single biasing spring clip to secure the crystal. The spring clip applies forces in two different directions substantially orthogonal to the two walls. The spring clip is based off a symmetrical geometry which applies nearly the same force application in both directions. The spring also features bend regions that contact the crystal in such a way as to reduce the presence of point loads or stress risers. The length of contact along the crystal is maximized, allowing for proper force distribution and a sufficient surface are contact for static holding capabilities.

An apparatus for stacking and coating of very short cavity laser diode arrays. The apparatus includes an array holder fixture to securely hold the very short cavity laser diode arrays and spacer arrays, and a stacking plate. The array holder fixture including a top-side presser to secure a stack of very short cavity laser arrays and spacer arrays from a first end of the stack, a bottom-side presser to secure the stack of very short cavity laser arrays and spacer arrays from a second end of the stack, and a pair of side clamps. The array holder fixture is operatively coupled to the stacking plate during the stacking of the very short cavity laser diode arrays and spacer arrays.

The invention relates to a method for producing a semi-conductor laser arrangement, in which a first laser diode chip is arranged on a first intermediate support. A second laser diode chip is arranged on a second intermediate support. The second laser diode chip with the second intermediate support is arranged on the first intermediate support, the second intermediate support being arranged on a side of the second laser diode chip facing away from the first intermediate support. The invention furthermore relates to a semi-conductor arrangement.

A semiconductor device according to the present disclosure includes an electrically conductive first electrode block, an electrically conductive submount, an insulating layer, a semiconductor element, an electrically conductive bump, and an electrically conductive second electrode block. The submount is provided in a first region of the upper surface of the first electrode block, and electrically connected to the first electrode block. The semiconductor element is provided on the submount, and has a first electrode electrically connected to the submount. The bump is provided on the upper surface of a second electrode, opposite the first electrode, of the semiconductor element, and electrically connected to the second electrode. A third region of the lower surface of the second electrode block is electrically connected to the bump via an electrically conductive metal layer. An electrically conductive metal sheet is provided between the metal layer and the bump.