A wafer comprising: a silicon substrate; a base layer of a predetermined thickness of a III-V semiconductor material bonded with the silicon substrate; and at least one layer grown on the base layer to form a plurality of quantum dot lasers.

An apparatus, comprising: a silicon substrate; and a quantum dot laser comprising: a base layer of a III-V semiconductor material, bonded with the silicon substrate; and at least one layer grown epitaxially from the base layer, wherein the at least one layer comprises a quantum dot layer. The apparatus further comprises a photonic element, fabricated on the silicon substrate and including a waveguide optically aligned with the quantum dot layer.

A mount connects a light emitting device, such as a laser diode assembly, to an optical bench. The mount may include a thermoelectrical module coupled to a sub-element of a heat exchanger extending through an opening formed in the optical bench. The thermoelectrical module acts as a heat sink to draw heat outwardly from the laser diode and cool the same. The heat sink enables the laser diode to transmit heat thereto such that substantially all of the heat generated by the laser diode sinks to the heat exchanger. As such, the laser diode transfers virtually no heat to the optical bench so the optical bench is free of deflections or distortions resultant from the heat generated during generation of the laser beam.

A light-emitting module according to an embodiment of the present technology includes a plurality of multi-light emitters each including a plurality of light-emitting elements that is arranged to be spaced apart from each other by a predetermined distance in one direction and emits light in a direction orthogonal to the one direction, and a plurality of individual electrodes that supplies each of the plurality of light-emitting elements with electric power, the plurality of multi-light emitters being arranged in the one direction. The plurality of light-emitting elements includes a first light-emitting element located at an outermost end in the one direction, and a second light-emitting element located at a second-outermost end in the one direction. The plurality of individual electrodes includes a first individual electrode that supplies the first light-emitting element with electric power, and a second individual electrode that supplies the second light-emitting element with electric power. The first individual electrode and the second individual electrode are arranged in a region between the first light-emitting element and the second light-emitting element.

An optical apparatus comprises a semiconductor substrate and a slab-coupled optical waveguide (SCOW) emitter disposed on the semiconductor substrate. The SCOW emitter comprises an optical waveguide comprising: a first region doped with a first conductivity type; a second region doped with a different, second conductivity type; and an optically active region disposed between the first region and the second region. The optically active region comprises a plurality of quantum dots.

A tunable laser device based on silicon photonics includes a substrate configured with a patterned region comprising one or more vertical stoppers, an edge stopper facing a first direction, a first alignment feature structure formed in the patterned region along the first direction, and a bond pad disposed between the vertical stoppers. Additionally, the tunable laser includes an integrated coupler built in the substrate located at the edge stopper and a laser diode chip including a gain region covered by a P-type electrode and a second alignment feature structure formed beyond the P-type electrode. The laser diode chip is flipped to rest against the one or more vertical stoppers with the P-type electrode attached to the bond pad and the gain region coupled to the integrated coupler. Moreover, the tunable laser includes a tuning filter fabricated in the substrate and coupled via a wire waveguide to the integrated coupler.

In an optical module (first module (1)), a plurality of semiconductor laser elements (a first semiconductor laser element (21) through a third semiconductor laser element (23)) that output light of wavelengths which are different from each other from light emitting points are mounted on a base member (10). The base member (10) has a reference surface (11) serving as a reference in a height direction (Z) and a mounting surface (a first mounting surface (12a) and a second mounting surface (12b)) on which the semiconductor laser elements are mounted. At least some of the plurality of semiconductor laser elements are different from each other in a height (a first light emission height (TL1) through a third light emission height (TL3)) from a surface in contact with the mounting surface to the light emitting points, and are substantially equal in a height (reference height (HL)) from the reference surface to the light emitting points.

A tunable laser device based on silicon photonics includes a substrate configured with a patterned region comprising one or more vertical stoppers, an edge stopper facing a first direction, a first alignment feature structure formed in the patterned region along the first direction, and a bond pad disposed between the vertical stoppers. Additionally, the tunable laser includes an integrated coupler built in the substrate located at the edge stopper and a laser diode chip including a gain region covered by a P-type electrode and a second alignment feature structure formed beyond the P-type electrode. The laser diode chip is flipped to rest against the one or more vertical stoppers with the P-type electrode attached to the bond pad and the gain region coupled to the integrated coupler. Moreover, the tunable laser includes a tuning filter fabricated in the substrate and coupled via a wire waveguide to the integrated coupler.

A tunable laser device based on silicon photonics includes a substrate configured with a patterned region comprising one or more vertical stoppers, an edge stopper facing a first direction, a first alignment feature structure formed in the patterned region along the first direction, and a bond pad disposed between the vertical stoppers. Additionally, the tunable laser includes an integrated coupler built in the substrate located at the edge stopper and a laser diode chip including a gain region covered by a P-type electrode and a second alignment feature structure formed beyond the P-type electrode. The laser diode chip is flipped to rest against the one or more vertical stoppers with the P-type electrode attached to the bond pad and the gain region coupled to the integrated coupler. Moreover, the tunable laser includes a tuning filter fabricated in the substrate and coupled via a wire waveguide to the integrated coupler.

A light emitting apparatus includes: a submount including a mounting face and an end face, and the end face having an upper edge apart from a front edge of the mounting face; and a quantum cascade laser disposed on the front edge and the mounting face. The quantum cascade laser includes: a laser structure having first, and second faces; a first electrode on the first face; a second electrode on the second face; and a reflecting structure on a first end face of the laser structure. The reflecting structure includes an insulating film having a first end on the first face and a second end on the second face, and a metal film having a first end on the first face, and a second end on the second face. The insulating film is disposed between the laser structure and the first end and the second end of the metal film.