A device includes an illumination device for emitting an illumination beam. The illumination device includes an emitter array including multiple light emitters; and a micro-lens array (MLA) including multiple micro-lenses. The MLA is positioned to receive light emitted from the emitter array. Light from the MLA forms the illumination beam. A first region of the MLA is offset from the emitter array by a first offset amount, and a second region of the MLA is offset from the emitter array by a second offset amount different than the first offset amount.

In some implementations, an optical assembly includes a substrate that includes a thermally conductive core, an IC driver chip that is disposed on a first surface of the substrate, and a VCSEL device that includes an electrically insulated surface that is disposed on the thermally conductive core of the substrate within a cavity formed in the second surface of the substrate. The VCSEL device includes a cathode contact disposed on a surface of the VCSEL device and an anode contact disposed on the surface of the VCSEL device. The VCSEL device includes a plurality of emitters and a microlens component that is disposed over the plurality of emitters on the surface of the VCSEL device.

A composite component, a device, and method for producing the composite component including a plurality of optical components, a removable sacrificial layer, a retaining structure and a common intermediate carrier are provided, wherein the optical components each have an optical element for shaping a light beam and the sacrificial layer is arranged in the vertical direction at least in places between the intermediate carrier and the optical components. The retaining structure includes retaining elements, wherein the retaining structure and the sacrificial layer form a mechanical connection between the intermediate carrier and the optical components. The optical components are mechanically connected to the intermediate carrier only via the retaining structure, wherein the retaining elements are formed in such a way that under mechanical load they release the optical components so that the optical components are formed to be detachable from the intermediate carrier and thus transferable.

Focusing optics can include optical elements disposed and bonded in a linear arrangement (linear array) in at least two rows. A transparent bonding agent can secure alignment of the at least two rows of the optical elements. Scattering elements can also be disposed in the transparent polymer to cause light diffusion. Diffused or un-diffused light from a semiconductor laser array can then be caused to pass through the optical element and illuminate a target substrate such as an imaging member in a printing system.

This disclosure provides methods and apparatuses for sorting target particles. In various embodiments, the disclosure provides a cassette for sorting target particles, methods for sorting target particles, methods of loading a microchannel for maintaining sample material viability, methods of quantifying sample material, and an optical apparatus for laser scanning and particle sorting.

A vertical-cavity surface-emitting laser (VCSEL) illuminator system includes a VCSEL die positioned perpendicular to an optical axis of a lens, the VCSEL die including respective emitter elements positioned within respective spatial zones of an emission surface of the VCSEL die, where a distance between the lens and the emission surface of the VCSEL die differs from a focal length of the lens; a diffuser situated opposite the VCSEL die with respect to the lens, resulting in an optical path of light emitted from the VCSEL die passing through the lens and the diffuser; a controller that selects emitter elements, of the emitter elements, based on an intended angular beam width of light to be emitted from the system; and a driver system that selectively applies a drive signal to the selected emitter elements in response to the selected emitter segments, elements, or zones being selected by the controller.

A device comprising: an illumination device for emitting an illumination beam, the illumination device comprising: an emitter array comprising multiple light emitters; and a meta-structure or micro-prism array comprising multiple transmission areas, the meta-structure of micro-prisms being positioned to receive light emitted from the emitter array, in which light from the meta-structure of micro-prism forms the illumination beam, in which a first one of said multiple transmission areas is arranged to emit light in a different direction than a second one of said multiple transmission areas.

Provided is a vertical cavity surface emitting laser element that includes a first substrate, a second substrate, a first DBR layer, and a second DBR layer. The first substrate is formed of a first material and includes an active layer. The second substrate is formed of a second material and is bonded to the first substrate, the second material causing light having a specific wavelength to be transmitted therethrough and being different from that of the first substrate. The first DBR layer is provided on a side of the first substrate opposite to the second substrate and reflects the light having the wavelength. The second DBR layer is provided on a side of the second substrate opposite to the first substrate and reflects the light having the wavelength.

In some implementations, an optical assembly includes a substrate that includes a thermally conductive core, an IC driver chip that is disposed on a first surface of the substrate, and a VCSEL device that includes an electrically insulated surface that is disposed on the thermally conductive core of the substrate within a cavity formed in the second surface of the substrate. The VCSEL device includes a cathode contact disposed on a surface of the VCSEL device and an anode contact disposed on the surface of the VCSEL device. The VCSEL device includes a plurality of emitters and a microlens component that is disposed over the plurality of emitters on the surface of the VCSEL device.

Disclosed is a surface-emitting laser module integrated with a metalens, and an electronic device and a laser coupling system comprising the surface-emitting laser module. According to an embodiment, a surface-emitting laser module may comprises: a surface-emitting laser comprising a photonic crystal surface-emitting laser or a topological cavity surface-emitting laser, the surface-emitting laser having a light-emitting surface; and a metalens integrated at the light-emitting surface of the surface-emitting laser.