Patent classifications
H01S5/06258
SPOT-SIZE CONVERTER
A spot-size converter includes first and second waveguide structures. The first waveguide structure extends longitudinally along a waveguide axis from a first end to a second end and is configured to support a first optical mode at the first end. The second waveguide structure is formed within the first waveguide structure. The second waveguide structure extends longitudinally between the first end and the second end. The second waveguide structure is configured to support a second optical mode at the second end. The second optical mode has a different diameter than the first optical mode. The second waveguide structure includes a waveguide core that has a first cross-sectional area in a first plane normal to the waveguide axis at the first end and a second cross-sectional area in a second plane normal to the waveguide axis at the second end. The second cross-sectional area is larger than the first cross-sectional area.
Intelligent subsystem
An intelligent subsystem comprising a microprocessor, a foldable/stretchable display, radio modules/transceivers, a first set of computer implementable instructions for intelligent learning (that can include (i) artificial intelligence or an artificial neural network and (ii) fuzzy logic) and a second set of computer implementable instructions in natural language is disclosed. The intelligent subsystem can (i) respond to a user's interests and/or preferences and (ii) provide a peer-to-peer transaction. Furthermore, the intelligent subsystem can be sensor-aware or context-aware.
INP-based monolithic integrated chaotic semiconductor laser chip capable of feeding back randomly diffused light
An InP-based monolithic integrated chaotic semiconductor laser chip capable of feeding back randomly diffused light, being composed of six regions: a left DFB semiconductor laser, a bidirectional SOA, a left passive optical waveguide region, a doped passive optical waveguide region, a right passive optical waveguide region, and a right DFB semiconductor laser, specifically including: an N+ electrode layer, an N-type substrate, an InGaAsP lower confinement layer, an undoped InGaAsP multiple quantum well active region layer, doped particles, distributed feedback Bragg gratings, an InGaAsP upper confinement layer, a P-type heavily doped InP cover layer, a P-type heavily doped InGaAs contact layer, a P+ electrode layer, a light-emitting region, and isolation grooves. It effectively solves problems of bulky volume of the existing chaotic laser source, the time-delay signature of chaotic laser, narrow bandwidth, and low coupling efficiency of the light and the optical waveguide.
Intelligent subsystem in access networks
An intelligent subsystem coupled with a radio transceiver, a voice processing module, a first set of computer implementable instructions in an artificial intelligence algorithm and a fuzzy logic algorithm (stored in one or more non-transitory storage medias) and a second set of computer implementable instructions to provide a search on an internet in response to a user's interest/preference (stored in the one or more non-transitory storage medias), wherein the first set of computer implementable instructions and the second set of computer implementable instructions are combined/integrated or separated.
Intelligent subsystem
An intelligent subsystem coupled with a system-on-chip (comprising a microprocessor/graphic processor), a radio transceiver (e.g. a 5G/higher than 5G bandwidth radio transceiver), a voice processing module/voice processing algorithm, a stretchable/rollable (reconfigurable in size) display component, a near-field communication device, a biometric sensor and an intelligent learning algorithm is disclosed. The intelligent subsystem can respond to a user's interests and/or preferences. Furthermore, the intelligent subsystem is sensor-aware or context-aware.
Semiconductor optical device
A semiconductor optical device is provided with a semiconductor substrate that has a length and width, a laser section that is provided on the semiconductor substrate and includes an active layer and an optical waveguide section that is provided adjacent to the laser section on the semiconductor substrate and is joined to the laser section. The optical waveguide section includes a core layer that is connected to an end portion of the active layer, and a pair of cladding layers between which the core layer is sandwiched and emits, from an emission end surface, light incident from the joining interface between the optical waveguide section and the laser section. The semiconductor optical device may be also provided with a reflection suppression layer that is provided on the upper surface of the optical waveguide section.
OPTICAL SEMICONDUCTOR DEVICE
An optical semiconductor device includes a chassis that has an external wall, a feedthrough that penetrates the external wall of the chassis and has a projection portion projecting toward outside of the chassis from the external wall, a connection terminal that is electrically connected to a component mounted in the chassis and is on the projection portion of the feedthrough, a first temperature detector that is on an external face of the external wall of the chassis and detects a temperature of the chassis, and a flexible substrate of which an end is connected to the connection terminal and of which a portion spaced from the end is connected to the first temperature detector, wherein the first temperature detector is between the external wall and the flexible substrate.
Intelligent subsystem
An intelligent subsystem coupled with a system-on-chip (comprising a microprocessor/graphic processor), a radio transceiver, a voice processing module/voice processing algorithm, a foldable display, a near-field communication device, a biometric sensor and an intelligent learning algorithm is disclosed. The intelligent subsystem can respond to a user's interests and/or preferences. Furthermore, the intelligent subsystem is sensor-aware or context-aware.
Intelligent subsystem
An intelligent subsystem coupled with a system-on-chip (comprising a microprocessor/graphic processor), a radio transceiver (e.g. a 5G/higher than 5G bandwidth radio transceiver), a voice processing module/voice processing algorithm, a foldable display component, a near-field communication device, a biometric sensor and an intelligent learning algorithm is disclosed. The intelligent subsystem can respond to a user's interests and/or preferences. Furthermore, the intelligent subsystem is sensor-aware or context-aware.
Intelligent subsystem
An intelligent subsystem coupled with a system-on-chip (comprising a microprocessor/graphic processor), a radio transceiver, a voice processing module/voice processing algorithm, a stretchable/rollable display, a near-field communication device, a biometric sensor and an intelligent learning algorithm is disclosed. The intelligent subsystem can respond to a user's interests and/or preferences. Furthermore, the intelligent subsystem is sensor-aware or context-aware.