Patent classifications
H03H9/14541
BOUNDARY ACOUSTIC WAVE DEVICE WITH MULTI-LAYER PIEZOELECTRIC SUBSTRATE
Aspects of this disclosure relate to a boundary acoustic wave device. The boundary acoustic wave device can include two low acoustic impedance layers, an interdigital transducer electrode, piezoelectric material positioned between the interdigital transducer electrode and each of the two low acoustic impedance layers, and two high acoustic impedance substrates. The two low acoustic impedance layers can be positioned between the two high acoustic impedance substrates. Related acoustic wave filters, multiplexers, radio frequency modules, wireless communication devices, and methods are disclosed.
ACOUSTIC WAVE DEVICE WITH INTERDIGITAL TRANSDUCER ELECTRODE HAVING NON-ZERO TILT ANGLE
Acoustic wave device is disclosed. the acoustic wave device can include a piezoelectric layer and an interdigital transducer electrode over the piezoelectric layer. The interdigital transducer electrode having a non-zero tilt angle. The non-zero tilt angle can between 5° to 15°. The interdigital transducer electrode is configured to shift stopband of the acoustic wave device and to reduce a slanted stopband.
ACOUSTIC WAVE DEVICE, WAFER, AND METHOD OF MANUFACTURING WAFER
An acoustic wave device includes a support substrate, a piezoelectric layer provided on the support substrate, at least a pair of comb-shaped electrodes provided on the piezoelectric layer, each of the comb-shaped electrodes including a plurality of electrode fingers, and an insulating layer provided between the support substrate and the piezoelectric layer, the insulating layer having, in at least a part thereof, a plurality of void regions of which extending directions are different from each other when viewed from a thickness direction of the support substrate, a width in the corresponding extending direction of each of the void regions being longer than a width in a direction orthogonal to the corresponding extending direction when viewed from the thickness direction of the support substrate.
MULTILAYER PIEZOELECTRIC SUBSTRATE SURFACE ACOUSTIC WAVE DEVICE WITH TILTED MULTILAYER INTERDIGITAL TRANSDUCER ELECTRODE
An acoustic wave device is disclosed. The acoustic wave device can include a multilayer piezoelectric substrate and an interdigital transducer electrode over the multilayer piezoelectric substrate. The interdigital transducer electrode includes a first layer and a second layer over the first layer. The interdigital transducer electrode has a non-zero tilt angle that provides an improved quality factor as compared to a zero tilt angle. The acoustic wave device is configured to generate a surface acoustic wave having a wavelength L. A total number of fingers of the interdigital transducer electrode is between 50 L and 100 L. A width between a finger of the interdigital transducer electrode and an adjacent finger of interdigital transducer electrode is between 20 L and 40 L.
Acoustic wave element, filter element, and communication apparatus
An acoustic wave element 1 according to the present disclosure includes a piezoelectric substrate 2 and an IDT electrode 3 on the piezoelectric substrate 2. The IDT electrode 3 includes a multilayer structure of a first layer 35 comprised of Al containing 10% or less of a sub-component and a second layer 37 comprised of a CuAl.sub.2 alloy. The second layer 37 enables the acoustic wave element 1 to have excellent electric power resistance.
Acoustic wave device
An acoustic wave device includes a piezoelectric body portion, an interdigital transducer electrode connected to a first terminal and a second terminal, and a reflector connected to the second terminal. In the interdigital transducer electrode, in the interdigital transducer electrode, where, of a group of electrode fingers, the electrode finger located at one end in a second direction is a first end electrode finger and the electrode finger located at another end is a second end electrode finger, the first end electrode finger is located between the reflector and the second end electrode finger in the second direction. An outer busbar portion of one of a first busbar and a second busbar, not connected to the first end electrode finger, is located on an inner side in the second direction relative to a center portion, in a first direction, of the first end electrode finger.
SURFACE ACOUSTIC WAVE DEVICES AND RELATED METHODS
Surface acoustic wave devices and related methods. In some embodiments, a surface acoustic wave device for providing resonance of a surface acoustic wave having a wavelength λ can include a quartz substrate and a piezoelectric plate formed from LiTaO.sub.3 or LiNbO.sub.3 disposed over the quartz substrate. The piezoelectric plate can have a thickness greater than 2λ. The surface acoustic wave device can further include an interdigital transducer electrode formed over the piezoelectric plate. The interdigital transducer electrode can have a mass density ρ in a range 1.50 g/cm.sup.3<ρ≤6.00 g/cm.sup.3, 6.00 g/cm.sup.3<ρ≤12.0 g/cm.sup.3, or 12.0 g/cm.sup.3<ρ≤23.0 g/cm.sup.3, and a thickness greater than 0.148λ, greater than 0.079λ, or greater than 0.036λ, respectively.
TEMPERATURE COMPENSATED SURFACE ACOUSTIC WAVE DEVICES WITH MULTIPLE BURIED MASS LOADING STRIPS
An acoustic wave device comprises a substrate including a piezoelectric material, interdigital transducer (IDT) electrodes disposed on a surface of the substrate, a first dielectric film having a lower surface disposed on the IDT electrodes and the surface of the substrate, first strips formed of a first material having a density greater than a density of the first dielectric film disposed within the first dielectric film over tips of the interdigitated electrode fingers in the edge regions of the IDT electrodes, and second strips formed of a second material having a density greater than the density of the first dielectric film disposed within the first dielectric film in the gap regions of the IDT electrodes, laterally spaced from the first strips in a direction perpendicular to a direction of propagation of a main acoustic wave through the acoustic wave device, and extending only partially over the gap regions.
ELASTIC WAVE DEVICE
An elastic wave device includes an interdigital transducer electrode, a dielectric film, and a frequency adjustment film are disposed on a LiNbO.sub.3 substrate. When Euler Angles of the LiNbO.sub.3 substrate are within a range of about 0°±5°, within a range of about θ±1.5°, within a range of about 0°±10°, the interdigital transducer electrode includes a main electrode, a film thickness of the main electrode normalized by a wavelength determined in accordance with an electrode finger pitch of the interdigital transducer electrode is denoted as T, and a density ratio of a material of the main electrode to Pt is denoted as r, the film thickness of the main electrode and θ of the Euler Angles satisfy θ=−0.05°/(T/r−0.04)+31.35°.
High-frequency device and multiplexer
A high-frequency device includes: a circuit substrate including dielectric layers that are stacked, wiring patterns located on at least one of the dielectric layers, and a passive element formed of at least one of the wiring patterns, the circuit substrate having a first surface that is a surface of an outermost dielectric layer in a stacking direction of the dielectric layers; a terminal for connecting the high-frequency device to an external circuit, the terminal being located on the first surface and electrically connected to the passive element through a first path in the circuit substrate; and an acoustic wave element located on the first surface and electrically connected to the passive element through a second path in the circuit substrate.