In a crystal unit, a substrate is rectangle-shaped. A frame includes a pair of portions located in regions on the sides of a pair of short sides of the substrate on the lower surface of the substrate and forms a concave portion between these pair of portions. An electrode pad is located on the upper surface of the substrate. A connection pad is located on the lower surface of the substrate within the frame. A plurality of external terminals are located on the lower surface of the frame. A crystal element is mounted on the electrode pad. A temperature sensing element is mounted on the connection pad. A ratio S2/S1 of an area S1 of a rectangular region formed by an outer edge of the lower surface of the frame and an area S2 of a smallest rectangular region containing all of the external terminals is 0.75 to 0.91.

A resonator device includes a base and a resonator component disposed on the base. The base includes a semiconductor substrate having a first surface and a second surface that are in a front-to-back relation with each other; an integrated circuit that includes a wiring layer disposed at the second surface side and including a connection pad and includes an insulating layer disposed between the second surface and the wiring layer; a through electrode that penetrates the semiconductor substrate and the insulating layer and is coupled to the connection pad; and an annular metal layer that is disposed so as to penetrate the insulating layer between the second surface and the wiring layer and surrounds the through electrode in a plan view of the semiconductor substrate.

A vibrator device includes a semiconductor substrate, a base, a vibrating element, and a lid. The semiconductor substrate has a first surface and a second surface which is in a front-back relationship with the first surface. The base includes an integrated circuit disposed on a first surface or a second surface. The vibrating element is electrically coupled to the integrated circuit and is disposed on the first surface side. The lid is joined to the base at a joining portion of the base to accommodate the vibrating element. The integrated circuit includes a passive element, and the passive element is disposed such that at least a part of the passive element overlaps with the joining portion in a plan view from a direction orthogonal to the first surface.

A method of wafer scale packaging acoustic resonator devices and an apparatus therefor. The method including providing a partially completed semiconductor substrate comprising a plurality of single crystal acoustic resonator devices, each having a first electrode member, a second electrode member, and an overlying passivation material. At least one of the devices to be configured with an external connection, a repassivation material overlying the passivation material, an under metal material overlying the repassivation material. Copper pillar interconnect structures are then configured overlying the electrode members, and solder bump structures are form overlying the copper pillar interconnect structures.

A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.

A piezoelectric oscillator includes a base member; a piezoelectric resonator mounted on an upper surface of the base member; a lid member joined to the upper surface so as to hermetically seal the piezoelectric resonator; an electronic component mounted on a lower surface of the base member; a mounting frame joined to the lower surface so as to surround the electronic component; and a heat conduction path disposed on the base member and/or the mounting frame. The heat conduction path is electrically isolated from both of the piezoelectric resonator and the electronic component in the piezoelectric oscillator and has heat conductivity. The heat conduction path includes a first heat conduction portion inside where the base member and the mounting frame overlap, and a second heat conduction portion connected to the first heat conduction portion and disposed outside where the base member and the mounting frame overlap.

A vibrator device includes abase, a circuit element that is attached to the base, and a vibrator element that is arranged at an active surface of the circuit element and is attached to the circuit element, and the circuit element includes a terminal for frequency adjustment that is used for frequency adjustment of the vibrator element and is disposed in a region that does not overlap the vibrator element when viewed in a plan view of the active surface.

A radio frequency module includes a module substrate having main surfaces facing each other and enabling radio frequency components to be mounted on both main surfaces, a power amplifier configured to amplify transmission signals in a cellular band, and a low noise amplifier configured to amplify GPS reception signals. The power amplifier and the low noise amplifier are mounted on the same module substrate.

A clock oscillator, a clock oscillator production method and use method, and a chip including the clock oscillator are provided. The clock oscillator includes a resonator, a shock-absorbing material layer, and a base, and at least a part of the shock-absorbing material layer is located between the resonator and the base. In the clock oscillator, the shock-absorbing material layer is added between the resonator and the base, and the shock-absorbing material layer can effectively prevent a mechanical wave from being conducted between the base and the resonator, so that the resonator is protected from external vibration. This can ensure, when there is external vibration, that an output frequency of the resonator is not deteriorated and improve shock absorption performance of the clock oscillator.

When a radio-frequency module is viewed in plan in a thickness direction of a mounting substrate, an electronic component overlaps an IC component. The electronic component includes four or more filters, each of which includes an input terminal and an output terminal. The IC component includes a first switch connected to the input terminals of at least four of the four or more filters and a second switch connected to the output terminals of the at least four filters. The input terminals of the at least four filters are in a first region including a center of the electronic component when viewed in plan in the thickness direction of the mounting substrate. The output terminals of the at least four filters are in a second region between the first region and a perimeter of the electronic component when viewed in plan in the thickness direction of the mounting substrate.