Three-dimensional packaging structure for fan-out of bonding wall of device is provided. A first surface of a device is disposed with bond pads and functional area. The device, except for the first surface, is encapsulated with encapsulation material. A first surface of the encapsulation material horizontally connected to the first surface forms a fan-out surface. A wall structure is disposed on the first surface and extends to the fan-out surface. The wall structure partially covers at least one of the bond pads and comprises first opening corresponding to the at least one of the bond pads. Cover plate is bonded with the wall structure to form cavity corresponding to the functional area and comprises at least one second opening in communication with the first opening. A metal interconnection structure is disposed on surface of the cover plate and is electrically connected to the at least one of the bond pads.

A surface acoustic wave (SAW) device including a substrate is provided. Multiple surface acoustic wave elements are disposed on the substrate. A conductive surrounding structure includes: a wall part, disposed on the substrate and surrounding the surface acoustic wave elements; and a lateral layer part, disposed on the wall part. The lateral layer part has an opening above the surface acoustic wave elements. A cap layer covers the lateral layer part and closes the opening.

When a radio-frequency module is viewed in plan in a thickness direction of a mounting substrate, an electronic component overlaps an IC component. The electronic component includes four or more filters, each of which includes an input terminal and an output terminal. The IC component includes a first switch connected to the input terminals of at least four of the four or more filters and a second switch connected to the output terminals of the at least four filters. The input terminals of the at least four filters are in a first region including a center of the electronic component when viewed in plan in the thickness direction of the mounting substrate. The output terminals of the at least four filters are in a second region between the first region and a perimeter of the electronic component when viewed in plan in the thickness direction of the mounting substrate.

A method for manufacturing a plurality of, in particular hermetically, sealed functional elements, comprising the following steps: providing a first wafer comprising the plurality of functional elements, providing a second wafer, applying a sealing material in the form of a plurality of frame structures on a first surface of the second wafer, placing the second wafer on the first wafer or vice versa, joining the first wafer with the second wafer.

A photosensitive resin composition according to the present invention is a photosensitive resin composition comprising (a) an alkali-soluble polyimide, (b) an unsaturated bond-containing compound, (c) a thermally crosslinkable compound, (d-1) a photobleaching photopolymerization initiator having the structure represented by general formula (1), and (d-2) a photopolymerization initiator having the structure represented by general formula (1) and having a molar extinction coefficient at a wavelength of 405 nm of at least 1000 L/(mol.Math.cm). (In general formula (1), R.sup.1 represents a halogen atom, hydroxy group, carboxy group, nitro group, cyano group, —NR.sup.3R.sup.4, C1-20 monovalent hydrocarbon group, C1-20 acyl group, or C1-20 alkoxy group, and R.sup.3 and R.sup.4 each independently represent a hydrogen atom or C1-10 alkyl group, provided that at least a portion of the hydrogen atoms in the hydrocarbon group, acyl group, and alkoxy group may be substituted by a halogen atom, hydroxy group, carboxy group, nitro group, cyano group, or —NR.sup.3R.sup.4, and a hydrocarbon group present in the hydrocarbon group, in the acyl group, or in the alkoxy group may be interrupted by an ether bond, thioether bond, ester bond, thioester bond, amide bond, or urethane bond. R.sup.2 represents a C1-5 alkyl group. The symbol * in the formula indicates bonding with a neighboring group via the * moiety.) The photosensitive resin composition according to the present invention is also a photosensitive resin composition comprising (a) an alkali-soluble polyimide, (b) an unsaturated bond-containing compound, (c) a thermally crosslinkable compound, and (d) at least two species of oxime ester-type photopolymerization initiators. The photosensitive resin composition according to the present invention enables a high-sensitivity, high-quality photographic patterning of the cap portion of a hollow structure. A photosensitive resin sheet that uses the photosensitive resin composition according to the present invention is useful for application to the cap of the hollow structure of an electronic component that includes a hollow structure.

An acoustic wave device includes a piezoelectric substrate including a first side defining a portion of an outer circumference, and a second side shorter than the first side, IDT electrodes on the piezoelectric substrate, a support including a cavity and on the piezoelectric substrate to surround the IDT electrodes with the cavity, first and second partitioning supports on the piezoelectric substrate and disposed in an inner side of the cavity of the support, and a cover on the support and covering the cavity of the support. An extending direction of the first partitioning support is parallel or substantially parallel to an extending direction of the first side of the piezoelectric substrate. An extending direction of the second partitioning support is orthogonal or substantially orthogonal to the extending direction of the first partitioning support.

An acoustic wave device includes a piezoelectric substrate, a first band pass filter that is on the piezoelectric substrate and has a first pass band, and a second band pass filter that is on the piezoelectric substrate and has a second pass band at a higher frequency than the first pass band. The first and second band pass filters include resonators that include respective IDT electrodes. When a first total average metallization ratio is defined as an average of metallization ratios of all of the IDT electrodes included in the first filter and a second total average metallization ratio is defined as an average of metallization ratios of all of the IDT electrodes included in the second filter, the first total average metallization ratio is greater than the second total average metallization ratio.

An acoustic wave device includes a first substrate having first and second surfaces opposite from each other, and side surfaces connecting the first and second surfaces, a first acoustic wave element disposed on the first surface of the first substrate, a second substrate that is provided over the first surface of the first substrate and over the first acoustic wave element and has a first air gap between the second and first substrates, a second acoustic wave element disposed on the second substrate, a ground terminal disposed on the second surface of the first substrate, a first metal layer provided between the first and second acoustic wave elements and located in the first air gap, and a second metal layer that covers half or more of a total area of the side surfaces of the first substrate and electrically connects the first metal layer and the ground terminal.

A stacked AW filter package includes a first substrate stacked on a second substrate. The first substrate has a first AW filter circuit on first surface and a metal layer on a second surface. The second substrate has a second AW filter circuit disposed in a cavity between the metal layer of the first substrate and a third surface of the second substrate. The metal layer is coupled to the second AW filter circuit by a metal interconnect formed in a metallization layer on a side surface of the first substrate. The metal layer provides isolation to reduce cross-talk (e.g., electromagnetic interference) within the stacked AW filter package between the first AW filter circuit and the second AW filter circuit. Including the metal layer in the stacked AW filter package improves signal quality of transmitted and received signals filtered in the first and second AW filter circuits.

An acoustic wave device includes a piezoelectric layer, electrodes, a support substrate, a resin sheet, a metallic frame, and an inorganic sheet. The electrodes oppose each other in an intersecting direction that intersects a thickness direction of the piezoelectric layer. The support substrate includes a first cavity extending through the support substrate so as to overlap at least a portion of the electrodes as viewed in the thickness direction. The resin sheet is arranged on a surface of the support substrate opposite to the piezoelectric layer to close the first cavity. The metallic frame includes a second cavity therein and surrounds the piezoelectric layer and the electrodes. The inorganic sheet is arranged on a surface of the metallic frame opposite to the piezoelectric layer to close the second cavity.