A packaged electronic component comprising: an electronic component housed within a package comprising a front part of a package comprising an inner section with a front cavity therein opposite the electronic component defined by the raised frame and an outer section sealing said cavity; and a back part of the package comprising a back cavity in an inner back section, and an outer back section sealing the cavity, said back package further comprising a first and a second via through the back end around said at least one back cavity for coupling to front and back electrodes of the electronic component; the vias terminating in external contact pads adapted to couple the package in a flip chip configuration to a circuit board.

The piezoelectric vibrator element is miniaturized, and at the same time, the vibration leakage is suppressed. The piezoelectric vibrator element is formed so that the total length L1 of the piezoelectric vibrator element, the length L2 of the base, the width L3 of the connection part, the length L4 of the support arm part fulfill all of the following conditions A through C, Condition A: 0.1≦L2/L1≦0.2, Condition B: 0.4≦L3/L2≦0.6, Condition C: L4/L1≧0.7. While the miniaturization is realized by shortening the base due to the condition A, the distance via the base can be elongated due to the condition B. Further, by increasing the length of the support arm parts due to the condition C, it is possible to increase the total mass of the path transmitting the vibration to absorb the vibration to thereby further suppress the vibration leakage.

An acoustic resonator includes a substrate having via holes provided therein and having a membrane structure formed on a first surface of the substrate, and a cap accommodating the membrane structure and bonded to the substrate. The cap includes a support block in contact with the membrane structure.

In the piezoelectric vibrator element, a larger area of the electrode part making a contribution to the vibration of the piezoelectric vibrator element is ensured. The piezoelectric vibrator element is a tuning-fork piezoelectric vibrator element, provided with a pair of vibrating arm parts extending from a base, and a groove part constant in width is formed on each of principal surfaces (reverse and obverse surfaces) in the longitudinal direction of the vibrating arm part. On the side surfaces and the principal surfaces, and in the groove part of the vibrating arm part, there are formed two systems of excitation electrodes. In the case of defining a width of a bank part formed by a side surface of the vibrating arm part and a side surface of the groove part as W0, and the distance between the excitation electrodes formed on the principal surface of the vibrating arm part as an electrode separation width W1, the electrode separation width W1 is formed in a range of 1 μm<W1<3 μm so as to fulfill W0>W1. By making the electrode separation width narrower than 3 μm, it is possible to increase the width of each of the excitation electrodes formed on the principal surface (on the bank part) of the vibrating arm part. Thus, the area of the electrode part making a contribution to the vibration can be increased, and the piezoelectric effect can be improved.

According to various aspects and embodiments, a method for forming a packaged electronic device is provided. In accordance with one embodiment, the method comprises depositing a layer of temporary adhesive material on at least a portion of a surface of a first substrate having a coefficient of thermal expansion, depositing a layer of dielectric material on at least a portion of the layer of temporary adhesive material, forming at least one seal ring on at least a portion of the layer of dielectric material, providing a second substrate having a coefficient of thermal expansion that is substantially the same as the coefficient of thermal expansion of the first substrate, the second substrate having at least one bonding structure attached to a surface of the second substrate, and aligning the at least one seal ring to the at least one bonding structure and bonding the first substrate to the second substrate.

An acoustic wave filter device includes a base comprising an acoustic wave filter part formed on one surface thereof and including a bonding part formed to surround the acoustic wave filter part, and a cap including a depression groove formed therein and a bonding counterpart formed to correspond to the bonding part. The depression groove is positioned over the acoustic wave filter part. The bonding part and the bonding counterpart receive a voltage to deform and bond the bonding part and the bonding counterpart to each other.

An acoustic wave filter device includes a base having an acoustic wave filter part and a bonding part disposed thereon, the bonding part surrounding the acoustic wave filter part, and a cap having a bonding counterpart disposed thereon, the bonding counterpart being bonded to the bonding part of the base, and the bonding part includes a first bonding layer including gold, and the bonding counterpart includes a second bonding layer bonded to the first bonding layer and including tin.

Provided is a piezoelectric device capable of improving measurement precision of a temperature of a piezoelectric element. A piezoelectric device (1) includes a package (2) including a housing member (4) having a thermistor substrate (3) and a frame (7) provided to project from a first main surface (3a) of the thermistor substrate (3) and in which a housing part (6) is formed by the first main surface (3a) and the frame (7) and a lid (9) provided on the frame (7) to cover a space (5) of the housing part (6), and a piezoelectric vibration element (5) provided on the first main surface (3a) of the thermistor substrate (3) in the housing part (6), wherein the thermistor substrate (3) is a multilayer negative temperature coefficient (NTC) thermistor.

Packaged RF front end systems including a hybrid filter and an active circuit in a single package are described. In an example, a package includes an active die comprising an acoustic wave resonator. A package substrate is electrically coupled to the active die. A seal frame surrounds the acoustic wave resonator and is attached to the active die and to the package substrate, the seal frame hermetically sealing the acoustic wave resonator in a cavity between the active die and the package substrate.

A frequency adjustment method of a vibrator element includes preparing a vibrator element that has a vibrating arm, a first weight placed on one principal surface of the vibrating arm, and a second weight placed on the other principal surface of the vibrating arm, in which the first weight has a non-overlapping region which does not overlap the second weight in a plan view in a normal direction of the principal surface, preparing a substrate including a wiring portion, and fixing the vibrator element to the substrate by causing the other principal surface side of the vibrator element to face the substrate side, and irradiating the non-overlapping region of the first weight with an energy ray from one principal surface side, removing a portion of the non-overlapping region of the first weight, and adjusting a resonance frequency of the vibrating arm.