A method for adjusting a resonant frequency of a resonator without impairing piezoelectricity that includes preparing a lower lid; arranging a substrate with a lower surface that faces the lower lid and forming a first electrode layer, a piezoelectric film, and a second electrode layer on an upper surface of the substrate. Moreover, a vibration arm is formed that bends and vibrates from the first electrode layer, the second electrode layer, and the piezoelectric film and an upper lid faces the lower lid with the resonator interposed therebetween. The method further includes adjusting a frequency of the resonator before or after arranging the upper lid by exciting the vibration arm by applying a voltage between the first electrode layer and the second electrode layer and by causing a part of the vibration arm to collide with either or both of the lower lid and the upper lid.

A method for manufacturing a vibrator device including a base portion having a first surface, a support portion protruding from the first surface in a normal direction of the first surface, and a vibrating arm that extends from the support portion along the first surface and that has a gap with the first surface, the method including: preparing a single crystal silicon substrate having a flat plate shape; forming, by dry etching, at least two bottomed long grooves arranged at a predetermined interval on a second surface which is one surface of the silicon substrate; and forming the vibrating arm between the second surface and a bottom surface of the long groove in a thickness direction of the silicon substrate by wet etching side surfaces of the long groove and communicating the two long grooves with each other.

A resonator that includes a base and one or more vibration arms with fixed ends connected to a front end of the base and open ends extending therefrom. Moreover, the vibration arms include first and second electrodes and a piezoelectric film that is disposed therebetween. The resonator further includes a protective film disposed opposing an upper face of the piezoelectric film and sandwiching the first electrode and a temperature characteristics adjusting film formed of a material different from a material of the protective film and that is provided on the fixed end side relative to the center of the vibration arms such that part of the protective film is exposed to a surface.

A piezoelectric vibrator that includes first and second vibration portions that vibrate with mutually reverse phases. Each of the vibration portions includes a silicon layer, a first piezoelectric layer and a second piezoelectric layer that has polarization in an opposite direction to a direction of polarization of the first piezoelectric layer. First and second electrodes are disposed on opposite sides of the second piezoelectric layer. The piezoelectric vibrator has a structure such that a first potential is applied to the first electrode of the first vibration portion and the second electrode of the second vibration portion, and a second potential is applied to the second electrode of the first vibration portion and the first electrode of the second vibration portion.

The resonator includes a vibrating portion that has three or more vibrating arms each having a fixed end and an open end and at least two vibrating arms undergoing out-of-plane bending in different phases. Moreover, the resonator includes a first base portion having a first front end connected to the fixed ends and a first rear end facing the first front end, a second base portion having a second front end facing the first rear end and a second rear end facing the second front end, and a connecting portion connected between a vicinity of a center of the first rear end and a vicinity of a center of the second front end, a holding portion that is provided in at least a part of a periphery of the vibrating portion, and a holding arm that is provided between the vibrating portion and the holding portion.

A method of forming a capacitive micro-electro-mechanical system (MEMS) sensor device includes at least one capacitive MEMS sensor element with at least one capacitive MEMS sensor cell. A patterned dielectric layer including a thick dielectric region and a thin dielectric region is formed on a top side of a first substrate. A second substrate is bonded to the thick dielectric region to provide at least one sealed micro-electro-mechanical system (MEMS) cavity. The second substrate is thinned to reduce a thickness of said second substrate to provide a membrane layer. Vias are etched through the membrane layer and said thick dielectric region extending into the first substrate to form embedded vias. A dielectric liner which lines the embedded vias is formed within the first substrate. The embedded vias are filed with electrically conductive TSV filler material to form a plurality of through-substrate vias (TSVs), said plurality of TSVs extending to at least a top of said membrane layer. A patterned metal cap layer including metal caps is formed on top of said plurality of TSVs. Trenches are etched through regions of the membrane layer for releasing a first portion of the membrane layer over said MEMS cavity to provide a MEMS electrode and to define a fixed electrode. A third substrate including an inner cavity and outer protruding portions framing said inner cavity is bonded to the thick dielectric. The protruding portions are bonded to the thick dielectric region and, together with said first substrate vacuum, seals said MEMS electrode. The plurality of TSVs on a bottom side of said first substrate are exposed.

A resonance device that includes a lower cover formed from non-degenerate silicon; a resonator having a degenerate silicon substrate with a lower surface facing the lower cover, and including first and second electrode layers laminated on the substrate with a piezoelectric film formed therebetween and having a surface opposing an upper surface of the substrate. Moreover, the lower surface of the substrate has an adjustment region where a depth or height of projections and recesses formed on the surface is larger than that in another region of the lower surface of the substrate or is a region where an area of the projections and recesses is larger than that in the other region of the lower surface of the substrate.

A resonator includes a vibrator with a base, and multiple vibrating arms extending therefrom. Moreover, a frame surrounds a periphery of the vibrating part and a holding arm couples the vibrator to the frame. The holding arm includes a pair of first support arms that are connected to the base opposite the vibrating arms and a coupling portion that couples the support arms with one another and that is connected to the frame.

A resonator including a base; two or more vibration arms connected at ends thereof to a front end of the base and spaced apart from each other across a predetermined space and extending away from the base. Moreover, a connection member connects the vibration arms that bend in the same direction when an electric field is applied. The resonator inhibit occurrence of a spurious mode that otherwise occurs in a resonator that performs out-of-plane bending.

A resonator includes a vibration portion with a base and a plurality of vibration arms each having a fixed end and a free end with the fixed end being connected to the base. Each of the plurality of vibration arms includes a piezoelectric thin film and an electrode stacked on the piezoelectric thin film. Moreover, a width of each of the plurality of vibration arms increases from the fixed end toward the free end. In addition, a width of the electrode of each of the plurality of vibration arms increases from the fixed end towards the free end of the vibration arm.