An interface bridge to enable communication between a first integrated circuit die and a second integrated circuit die is disclosed. The two integrated circuit die may be connected via chip-to-chip interconnects. The first integrated circuit die may include programmable logic fabric. The second integrated circuit die may support the first integrated circuit die. The first integrated circuit die and the secondary integrated circuit die may communicate with one another via the chip-to-chip interconnects using an interface bridge. The first and second component integrated circuits may include circuitry to implement the interface bridge, which may provide source-synchronous communication using a data receive clock from the second integrated circuit die to the first integrated circuit die.

The present invention provides a circuit building system, comprising a plurality of electrically conductive and detachably and mechanically interconnectable blocks that extend between a low voltage power source and one or more electrically active members and that are selectively interconnected in such a way to build a closable electric block-defined circuit through which current is flowable to activate said one or more electrically active members and by which a triggerable action is generatable independently of a separate data line, wherein a first block of said plurality of electrically conductive blocks is an electrically switchable block that comprises first and second electrically conductive terminal members by which said activating current, in response to said triggerable action, is selectively flowable to an adjacent block of the plurality of blocks in abutting and electricity conducting relation therewith.

Provided is a semiconductor device in which influence resulting from a cell function change can be reduced. The semiconductor device includes a function cell designed using a basic cell including a first wiring layer provided over a main surface of a semiconductor substrate and having a predetermined pattern and a second wiring layer provided over the first wiring layer and having a predetermined pattern. The function cell corresponds to the basic cell which is modified to have a predetermined function by changing the pattern of the second wiring layer at a design stage. The function cell has a first layout and a second layout which are disposed in juxtaposition in one direction in a plane parallel with the main surface. The function cell is provided with the predetermined function by coupling together wires belonging to the respective second wiring layers of the first layout and the second layout.

A semiconductor device using a programming unit with is provided. A highly reliable semiconductor device using the programming unit is provided. A highly integrated semiconductor device using the programming unit is provided. In a semiconductor circuit having a function of changing a structure of connections between logic cells such as PLDs, connection and disconnection between the logic cells or power supply to the logic cells is controlled by a programming unit using an insulated gate field-effect transistor with a small amount of off-state current or leakage current. A transfer gate circuit may be provided in the programming unit. To lower driving voltage, a capacitor may be provided in the programming unit and the potential of the capacitor may be changed during configuration and during operation.

One embodiment of the invention includes a reconfigurable circuit comprising a phase-change material switch. The phase-change material switch includes an actuation portion configured to receive a control signal having one of a first state and a second state and to emit a first heat profile in response to the first state of the control signal and a second heat profile in response to the second state of the control signal. The phase-change material switch also includes a switch portion comprising a phase-change material in proximity with the actuation portion. The switch portion can be selectable between a conducting state in response to the first heat profile to conduct an input signal from an input to an output of the phase-change material switch and a blocking state in response to the second heat profile to substantially block the input signal from the input to the output.

An electrical switch circuit adapted to switch digital, high-speed signals with low power includes a plurality of input buffers each coupled to an input transmission line of a plurality of input transmission lines, wherein each input buffer utilizes a digital inverter; a plurality of output buffers each coupled to an output transmission line of a plurality of output transmission lines, wherein each output buffer utilizes a digital inverter; and a plurality of switches each coupled to an associated input transmission line and an associated output transmission line, wherein each of the input transmission line, the output transmission line, and the plurality of switches are in a single line configuration. For the low power, each of the input buffers, the output buffers, the input transmission lines, and the output transmission lines can be unterminated.

A semiconductor device using a programming unit with is provided. A highly reliable semiconductor device using the programming unit is provided. A highly integrated semiconductor device using the programming unit is provided. In a semiconductor circuit having a function of changing a structure of connections between logic cells such as PLDs, connection and disconnection between the logic cells or power supply to the logic cells is controlled by a programming unit using an insulated gate field-effect transistor with a small amount of off-state current or leakage current. A transfer gate circuit may be provided in the programming unit. To lower driving voltage, a capacitor may be provided in the programming unit and the potential of the capacitor may be changed during configuration and during operation.

The present invention provides a circuit building system, comprising a plurality of electrically conductive and detachably and mechanically interconnectable blocks that extend between a low voltage power source and one or more electrically active members and that are selectively interconnected in such a way to build a closable electric block-defined circuit through which current is flowable to activate said one or more electrically active members and by which a triggerable action is generatable independently of a separate data line, wherein a first block of said plurality of electrically conductive blocks is an electrically switchable block that comprises first and second electrically conductive terminal members by which said activating current, in response to said triggerable action, is selectively flowable to an adjacent block of the plurality of blocks in abutting and electricity conducting relation therewith.

A reconfigurable circuit comprising: a first level crossbar switch that has first non-volatile resistive switches; a second level crossbar switch that has second non-volatile resistive switches; and a first wire and third non-volatile resistive switches that are used for redundancy, wherein input wires of the second level crossbar switch are connected to output wires of the first level crossbar switch one-to-one, and input wires of the first level crossbar switch and output wires of the second level crossbar switch are connected to the first wire through the third non-volatile resistive switches.

An interface bridge to enable communication between a first integrated circuit die and a second integrated circuit die is disclosed. The two integrated circuit die may be connected via chip-to-chip interconnects. The first integrated circuit die may include programmable logic fabric. The second integrated circuit die may support the first integrated circuit die. The first integrated circuit die and the secondary integrated circuit die may communicate with one another via the chip-to-chip interconnects using an interface bridge. The first and second component integrated circuits may include circuitry to implement the interface bridge, which may provide source-synchronous communication using a data receive clock from the second integrated circuit die to the first integrated circuit die.