H01S5/18377

SEMICONDUCTOR LASER ELEMENT
20230072452 · 2023-03-09 ·

A reflectivity of an end surface protective film of a semiconductor laser element is made less than or equal to 1% in a wide wavelength range. Semiconductor laser element includes semiconductor stack body having front end surface and rear end surface, and end surface protective film disposed on front end surface of semiconductor stack body. End surface protective film includes first dielectric layer disposed on front end surface and second dielectric layer stacked outside first dielectric layer. Second dielectric layer includes first layer stacked on first dielectric layer, second layer stacked on first layer, and third layer stacked on second layer. For wavelength λ, of a laser beam, refractive index n2 of second layer is higher than refractive index n1 of first layer and refractive index n3 of third layer, and a film thickness of second layer ranges from λ(8n2) to 3λ(4n2) inclusive.

REFLECTING MIRROR, VERTICAL CAVITY SURFACE EMITTING LASER, VERTICAL CAVITY SURFACE EMITTING LASER ARRAY, PROJECTOR, HEAD UP DISPLAY, MOVABLE BODY, HEAD MOUNT DISPLAY, OPTOMETRY APPARATUS, AND LIGHTING APPARATUS
20230065551 · 2023-03-02 ·

A reflecting mirror includes a first film and a second film on the first film, and has a reflection band where a center wavelength is λ. The first film includes a layer having a first average refractive index and another layer having a second average refractive index higher than the first average refractive index. The second film includes a layer having a third average refractive index and another layer having a fourth average refractive index higher than the third average refractive index. A sum of optical film thicknesses of the two layers of the first film is λ/2. A sum of optical film thicknesses of the two layers of the second film is greater than or equal to (n+1)λ/2 (n is an integer greater than or equal to 1).

Surface Emitting Laser and Method for Manufacturing the Same
20220329047 · 2022-10-13 ·

A columnar portion is formed by etching parts of an active layer and a first reflective layer. In this etching process, the columnar portion is formed by etching the first reflective layer to a position of a semiconductor layer. For example, it is etched to a thickness of approximately 3 μm.

TOP-EMITTING VERTICAL-CAVITY SURFACE-EMITTING LASER WITH BOTTOM-EMITTING STRUCTURE
20230163557 · 2023-05-25 ·

A vertical cavity surface emitting laser (VCSEL) may include a substrate layer, epitaxial layers on the substrate layer, and angled reflectors configured to receive an optical beam emitted toward a bottom surface of the VCSEL and redirect the optical beam through an exit window in a top surface of the VCSEL. In some implementations, the angled reflectors may be formed in the substrate layer. Additionally, or alternatively, the VCSEL may include molded optics, where the molded optics include the angled reflectors. In some implementations, the exit window may include an integrated lens.

SURFACE EMITTING LASER
20230112925 · 2023-04-13 ·

A surface emitting laser according to one embodiment of the disclosure includes a stacked structure including, in order, a first DBR layer, an active layer, a second DBR layer, and a first electrically conductive contact layer. The stacked structure further includes a second electrically conductive contact layer and a two-dimensional electron gas generation layer between the first DBR layer and the active layer or in the first DBR layer. The surface emitting laser further includes a first electrode layer in contact with the first electrically conductive contact layer and a second electrode layer in contact with the second electrically conductive contact layer.

SURFACE-EMITTING LASER

A surface-emitting laser includes a lower DBR layer, a cavity layer, and an upper DBR layer that are stacked in this order on top of a substrate, wherein the lower DBR layer has a first DBR layer, a contact layer, and a second DBR layer that are stacked in this order on top of the substrate, wherein the first DBR layer and the second DBR layer each include a plurality of first layers and a plurality of second layers that are alternately stacked, wherein the first layers and the second layers are each a semiconductor layer including aluminum, wherein a composition ratio of the aluminum of each first layer is lower than a composition ratio of the aluminum of each second layer, and wherein the second DBR layer includes 12 or more and 20 or fewer pairs of the first layers and the second layers.

Back side emitting light source array device and electronic apparatus having the same

Provided is a back side emitting light source array device and an electronic apparatus, the back side emitting light source array device includes a substrate, a distributed Bragg reflector (DBR) provided on a first surface of the substrate, a plurality of gain layers which are provided on the DBR, the plurality of gain layers being spaced apart from one another, and each of the plurality of gain layers being configured to individually generate light, and a nanostructure reflector provided on the plurality of gain layers opposite to the DBR, and including a plurality of nanostructures having a sub-wavelength shape dimension, wherein a reflectivity of the DBR is less than a reflectivity of the nanostructure reflector such that the light generated is emitted through the substrate.

METHOD OF MANUFACTURING VERTICAL CAVITY SURFACE EMITTING LASER ELEMENT AND VERTICAL CAVITY SURFACE EMITTING LASER ELEMENT
20230144914 · 2023-05-11 ·

A method of manufacturing a vertical cavity surface emitting laser element including a first reflector including a nitride semiconductor multilayer film, the method includes: growing a first semiconductor layer consisting of a group III semiconductor containing aluminum and indium, the growing of the first semiconductor layer consisting of growing a first layer by supplying an aluminum source gas, an indium source gas, and a nitrogen source gas, and growing a second layer by supplying an aluminum source gas, an indium source gas, and a nitrogen source gas so that an indium composition ratio of the second layer is higher than an indium composition ratio of the first layer; and growing a second semiconductor layer consisting of gallium nitride. The growing of the first semiconductor layer and the growing of the second semiconductor are repeated alternately to form the nitride semiconductor multilayer film constituting the first reflector.

Light-emitting assembly having a carrier

An assembly includes a carrier and a structure having a core formed on the carrier, wherein the core has a longitudinal extension having two end regions, a first end region is arranged facing the carrier and a second end region is arranged facing away from the carrier, the core is formed as electrically conductive at least in an outer region, the region is at least partially covered with an active zone layer, the active zone layer generates electromagnetic radiation, a mirror layer is provided at least in one end region of the core to reflect electromagnetic radiation in a direction, a first electrical contact layer contacts an electrically conductive region of the core, and a second contact layer contacts the active zone layer.

VERTICAL-CAVITY SURFACE-EMITTING LASER

A vertical-cavity surface-emitting laser (VCSEL) including a substrate including a plurality of emitters forming an array region, a lower mirror, an upper mirror, an active layer interposed between the lower mirror and the upper mirror, an aperture forming layer interposed between the upper mirror and the active layer and including an oxidation region and a window region, a connector disposed on the upper mirror, a plurality of oxidation holes passing through the upper mirror and the aperture forming layer, an upper insulation layer covering the plurality of oxidation holes, and a pad electrically connected to the connector, in which at least a portion of the connector is disposed in the plurality of oxidation holes, the plurality of emitters is disposed in substantially a honeycomb shape on the substrate, and the pad is formed on one side of the substrate adjacent to the array region.