Provided is a programmable logic integrated circuit wherein even if a failure occurs in any resistance-variable element, remedy would be possible and hence the improvement of reliability has been achieved. In a programmable logic integrated circuit comprising resistance-variable elements, when the states of the resistance-variable elements are to be changed according to externally inputted configuration information, a control means uses a reading means to read the states of the respective resistance-variable elements, and then uses a writing means to change only the states of resistance-changing elements that are different from a state indicated by the configuration information.

A reconfigurable device and an analog circuit are formed on a single chip so that the analog circuit can be controlled by the reconfigurable device. A reconfigurable semiconductor device (1) includes a plurality of logic sections (20) and an analog section (10). The plurality of logic sections (20) are connected to each other by an address line or a data line. The analog section (10) includes a plurality of input/output sections and an output amplifier. Each of the logic sections (20) includes a plurality of address lines, a plurality of data lines, a memory cell unit, and an address decoder that decodes an address signal and that outputs a decoded signal to the memory cell unit. The plurality of logic sections (20) and the analog section (10) are mounted in the same chip package.

A reconfigurable circuit comprising: a first level crossbar switch that has first non-volatile resistive switches; a second level crossbar switch that has second non-volatile resistive switches; and a first wire and third non-volatile resistive switches that are used for redundancy, wherein input wires of the second level crossbar switch are connected to output wires of the first level crossbar switch one-to-one, and input wires of the first level crossbar switch and output wires of the second level crossbar switch are connected to the first wire through the third non-volatile resistive switches.

An interface bridge to enable communication between a first integrated circuit die and a second integrated circuit die is disclosed. The two integrated circuit die may be connected via chip-to-chip interconnects. The first integrated circuit die may include programmable logic fabric. The second integrated circuit die may support the first integrated circuit die. The first integrated circuit die and the secondary integrated circuit die may communicate with one another via the chip-to-chip interconnects using an interface bridge. The first and second component integrated circuits may include circuitry to implement the interface bridge, which may provide source-synchronous communication using a data receive clock from the second integrated circuit die to the first integrated circuit die.

Provided is a semiconductor device including a substrate with a plurality of logic cells, transistors provided in the plurality of logic cells, contact plugs connected to electrodes of the transistors, first via plugs in contact with top surfaces of the contact plugs, and first wires in contact with top surfaces of the first via plugs. The first wires may include a common conductive line connected to the plurality of logic cells through the contact plugs, and all of the first wires may be shaped like a straight line extending parallel to a specific direction.

A crosspoint switch matrix may include a plurality of point cells provided at intersections between a plurality of input pathways and a plurality of output pathways. The input pathways may be partitioned into groups, each group defined by a demultiplexer that forwards an input signal to the point cells within the group and/or to a demultiplexer of a succeeding group. The output pathways may be partitioned into groups, each group defined by a multiplexer that forwards a signal from an active point cell to an output of the matrix. Multiplexers of groups in intermediate positions between the point cell and the matrix output may relay the output signal between the multiplexers along a bypass pass. When both the input pathways and output pathways are so partitioned, each point cell may be a member of one input pathway group and one output pathway group.

An electrical switch circuit adapted to switch digital, high-speed signals with low power includes a plurality of input buffers each coupled to an input transmission line of a plurality of input transmission lines, wherein each input buffer utilizes a digital inverter; a plurality of output buffers each coupled to an output transmission line of a plurality of output transmission lines, wherein each output buffer utilizes a digital inverter; and a plurality of switches each coupled to an associated input transmission line and an associated output transmission line, wherein each of the input transmission line, the output transmission line, and the plurality of switches are in a single line configuration. For the low power, each of the input buffers, the output buffers, the input transmission lines, and the output transmission lines can be unterminated.

An interface bridge to enable communication between a first integrated circuit die and a second integrated circuit die is disclosed. The two integrated circuit die may be connected via chip-to-chip interconnects. The first integrated circuit die may include programmable logic fabric. The second integrated circuit die may support the first integrated circuit die. The first integrated circuit die and the secondary integrated circuit die may communicate with one another via the chip-to-chip interconnects using an interface bridge. The first and second component integrated circuits may include circuitry to implement the interface bridge, which may provide source-synchronous communication using a data receive clock from the second integrated circuit die to the first integrated circuit die.

An integrated circuit according to an embodiment includes: a first wiring line group including at least three first wiring lines; a second wiring line group including second wiring lines; first resistive change elements each including a first and second terminals, and a first resistive change layer; a first select circuit including first input terminals connected to the second wiring lines and a first output terminal, the first select circuit selecting a first input terminal from the first input terminals, and output information from the first output terminal; a third and fourth wiring lines; and a second select circuit selecting two first wiring lines from the first wiring line group, connecting one of the selected two first wiring lines to the third wiring line, and connecting the other one of the selected two first wiring lines to the fourth wiring line.

Provided is a semiconductor device including a substrate with a plurality of logic cells, transistors provided in the plurality of logic cells, contact plugs connected to electrodes of the transistors, first via plugs in contact with top surfaces of the contact plugs, and first wires in contact with top surfaces of the first via plugs. The first wires may include a common conductive line connected to the plurality of logic cells through the contact plugs, and all of the first wires may be shaped like a straight line extending parallel to a specific direction.