Provided is semiconductor laser device 100 including heat dissipation block 60 provided with flow path 66 of a coolant, and first and second semiconductor laser modules 10, 20. Heat dissipation block 60 include lower heat dissipation block 61 formed with groove 65, insulating sealant 62 that has openings 62a, 62b above groove 65 and is disposed on lower heat dissipation block 61, and first and second upper heat dissipation blocks 63a, 63b covering openings 62a, 62b, respectively. First semiconductor laser module 10 is disposed in contact with an upper surface of first upper heat dissipation block 63a, having a positive electrode side facing down, and second semiconductor laser module 20 is disposed in contact with an upper surface of second upper heat dissipation block 63b, having a negative electrode side facing down.

A process for creating a stabilized diode laser device is disclosed, where the stabilized diode laser device includes a unibody mounting plate and several chambers aligned along a transmission axis. Various optic components are placed in the chambers, and based on a transmission through the chambers, the optic components are aligned and secured within the chambers.

A semiconductor light emitting device includes a substrate, and an array including three or more light emitting elements which are aligned above and along a main surface of a substrate and each emit light. The light emitting elements each include a clad layer of a first conductivity type, an active layer containing In, and a clad layer of a second conductivity type disposed above the substrate sequentially from the substrate. Among the light emitting elements, the compositional ratio of In in the active layer is smaller in the light emitting element located in a central area in an alignment direction than that in the light emitting elements located in both end areas in the alignment direction.

The invention relates to a laser assembly (1) comprising a diode laser bar (2), a heat sink (4) and at least one cover (7). The laser bar is located between the heat sink and the cover. The heat sink and/or the cover is/are coated with nanowires (16) or nanotubes via which the contact between the laser bar and the heat sink and/or the cover is established.

Devices and methods are disclosed for an optical component mounting system for supporting an optical component such as a laser. The mounting system comprises a first component comprising a first surface, a second component comprising a second surface facing the first surface, and adhesive between the first surface of the first component and the second surface of the second component, wherein the first component comprises at least three mounting pads extending from the first surface for contacting the second surface of the second component and providing direct support between the first component and the second component. The component comprising the mounting pads may be a lower mount, an upper mount such as an upper clamping mount, or a bonding pad or other component in the stack of components. A method of assembling the stack of components may comprise curing the adhesive at a temperature at or above an upper end of an expected temperature operating range for the optical component mounting system.

A stabilized diode laser device is disclosed, which includes a unibody mounting plate that is mated mechanically to a thermoelectric cooler. The unibody mounting plate comprises chambers in which components, including a laser diode, are aligned and secured. A combination of the secured components within the unibody mounting plate, along with the thermoelectric cooler, provides stabilization of the laser diode.

The invention relates to an optical pulse generator comprising an active optical component adapted to emit optical radiation and electronic components of a means for electronically driving the optical component to excite the optical component to a pulsed emission of optical radiation, wherein the electronic components are arranged on a first side of a first submount, contact surfaces of the means for electronically driving are arranged on an opposite second side of the first submount, and the electronic components are connected to the contact surfaces of the means for electronically driving using electrically conductive vias in the first submount.

A mount connects a light emitting device, such as a laser diode assembly, to an optical bench. The mount may include a thermoelectrical module coupled to a sub-element of a heat exchanger extending through an opening formed in the optical bench. The thermoelectrical module acts as a heat sink to draw heat outwardly from the laser diode and cool the same. The heat sink enables the laser diode to transmit heat thereto such that substantially all of the heat generated by the laser diode sinks to the heat exchanger. As such, the laser diode transfers virtually no heat to the optical bench so the optical bench is free of deflections or distortions resultant from the heat generated during generation of the laser beam.

An example method includes stacking a plurality of laser diode bars proximate an alignment plate. Each respective laser diode bar has a front edge through which the respective laser diode bar emits light. The alignment plate has a first side that provides a common plane for aligning the front edges of the laser diode bars and a second side opposite the first side. The alignment plate has a plurality of microholes extending between the first and second sides. The method also includes applying suction to the plurality of laser diode bars through the plurality of microholes. The suction draws the front edges of the laser diode bars against the first side of the alignment plate such that the front edges of the laser diode bars are aligned in the common plane. Conductive plates used to clamp the plurality of laser diodes therebetween may be aligned in a similar fashion.

Methods, devices, and systems for laser diode packaging platforms are provided. In one aspect, a laser diode assembly includes a heat sink and a plurality of laser diode units horizontally spaced apart from one another on the heat sink. Each laser diode unit includes: a first submount positioned on the heat sink and spaced apart from adjacent another first submount, a laser diode including an active layer between a first-type doped semiconductor layer and a second-type doped semiconductor layer, a bottom side of the laser diode being positioned on the first submount, and a second submount positioned on a top side of the laser diode and spaced apart from adjacent another second submount. The first submount, the laser diode, and the second submount in the laser diode unit are vertically positioned on the heat sink. The laser diodes of the plurality of laser diode units are electrically connected in series.