An optical apparatus comprises a package containing an optical device and having a front end face provided with a through window part 11 to which an optical fiber optically connected to the optical device is attached, a base having an attachment surface for attaching the package, a first extension arranged so as to project from the front end face along the attachment surface, and a package securing member having a tilted surface adapted to abut against the package so as to generate a force for pressing the package against the base. The package securing member is independent of the package.

In various embodiments, laser systems feature beam emitters thermally coupled to heat sinks comprising, consisting essentially of, or consisting of a metal-matrix composite of a thermally conductive metal and a refractory metal. At least a portion of the surface of the heat sink is treated to form a depleted region, and a diamond coating is deposited within and/or over the depleted region. The depleted region is substantially free of the thermally conductive metal or contains the thermally conductive metal at a concentration less than that of the body of the heat sink.

A semiconductor light emitting device includes a substrate, and an array including three or more light emitting elements which are aligned above and along a main surface of a substrate and each emit light. The light emitting elements each include a clad layer of a first conductivity type, an active layer containing In, and a clad layer of a second conductivity type disposed above the substrate sequentially from the substrate. Among the light emitting elements, the compositional ratio of In in the active layer is smaller in the light emitting element located in a central area in an alignment direction than that in the light emitting elements located in both end areas in the alignment direction.

A semiconductor laser device includes a multilayer substrate, a first conductive layer (submount) that is disposed on the multilayer substrate, a semiconductor laser element located in a first region of the first conductive layer, a first bump located on a surface of the semiconductor laser element, the surface not facing the first conductive layer, a first electrode electrically connected to the first bump, a second conductive layer located in a second region of the first conductive layer, and a second electrode electrically connected to the first conductive layer via the second conductive layer.

A semiconductor laser module includes: a semiconductor laser element that outputs a laser beam; a sub-mount material that is electrically conductive and bonded to a first surface of the semiconductor laser element; an electrode assembly that is electrically conductive and connected to a second surface of the semiconductor laser element; a conductive wire structure including a plurality of linear members interconnecting the electrode assembly and the second surface; an insulating plate bonded to the electrode assembly; and a cooling block bonded to the sub-mount material and the insulating plate for cooling the semiconductor laser element, wherein the conductive wire structure fixed to the electrode assembly is electrically connected to the semiconductor laser element after the semiconductor laser element, the sub-mount material, and the cooling block are fixed together through bonding materials.

An optical apparatus includes: an optical component opposed to and spaced apart from a light-emitting surface through which laser light is emitted; a case that houses a semiconductor laser element and the optical component and includes an introduction port for introducing gas and an exhaust port for exhausting the gas; and a flow passage section (i.e., a tubular body) including a spray port for spraying the semiconductor laser element with the gas introduced from the introduction port.

A light-source apparatus includes a light-source chip, a case, first and second electrically-conductive parts, a substrate, an electromagnetic shield plate, an electrically-conductive layer and an electrically-conductive unit. The light-source chip is received in the case. Each of the first and second electrically-conductive parts is a part of the case. The case is mounted to the substrate. The electromagnetic shield plate covers at least part of the substrate. The electrically-conductive layer is formed on the substrate and electrically connected with both the second electrically-conductive part and the electromagnetic shield plate. The electrically-conductive unit is provided to electrically connect the first electrically-conductive part and the electromagnetic shield plate.

Adjustable rotation stages include a dual-axis flexure that define first and second axes of rotation A clamp secures a laser diode beam generator or other components to the dual-axis flexure and provides adjustable rotation about a third axis that if different from the first and second axes. Rotation adjustments can be made with screws facing in a common direction.

Adjustable rotation stages include a dual-axis flexure that define first and second axes of rotation A clamp secures a laser diode beam generator or other components to the dual-axis flexure and provides adjustable rotation about a third axis that if different from the first and second axes. Rotation adjustments can be made with screws facing in a common direction.

The control unit executes: a first execution step of executing a processing program to set a target value to a value defined by a processing program and performing feedback control on a driving current of a laser oscillator; a detection step of detecting an output fluctuation during execution of the first execution step; a specification step of specifying a physical quantity for which a measured value within a predetermined monitoring time before an occurrence timing of the output fluctuation does not satisfy a predetermined condition as an abnormal physical quantity from a plurality of physical quantities measured during execution of the first execution step; and a program update step of detecting appearance of a predetermined feature in an abnormal physical quantity as a fluctuation factor during execution of a post-update processing program, and updating the processing program to correct the driving current to reduce a difference between the laser output power and the target value compared with when the output fluctuation occurs in the first execution step after detection of the fluctuation factor.