Disclosed are a full-wave drive circuit for an ultrasonic atomizing sheet and an ultrasonic electronic cigarette. In an embodiment, the ultrasonic atomizing sheet full-wave drive circuit comprises a power supply module, a microprocessor, a high-frequency square wave generation circuit, an NMOS transistor and a resonance circuit configured to convert, on the basis of the NMOS transistor, a voltage signal outputted by the high-frequency square wave generation circuit into a full-wave oscillation signal, so as to drive the ultrasonic atomizing sheet to perform full-wave oscillation. A disclosed embodiment has low requirements for a boost module, low loss of the boost module, high power conversion efficiency, small volume, low loss of NMOS transistor and low cost, is easy for debugging, and has high reliability and good atomization effect.

Embodiments of a differential bootstrapped track-and-hold circuit are disclosed. In an embodiment, the differential bootstrapped track-and-hold circuit includes first and second single-ended bootstrapped track-and-hold circuits. Each single-ended bootstrapped track-and-hold circuit includes a sampling switch connected between an input terminal and an output terminal, a sampling capacitor connected to the output terminal, and a dummy sampling switch connected between the input terminal and a dummy output terminal. The sampling switch and the dummy sampling switch are controlled by a bootstrap driver connected to the input terminal. The dummy output terminal of the first single-ended bootstrapped track-and-hold circuit is connected to the output terminal of the second single-ended bootstrapped track-and-hold circuit and the dummy output terminal of the second single-ended bootstrapped track-and-hold circuit is connected to the output terminal of the first single-ended bootstrapped track-and-hold circuit to provide signals to compensate for charge injection errors at the output terminals.

A digital step attenuator (DSA) cell and related method are provided. The DSA cell includes a first branch comprising a first resistor connected, at a first side, to an input port and, at a second side, to an output port; a second resistor connected, at a first side, to the first resistor and, at a second side, to a first transistor and a third resistor connected, at a first side, to the first resistor and, at a second side, to a second transistor. Also included in the DSA cell is a second branch, in a parallel configuration with the first resistor, that includes a fourth resistor and a third transistor. Also included is a third branch, in a parallel configuration with the first resistor, that includes a fourth transistor. The first transistor, the second transistor, the third transistor, and the fourth transistor are configured to be operated independently.

A power supply system for USB Power Delivery includes a current source drive circuit to control a power FET to regulate the supply of power along a power path. The current source drive circuit includes a cascode current source and a cascode protection circuit formed by a source follower and a feedback voltage divider. The source follower can be a transistor with its gate connected to a cascode node between upper- and lower-stage transistors of the cascode current source. The divider node of the voltage divider is connected to the gate of the lower-stage transistor. The current source drive circuit can operate within the gate-source voltage specifications of 30-volt DEPMOS devices, and can provide high output impedance to the gate of power FET and a current limit circuit during current limiting operation, without requiring an extra high-voltage mask during fabrication.

A semiconductor integrated-circuit (IC) chip comprises a memory cell including: a latch circuit comprising first and second inverters coupling to each other, a first latch node coupling to an input point of the first inverter and an output point of the second inverter and a second latch node coupling to an input point of the second inverter and an output point of the first inverter; a first N-type MOS transistor having a first terminal coupling to the first latch node, a second terminal coupling to a first output point of the memory cell, and a first gate terminal for controlling coupling between the first latch node and the first output point of the memory cell; a second N-type MOS transistor having a third terminal coupling to the second latch node, a fourth terminal coupling to a second output point of the memory cell, and a second gate terminal for controlling coupling between the second latch node and the second output point of the memory cell; and a P-type MOS transistor having a fifth terminal coupling to the first latch node, a sixth terminal coupling to a third output point of the memory cell, and a third gate terminal for controlling coupling between the first latch node and the third output point of the memory cell.

A positive-logic FET switch stack that does not require a negative bias voltage, exhibits high isolation and low insertion/mismatch loss, and may withstand high RF voltages. Embodiments include a FET stack comprising series-coupled positive-logic FETs (i.e., FETs not requiring a negative voltage supply to turn OFF), series-coupled on at least one end by an “end-cap” FET of a type that turns OFF when its V.sub.GS is zero volts. The one or more end-cap FETs provide a selectable capacitive DC blocking function or a resistive signal path. Embodiments include a stack of FETs of only the zero V.sub.GS type, or a mix of positive-logic and zero V.sub.GS type FETs with end-cap FETs of the zero V.sub.GS type. Some embodiments withstand high RF voltages by including combinations of series or parallel coupled resistor ladders for the FET gate resistors, drain-source resistors, body charge control resistors, and one or more AC coupling modules.

A bidirectional switch fault protection circuit includes a bidirectional switch circuit, a desaturation detection circuit, and a gate driver. The bidirectional switch circuit generates first and second switch voltages based on a direction of electric current. The desaturation detection circuit outputs the first switch voltage in response to the electric current flowing in a first direction and outputs the second switch voltage in response to the electric current flowing in a second direction opposite the first direction. The gate driver receives the first switch voltage in response to the electric current flowing in the first direction and the second switch voltage in response to the electric current flowing in the second direction. The gate driver detects a first short circuit condition based on the first switch voltage and a second short circuit condition based on the second switch voltage.

Embodiments are directed to rectifiers using a single bias current or bias current path to bias multiple rectifying elements. A rectifier that has multiple rectifier stages coupled together serially includes a bias current path coupled to each of the rectifier stages. The bias current path is configured to simultaneously bias rectifying elements in each of the rectifier stages by using a bias current to bias a first rectifying element and reusing the bias current to bias other rectifying elements.

A digital step attenuator (DSA) cell and related method are provided. The DSA cell includes a first branch comprising a first resistor connected, at a first side, to an input port and, at a second side, to an output port; a second resistor connected, at a first side, to the first resistor and, at a second side, to a first transistor and a third resistor connected, at a first side, to the first resistor and, at a second side, to a second transistor. Also included in the DSA cell is a second branch, in a parallel configuration with the first resistor, that includes a fourth resistor and a third transistor. Also included is a third branch, in a parallel configuration with the first resistor, that includes a fourth transistor. The first transistor, the second transistor, the third transistor, and the fourth transistor are configured to be operated independently.

According to one embodiment, a semiconductor integrated circuit device comprises first and second transistors having control terminals receiving an input signal and an inversion signal of the input signal, third and fourth transistors having control terminals receiving the input signal and the inversion signal, first and second inverters in which outputs are connected to inputs of other converters, and a fifth transistor connected to the first to fourth transistors. The third and fourth transistors are connected to outputs of the second and the first inverters. Clock signal is supplied to the fifth transistor.