A novel semiconductor device is provided. The semiconductor device includes a programmable logic device including a programmable logic element, a control circuit, and a detection circuit. The programmable logic device includes a plurality of contexts. The control circuit is configured to control selection of the contexts. The detection circuit is configured to output a signal corresponding to the amount of radiation. The control circuit is configured to switch between a first mode and a second mode in accordance with the signal corresponding to the amount of radiation. The first mode is a mode in which the programmable logic device performs processing by a multi-context method, and the second mode is a mode in which the programmable logic device performs processing using a majority signal of signals output from the logic element multiplexed by the plurality of contexts.

A device for generating sum-of-products data includes an array of variable resistance cells, variable resistance cells in the array each comprising a programmable threshold transistor and a resistor connected in parallel, the array including n columns of cells including strings of series-connected cells and m rows of cells. Control and bias circuitry are coupled to the array, including logic for programming the programmable threshold transistors in the array with thresholds corresponding to values of a weight factor W.sub.mn for the corresponding cell. Input drivers are coupled to corresponding ones of the m rows of cells, the input drivers selectively applying inputs X.sub.m to rows m. Column drivers are configured to apply currents I.sub.n to corresponding ones of the n columns of cells. Voltage sensing circuits operatively coupled to the columns of cells.

A multi-chip package comprising: an interconnection substrate comprising an interconnection bridge embedded in the interconnection substrate, and an interconnection scheme comprising a first interconnection metal layer, a second interconnection metal layer over the first interconnection layer and the interconnection bridge, and a polymer layer between the first and second interconnection metal layers, wherein the interconnection bridge is embedded in the interconnection scheme and has sidewalls surrounded by the polymer layer; a semiconductor IC chip over the interconnection substrate and across over an edge of the interconnection bridge; a memory chip over the interconnection substrate and across over an edge of the interconnection bridge, wherein the interconnection bridge comprises a plurality of metal interconnects configured for a data bus coupling the semiconductor IC chip to the memory chip, wherein a bitwidth of the data bus between the semiconductor IC chip and the memory chip is greater than or equal to 512.

An example apparatus for analog-to-digital conversion includes a plurality of channels each including an analog-to-digital converter (ADC), a switch configured to couple a differential input to the ADC, a first offset calibration circuit coupled to an output of the ADC, a multiplier coupled to an output of the first offset calibration circuit, a second offset calibration circuit coupled to an output of the multiplier, and a pseudorandom bit sequence (PRBS) generator coupled to the switch and the multiplier. The apparatus further includes a gain calibration circuit coupled to an output of the second offset calibration circuit in each of the plurality of channels; and a time-skew calibration circuit coupled to an output of the gain calibration circuit.

The disclosure relates to systems and methods for sector-to-sector and die-to-die clock synchronization in programmable logic devices. The methods and systems may employ phase difference detector and programmable delay elements to minimize skews in the clock tree and facilitate timing closure of time-critical paths and increase in operating frequencies.

A novel semiconductor device is provided. The semiconductor device includes a programmable logic device including a programmable logic element, a control circuit, and a detection circuit. The programmable logic device includes a plurality of contexts. The control circuit is configured to control selection of the contexts. The detection circuit is configured to output a signal corresponding to the amount of radiation. The control circuit is configured to switch between a first mode and a second mode in accordance with the signal corresponding to the amount of radiation. The first mode is a mode in which the programmable logic device performs processing by a multi-context method, and the second mode is a mode in which the programmable logic device performs processing using a majority signal of signals output from the logic element multiplexed by the plurality of contexts.

A method for managing power on a programmable logic device (PLD) based accelerator unit in a computer system includes determining when the PLD based accelerator unit is in an idle state. A PLD in the PLD based accelerator unit is reconfigured from a fully operational state to a low power state in response to determining the accelerator unit is in the idle state.

An integrated circuit device may include programmable logic fabric disposed on a first integrated circuit die and having configuration memory. The integrated circuit device may also include a base die that may provide memory and/or operating supporting circuitry. The first die and the second die may be coupled using a high-speed parallel interface. The interface may employ microbumps. The first die and the second die may also include controllers for the interface.

A method includes receiving, at a field programmable gate array (FPGA), one or more Ethernet packets of a message including control or status information associated with the FPGA. The method also includes determining, by the FPGA, a payload of each packet by removing at least one Ethernet header from the packet. The method further includes removing, by the FPGA, a User Datagram Protocol (UDP) header from each packet and determining UDP header metadata. The method also includes converting, by the FPGA based on the UDP header metadata, the packets to a read or write message associated with one or more registers of the FPGA. In addition, the method includes performing, by the FPGA, a read or write of the one or more registers of the FPGA according to the read or write message.

A multi-chip package comprising: an interconnection substrate comprising an interconnection bridge embedded in the interconnection substrate, and an interconnection scheme comprising a first interconnection metal layer, a second interconnection metal layer over the first interconnection layer and the interconnection bridge, and a polymer layer between the first and second interconnection metal layers, wherein the interconnection bridge is embedded in the interconnection scheme and has sidewalls surrounded by the polymer layer; a semiconductor IC chip over the interconnection substrate and across over an edge of the interconnection bridge; a memory chip over the interconnection substrate and across over an edge of the interconnection bridge, wherein the interconnection bridge comprises a plurality of metal interconnects configured for a data bus coupling the semiconductor IC chip to the memory chip, wherein a bitwidth of the data bus between the semiconductor IC chip and the memory chip is greater than or equal to 512.