H01S5/34353

DILUTE NITRIDE BASED LASERS, PHOTODETECTORS, AND SENSING SYSTEMS
20210111539 · 2021-04-15 ·

Disclosed herein is a laser structure comprising an active region overlying a GaAs substrate. The active region includes a dilute nitride material. The laser is configured to generate light at wavelengths greater than 1300 nm. Also disclosed herein is a photodetector comprising an absorber layer overlying a GaAs substrate. The absorber layer includes a dilute nitride material. The photodetector is configured to detect light at wavelengths greater than 1300 nm. Exemplary dilute nitride materials may include, but are not limited to, GaInNAs and GaInNAsSb. Embodiments of the disclosure may include a dilute nitride-on-GaAs laser structure and a dilute nitride-on-GaAs photodetector.

Vertical cavity surface emitting laser and method for manufacturing vertical cavity surface emitting laser

A vertical cavity surface emitting laser includes: an active layer including a quantum well structure including one or more well layers including a III-V compound semiconductor containing indium as a group III constituent element; an upper laminated region containing a carbon dopant; and a substrate for mounting a post including the active layer and the upper laminated region, in which the active layer is provided between the upper laminated region and the substrate, the quantum well structure has a carbon concentration of 210.sup.16 cm.sup.3 or less, and the upper laminated region includes a pile-up layer of indium at a position away from the active layer.

SURFACE EMITTING LASER, SURFACE EMITTING LASER DEVICE, LIGHT SOURCE DEVICE, AND DETECTION APPARATUS
20210083452 · 2021-03-18 ·

A surface emitting laser includes a substrate, a plurality of surface emitting laser elements on a first surface of the substrate, a first electrode electrically connected to a first conductive semiconductor of the surface emitting laser elements; and a second electrode electrically connected to a second conductive semiconductor of the surface emitting laser elements. Each of the surface emitting laser elements includes a first reflecting mirror on the substrate; an active layer on the first reflecting mirror; and a second reflecting mirror on the active layer. When a first contact region in which the first electrode and the first conductive semiconductor are connected to each other is on the first surface or in the first conductive semiconductor of the surface emitting laser elements. The first electrode is electrically connected to the light emitting units. The second electrode is electrically connected to each of the light emitting units.

OPTICAL SEMICONDUCTOR ELEMENT

According to one embodiment, an optical semiconductor element includes a substrate, a light emitting layer, and a distributed Bragg reflector. The light emitting layer includes an AlGaAs multi quantum well layer. The distributed Bragg reflector is provided between the substrate and the light emitting layer. A pair of a first layer and a second layer is periodically stacked in the distributed Bragg reflector. The first layer includes Al.sub.xGa.sub.1-xAs. The second layer includes In.sub.z(Al.sub.yGa.sub.1-y).sub.1-zP. A refractive index n.sub.1 of the first layer is higher than a refractive index n.sub.2 of the second layer. The first layer has a thickness larger than 0/(4n.sub.1) where 0 is a center wavelength of a band on wavelength distribution of a reflectivity of the distributed Bragg reflector. The second layer has a thickness smaller than 0/(4n.sub.2).

QUANTUM DOT LASERS AND METHODS FOR MAKING THE SAME

A quantum dot (QD) laser comprises a semiconductor substrate and an active region epitaxially deposited on the semi-conductor substrate. The active region includes a plurality of barrier layers and a plurality of QD layers interposed between each of the plurality of barrier layers. A net compressive strain associated with the plurality of QD layers is maintained below a maximum allowable strain to prevent formation of misfit dislocations within the active region of the QD laser.

Semiconductor laser diode

Provided is a semiconductor laser diode, including a GaAs/In P substrate and a multi-layer structure on the GaAs/InP substrate. The multi-layer structure includes a lower epitaxial region, an active region and an upper epitaxial region. The active region comprises a first active layer, an epitaxial region and a second active layer, the epitaxial region is disposed between the first active layer and the second active layer, the first active layer comprises one or more quantum well structures or one or more quantum dot structures, and the second active layer comprises one or more quantum well structures or one or more quantum dot structures. the epitaxial region further comprises a tunnel junction and at least one carrier confinement layer, at least one carrier confinement layer is disposed between the tunnel junction and the first active layer or between the tunnel junction and the second active layer such that the at least one carrier confinement layer blocks electrons or holes, and no electrons or holes are able to reach the tunnel junction.

SEMICONDUCTOR LASER DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR LASER DEVICE

A semiconductor laser device includes: a layered structure in which a first conductivity type cladding layer, an active layer, a second conductivity type cladding layer, and a contact layer are layered in a first direction, the layered structure including a facet in a second direction intersecting the first direction, the facet outputting laser light, a non-window region, and a window region, the window region having a bandgap larger than a bandgap of the non-window region; a first electrode electrically connected to the first conductivity type cladding layer; a second electrode that is formed on the contact layer and constitutes a current path through the layered structure with the first electrode; a passivation layer formed on the facet and having a bandgap larger than the bandgap of the window region; and a dielectric reflecting coating configured to cover an opposite side of the passivation layer from the facet.

SEMICONDUCTOR LASER DIODE

Provided is a semiconductor laser diode. Although the materials used in the conventional technology can reduce the strain, the selections of materials are relatively limited and the carrier confinement ability is not good. To solve the above-mentioned problems, a phosphorus-containing semiconductor layer is provided in a laser diode. As such, it can effectively reduce the strain of the active region or the total strain of the laser diode, and improve the carrier confinement capability of the active region. Therefore, it can effectively reduce the total strain or significantly improve carrier confinement under appropriate conditions of the laser diode. In some cases, it has the aforesaid effects. The phosphorus-containing semiconductor layer is suitable for an active region with one or more active layers. Especially after the phosphorus-containing semiconductor layer is provided in the active region with multiple active layers, high temperature performance are significantly improved or enhanced.

High-efficiency oxide VCSEL with improved light extraction, and manufacturing method thereof
10862271 · 2020-12-08 · ·

The present invention relates to a vertical cavity surface emitting laser (VCSEL) and a manufacturing method thereof, and more specifically, to a high-efficiency oxide VCSEL which emits laser beams having a peak wavelength of 860 nm, and a manufacturing method thereof.

VERTICAL-CAVITY SURFACE-EMITTING LASER WITH CHARACTERISTIC WAVELENGTH OF 910 NM

A vertical-cavity surface-emitting laser (VCSEL) and method of fabrication thereof is provided. The VCSEL includes a mesa structure disposed on a substrate. The mesa structure has a first reflector stack, a second reflector stack, and an active region disposed between the first and second reflector stacks. The active region is configured to cause the VCSEL to emit light having a characteristic wavelength of 910 nanometers. The active region includes alternating layers of quantum wells and barriers, the quantum wells having high indium content (up to 18%). The VCSEL features a first contact layer disposed at least partially on a surface of the mesa structure and configured to serve as an electrical signal layer and a second contact layer disposed at least partially about the mesa structure and configured to serve as an electrical ground.