An electronic component device includes first and second mount boards, and first, second, and third electronic components. The first electronic component includes a first major surface and a second major surface, and is disposed on the first mount board. The first major surface is positioned closer to the first mount board than the second major surface. The second electronic component includes a third major surface and a fourth major surface, and is disposed on the second mount board. The third major surface is positioned closer to the second mount board than the fourth major surface. The third electronic component includes a fifth major surface and a sixth major surface, and is disposed on the second mount board. The fifth major surface is positioned closer to the second mount board than the sixth major surface. The second major surface directly contacts the fourth and sixth major surfaces, or indirectly contacts the fourth and sixth major surfaces with a bonding layer interposed therebetween.

An acoustic wave device includes a first acoustic wave element including a first substrate having piezoelectricity at least in a portion thereof, a first functional electrode provided on a first surface of the first substrate, and a first wiring conductor electrically connected to the first functional electrode. The first acoustic wave element further includes a relay electrode on the first surface of the first substrate and electrically connected to a second wiring conductor, and a ground electrode on the first surface of the first substrate and electrically connected to the first functional electrode. The ground electrode is between at least one of the first functional electrode and the first wiring conductor, and the relay electrode, and is electrically insulated from the relay electrode.

An electronic element has a first surface, and an insulating surrounding member has a second surface and is in close contact with the electronic element and surrounds the electronic element while allowing the first surface to be exposed from the second surface. A wiring board faces a third surface constituted by the first surface and the second surface. An insulating joining member is interposed between the third surface and the wiring board and joins the third surface and the wiring board together. A conductive bump is located between the third surface and the wiring board and electrically connects the electronic element and the wiring board to each other. The joining member has a through hole that passes through the joining member from the third surface to the wiring board and that accommodates the bump. At least a portion of the through hole overlaps the second surface in perspective plan view.

An cartridge is combined with a smart device which is capable of communicating with a network to perform a portable, fast, field assay of a small sample biological analyte. A closed microfluidic circuit for mixes the analyte with a buffer with functionalized magnetic beads capable of being specifically combined with the analyte. A detector communicates with the microfluidic circuit in which the mixed analyte, buffer and combined functionalized magnetic beads are sensed. A microcontroller is coupled to detector for controlling the detector and for data processing an output assay signal from the detector. A user interface communicates with the microcontroller for providing user input and for providing user output through the smart device to the network.

A multiplexer includes a common terminal, a first filter configured to be connected to the common terminal, and having a first passband, a second filter configured to be connected to the common terminal, and having a second passband that at least partially overlaps the first passband, and a third filter configured to be connected to the common terminal, and having a third passband that does not overlap both the first passband and the second passband.

At least three acoustic filters circuits FC are arranged on a single chip CH. At least two of them are electrically connected already on the chip for multiplexing. This reduces space consumption and leads to smaller device size.

An acoustic wave component is disclosed. The acoustic wave component can include a bulk acoustic wave resonator and a surface acoustic wave device. The bulk acoustic wave resonator can include a first portion of a glass substrate, a first piezoelectric layer positioned on the glass substrate, and electrodes positioned on opposing sides of the first piezoelectric layer. The surface acoustic wave device can include a second portion of the glass substrate, a second piezoelectric layer positioned on the glass substrate, and an interdigital transducer electrode on the second piezoelectric layer.

A communications module includes a module substrate composed of a plurality of insulating layers, a plurality of wiring layers, and a plurality of wiring vias; and a filter module disposed on the module substrate. At least one of the wiring layers overlaps the filter module in a thickness direction of the module substrate and is connected to a ground potential to function as a ground layer, and an entirety of at least one of the wiring layers and at least one of the wiring vias disposed in a first region in the thickness direction of the module substrate between the filter module and the ground layer are electrically connected to the filter module.

Aspects of this disclosure relate to a packaged acoustic wave component with two acoustic wave devices interconnected by a thermally conductive frame, at least one of the acoustic wave devices including a multi-layer piezoelectric substrate. The multi-layer piezoelectric substrate includes a support layer and a piezoelectric layer disposed over the support layer. An interdigital transducer (IDT) electrode is disposed over the piezoelectric layer. The support layer has a high thermal conductivity, allowing heat generated by a first acoustic wave device with the multi-layer piezoelectric substrate to be transferred to a second acoustic wave device on which it is stacked to dissipate heat from the first acoustic wave device by way of the thermally conductive frame.

A multiplexer (1) includes a plurality of filters connected to a common terminal (110). The multiplexer (1) includes: a low-frequency filter (11L) that is formed of at least one surface acoustic wave resonator arranged between the common terminal (110) and the input/output terminal (120) and has a first pass band; a high-frequency filter (12H) that is connected between the common terminal (110) and the input/output terminal (130) and has a second pass band located at a higher frequency than the first pass band; and a capacitor (C.sub.B1) that is serially arranged in a connection path between the common terminal (110) and the low-frequency filter (11L). The Q value of the capacitor (C.sub.B1) in the second pass band is higher than the Q value in the second pass band of a capacitance obtained by treating the at least one surface acoustic wave resonator of the low-frequency filter (11L) as a capacitance.