Acoustic resonator devices and filters are disclosed. An acoustic resonator chip includes a piezoelectric plate attached to a substrate, a portion of the piezoelectric plate forming a diaphragm spanning a cavity in the substrate. A first conductor pattern formed on a surface of the piezoelectric plate includes interleaved fingers of an interdigital transducer on the diaphragm and a first plurality of contact pads. A second conductor pattern is formed on a surface of an interposer, the second conductor pattern including a second plurality of contact pads. Each pad of the first plurality of contact pads is directly connected to a respective pad of the second plurality of contact pads. A seal is formed between a perimeter of the piezoelectric plate and a perimeter of the interposer.

Methods of making acoustic resonator devices and filters are disclosed. A method of fabricating an acoustic resonator device includes fabricating an acoustic resonator chip including: attaching a back surface of a piezoelectric plate to a front surface of a substrate, such that portions of the piezoelectric plate form at least first and second diaphragms spanning at least first and second cavities, and forming a first conductor pattern as one or more conductor layers on the piezoelectric plate. The first conductor pattern includes at least first and second interdigitated transducers (IDTs) and a first plurality of contact pads. The method further includes fabricating an interposer having front and back surface and a second plurality of contact pads on the interposer back surface, forming conductive balls, and bonding each of the first plurality of contact pads to a respective pad of the second plurality of contact pads using the respective conductive ball.

An elastic wave device includes an elastic wave element mounted on a mounting substrate, with the elastic wave element being sealed by a sealing resin layer. The elastic wave element is bonded to electrode lands on the mounting substrate using bumps. Recessed portions are provided on a surface of the sealing resin layer on a side opposite to the side facing the mounting substrate. A ratio D/H between a depth of the recessed portions, and a distance of a portion of the sealing resin layer from the surface to a second main surface of a piezoelectric substrate, is no less than about 1/3.

A method for packaging a chip and a chip package structure are provided. The method is used to package the chip including an acoustic filter. The packaging substrate and the device wafer are welded together, wherein the edge of the device wafer is chamfered, the packaging substrate is provided with a groove, the chamfered portion of device wafer is aligned with the groove on the substrate, and then a mask is disposed. The surface of the mask facing the device wafer is an inclined surface, forming a wedge-shaped opening. A package resin material is printed, wherein the package resin material falls into the groove through the inclined surface of the mask, and a package resin film is formed between the groove and the chamfer. The mask is removed along the first surface toward the second surface. The package resin is cured in a position where the resin film is located.

A semiconductor package includes a main substrate, a resonator device disposed above the main substrate, a wiring portion connected to the resonator device, an electrical connection structure connected to the wiring portion and the main substrate, an encapsulant encapsulating the resonator device and the electrical connection structure, and a heat dissipation member bonded to and mounted on the resonator device. A cavity is provided in the resonator device, and is formed between the resonance portion and a resonator device substrate provided in the resonator device.

A packaging method and package structure for a filter chip. The packaging method includes providing a circuit substrate, covering a first surface of the circuit substrate and/or filter chip with adhesive material and forming recessed cavities or closed cavities in the adhesive material. The method further includes adhering the filter chip to the first surface of circuit substrate via the adhesive material, such that surface acoustic wave transmitting regions of the filter chip correspond to the recessed cavities or closed cavities in the adhesive material to form a gap therebetween, and encapsulating the filter chip with encapsulating material. The method further includes forming interconnecting holes extending from a second surface of the circuit substrate to pins of the filter chip, filling the interconnecting holes with conductive material, so that the conductive material is in electrical contact with a chip pin bump or pad metal of the filter chip, and forming external pin pads on the second surface.

An acoustic wave device includes a package substrate including first and second principal surfaces, an acoustic wave element at the first principal surface, a sealing resin layer covering at least a portion of the acoustic wave element, and a metal shield film covering the sealing resin layer. The package substrate includes a ground connection electrode in the package substrate, electrically connected to the acoustic wave element, and connected to a ground potential. The package substrate includes a side surface and a connection portion connected to at least a portion of an end edge on a side with the second principal surface in the side surface and at least a portion of an outer peripheral edge in the second principal surface. The shield film reaches the side surface of the package substrate and does not reach the connection portion, and the shield film is connected to the ground connection electrode.

An electronic component includes a package substrate extending in a longitudinal direction, and chip components disposed along the longitudinal direction of the package substrate and each connected to the package substrate by a bump. A height of a bump connecting at least one chip component disposed at an end portion in the longitudinal direction among the chip components and the package substrate is greater than a height of a bump connecting at least one chip component disposed inward relative to the end portion in the longitudinal direction among the chip components and the package substrate.

The radio frequency module includes a mounting board, a first metal member, and a second metal member. The first metal member and the second metal member are disposed on the mounting board. The first metal member has a longitudinal direction along a first direction in plan view from a thickness direction of the mounting board. The second metal member has a longitudinal direction along a second direction in plan view from the thickness direction of the mounting board. The first or second metal member is placed between a first electronic component and a second electronic component. The first metal member has a first recessed portion. The second metal member has a through hole and a second recessed portion. The through hole passes through the second metal member in the direction intersecting with the second direction. The second recessed portion faces and is in contact with the first recessed portion.

A multiplexer includes: a first terminal; a second terminal; a third terminal; a first filter connected between the first and second terminals, including a first capacitor, a first inductor, and one or more first acoustic wave resonators, and having a first passband; a second filter connected between the first and third terminals, including a second capacitor, a second inductor, and one or more second acoustic wave resonators, and having a second passband higher than the first passband; a substrate having a surface on which at least one first acoustic wave resonator of the one or more first acoustic wave resonators and at least one second acoustic wave resonator of the one or more second acoustic wave resonators are located; and a metal structure located on the surface and located between the at least one first acoustic wave resonator and the at least one second acoustic wave resonator.