A package that includes a first filter comprising a first polymer, a substrate cap, a second filter comprising a second polymer frame, at least one interconnect, an encapsulation layer and a plurality of through encapsulation vias. The substrate cap is coupled to the first polymer frame such that a first void is formed between the substrate cap and the first filter. The second polymer frame is coupled to the substrate cap such that a second void is formed between the substrate cap and the second filter. The at least one interconnect is coupled to the first filter and the second filter. The encapsulation layer encapsulates the first filter, the substrate cap, the second filter, and the at least one interconnect. The plurality of through encapsulation vias coupled to the first filter.

A package that includes a first filter device and a second filter device coupled to the first filter device. The first filter device includes a first substrate comprising a first piezoelectric material, and a first metal layer coupled to a first surface of the first substrate. The second filter device includes a second substrate comprising a second piezoelectric material, and a second metal layer coupled to a first surface of the first substrate. The package includes a first pillar interconnect configured to be electrically coupled to the first metal layer of the first filter device, where the first pillar interconnect extends through the second filter device. The package further includes a second pillar interconnect configured to be electrically coupled to the second metal layer of the second filter device.

An acoustic wave device includes a mounting substrate, and an acoustic wave element chip. The mounting substrate includes a first major surface with an electrode land thereon, and a second major surface facing the first major surface. The acoustic wave element chip includes a piezoelectric substrate including a major surface, and a functional electrode and a bump located over the major surface of the piezoelectric substrate. The bump is joined to the electrode land. A heat radiation pattern is located over the first major surface of the mounting substrate and located within a region facing the functional electrode of the acoustic wave element chip. The heat radiation pattern is connected to an internal layer portion of the mounting substrate between the first and second major surfaces, and not electrically connected to the electrode land on the first major surface.

An electronic component module includes an electronic component, a structure body, a through wiring, and an insulator. The structure body covers at least a portion of the electronic component and has conductivity. The through wiring extends through the structure body. The insulator is disposed at least between the through wiring and the structure body.

An electronic element has a first surface, and an insulating surrounding member has a second surface and is in close contact with the electronic element and surrounds the electronic element while allowing the first surface to be exposed from the second surface. A wiring board faces a third surface constituted by the first surface and the second surface. An insulating joining member is interposed between the third surface and the wiring board and joins the third surface and the wiring board together. A conductive bump is located between the third surface and the wiring board and electrically connects the electronic element and the wiring board to each other. The joining member has a through hole that passes through the joining member from the third surface to the wiring board and that accommodates the bump. At least a portion of the through hole overlaps the second surface in perspective plan view.

An electronic component includes an insulating surrounding member surrounding the electronic element while allowing a first surface of the electronic element to be exposed from a second surface of the surrounding member. A wiring board faces a third surface comprising the first and second surfaces. An insulating joining member is interposed between the third surface and the wiring board and joins the third surface and the wiring board together. A conductive bump, located between the third surface and the wiring board, electrically connects the electronic element and the wiring board. The joining member has a first through hole that overlaps a vibration region in the first surface in perspective plan view. The joining member has a second through hole that accommodates the bump. At least a portion of at least one of the first through hole or the second through hole overlaps the second surface in perspective plan view.

Reduced in size is a radio frequency component provided on a main surface of a mounting substrate on which an external connection electrode is disposed. A radio frequency module includes a mounting substrate, a first radio frequency component, and an external connection electrode. The mounting substrate has a first main surface and a second main surface opposed to each other. The first radio frequency component has a signal terminal and a ground terminal. The first radio frequency component is provided on the second main surface. The external connection electrode is provided on the second main surface. The first radio frequency component has a third main surface and a fourth main surface opposed to each other. The signal terminal is provided on the third main surface. The ground terminal is provided on the fourth main surface.

A SAW filter includes a substrate including a piezoelectric substrate, a transmission filter, and an additional resonator. The transmission filter is a ladder-type filter filtering signals from a transmission terminal and outputting the result to an antenna terminal. Further, the transmission filter includes one or more serial resonators and one or more parallel resonators which are connected in a ladder configuration on the piezoelectric substrate. An initial stage resonator is the serial resonator. The additional resonator includes an IDT electrode on the piezoelectric substrate. The IDT electrode is connected to the transmission terminal at a stage before the transmission filter and is connected to any of the one or more GND terminals. In the additional resonator, a resonance frequency and an antiresonance frequency are located outside of a passband of the transmission filter.

An elastic wave device includes a plate-shaped elastic wave element and a resin structure including a high elastic modulus resin portion and low elastic modulus resin portions. The low elastic modulus resin portions are provided in regions of side surfaces of an elastic wave element substrate, which extend from end portions at an IDT electrode formation surface side and do not reach a surface at a side opposite to an IDT electrode formation surface, and a remaining resin portion of a portion of the resin structure, which contacts with the side surfaces of the elastic wave element substrate, is the high elastic modulus resin portion.

An elastic wave device includes an elastic wave element chip, a bump electrically connected to the elastic wave element chip, a package substrate including an electrode bonded to the bump, the elastic wave element chip mounted on the package substrate with the bump, and a sealing resin portion covering the elastic wave element chip on the package substrate. A space surrounded by the elastic wave element chip, the package substrate, and the sealing resin portion is provided. The elastic wave element chip includes a substrate having piezoelectricity, an interdigital transducer electrode, and a pad electrode. A first main surface of the substrate having piezoelectricity includes a first region and a second region closer to a second main surface than the first region. The interdigital transducer electrode is disposed in the first region. The pad electrode is disposed in the second region and bonded to the bump.