A resonator includes a surface silicon layer as a base material, a first silicon oxide layer disposed on a first surface of the surface silicon layer, and a second silicon oxide layer disposed on the opposite side to the surface silicon layer of the first silicon oxide layer, wherein when the thickness of the surface silicon layer is represented by tsi, the thickness of the first silicon oxide layer is represented by ta, and the thickness of the second silicon oxide layer is represented by tb, the following relationships are satisfied: 0.138?tsi<ta<0.268?tsi and 0.189?tsi<tb<0.527?tsi.

A method of manufacturing a resonance device includes preparing a resonance device and adjusting a frequency of the resonator. The resonance device includes a lower lid, an upper lid joined to the lower lid, and a resonator with vibration arms that vibrate in bending vibration in an interior space between the lower and upper lids. The adjusting of the frequency of the resonator includes vibrating the vibration arms in bending vibration and thereby causing respective ends of the arms to strike the lower lid at an impact speed of 3.5?10.sup.3 ?m/sec or more. The ends of the vibration arms are made of silicon oxide, and the lower lid is made of silicon.

A resonance device is provided having a resonator with opposing upper and lower lids. The resonator includes a base, and multiple vibration arms that are connected to a front end of the base so as to extend away from the base. Moreover, a frame surrounds a periphery of the base portion and the vibration arms and one or more holding arms connect the base to the frame. The base, the vibration arms, and the holding arm include a substrate and a temperature characteristics correction layer laminated on the substrate and having a material with a coefficient of thermal expansion different from that of the substrate. The base, the vibration arms, and the holding arm are formed integrally with the substrate and the temperature characteristics correction layer.

In a resonator is provided that suppresses a shift of a resonant frequency. The resonator includes a vibration portion that has a base with front and rear ends and multiple vibration arms with fixed ends connected to the front end of the base and that extend away from the front end. Moreover, the resonator includes a frame that at least partially surrounds the vibration portion and one or more holding arms provided between the vibration portion and the frame with first ends connected to the base and the second ends connected to a region of the frame at the front end side relative to the rear end of the base portion.

A resonator is provided that suppresses a shift in resonant frequency. The resonator includes a vibration member including vibration arms extending therefrom with two or more of the vibration arms performing out-of-plane bend with different phases. Moreover, the resonator includes a base having a front end connected to the vibration arms and a rear end opposing the front end and structured to bend in a direction of the out-of-plane bend when the vibration arms perform the out-of-plane bend. Moreover, a frame surrounds a periphery of the vibration member and one or more holding arms are positioned between the vibration member and the frame. One end of each holding arm is connected to the base and the other end of the holding arm is connected to the frame. The holding arms bend in the direction of the out-of-plane bend when the base bends.

A resonator is provided that includes a base; at least three vibrating arms that include a piezoelectric film, an upper electrode, and a lower electrode; a frame; and a holding arm. Each vibrating arm includes an arm portion and a tip portion. The holding arm includes a holding side arm that extends parallel to the outer vibrating arm. A release width between the tip portion of the outer vibrating arm and the frame is larger than a release width between the holding side arm and the frame or a release width between the arm portion of the outer vibrating arm and the holding side arm.

A resonance device is provided with a reduced size and also suppresses the occurrence of deformation and breakage during operation. The resonance device includes a lower substrate, an upper substrate that defines a vibration space between the lower substrate and the upper substrate, a protruding portion that is formed on an inner surface of the lower or upper substrates. Moreover, a resonator is disposed in the vibration space and includes a base portion and vibration arms that extend in parallel to one another from the base portion along the inner surface of the lower substrate or the inner surface of the upper substrate and that vibrate in a vertical direction toward the inner surface of the lower substrate or the inner surface of the upper substrate.

A resonance device is provided that includes a resonator having a base, a vibrating arm extending from one end of the base along a first direction, a frame disposed around at least a part of the vibrating arm and holding the vibrating arm such that the vibrating arm is configured to vibrate, and a support arm connecting the base to the frame. Moreover, a first substrate is provided that includes a first recess forming at least a part of a vibration space for the resonator and a first limiting portion provided away from the support arm by a first distance in a thickness direction, in which the first distance is smaller than a distance between a bottom surface of the first recess and the vibrating arm in the thickness direction of the first substrate.

A vibrating device having vibrating arms connected to a supporter. The vibrating arms have an n-type Si layer which is a degenerated semiconductor and an exciter provided on the n-type Si layer. The exciter has a piezoelectric thin film and a first and second electrodes with the piezoelectric thin film interposed therebetween.

A resonator is provided that includes a vibrating portion including three or more vibrating arms with at least two vibrating arms that bend out of plane with different phases and a base. The resonator also includes a frame that holds the vibrating portion; and a support arm having one end connected to the frame and the other end connected to a rear end portion of the base. The other end of the support arm is connected to a position in a range from 0.1 WB to 0.1 WB, with respect to a base width WB of the base, relative to a position, on the rear end portion of the base where a center line passes in a plan view. A support arm length of the support arm is 0.2 or more times and 0.4 or less times a vibrating arm length of the vibrating arms.