Methods, systems, and apparatus, including a system that includes a first integrated circuit chip configured to store application logic for one or more executable applications; and a second integrated circuit chip communicatively coupled to the first integrated circuit chip, the second integrated circuit chip including an instruction decoder configured to decode instructions for executing the one or more executable applications; and a communication interface configured to transmit the decoded instructions to the first integrated circuit chip to execute the one or more executable applications on the first integrated circuit chip.

The present disclosure provides chip architectures for FPGAs and other routing implementations that provide for increased memory with high bandwidth, in a reduced size, accessible with reduced latency. Such architectures include a first layer in advanced node and a second layer in legacy node. The first layer includes an active die, active circuitry, and a configurable memory, and the second layer includes a passive die with wiring. The second layer is bonded to the first layer such that the wiring of the second layer interconnects with the active circuitry of the first layer and extends an amount of wiring possible in the first layer.

A multichip package may include at least a main die mounted on a substrate. The main die may be coupled to one or more transceiver dies also mounted on the substrate. The main die may include one or more universal interface blocks configured to interface with an on-package memory device or an on-package expansion die, both of which can be mounted on the substrate. The expansion die may include external memory interface (EMIF) components for communicating with off-package memory devices and/or bulk random-access memory (RAM) components for storing large amounts of data for the main die. Smaller input-output blocks such as GPIO (general purpose input-output) or LVDS (low-voltage differential signaling) interfaces may be formed within the core fabric of the main die without causing routing congestion while providing the necessary clock source.

A method of routing interconnects of a field programmable gate array including: a plurality of logic tiles, and a tile-to-tile interconnect network, having a plurality of tile-to-tile interconnects to interconnect logic tile networks of the logic tiles, the method comprises: routing a first plurality of tile-to-tile interconnects in a first plurality of logic tiles. After routing the first plurality of tile-to-tile interconnects, routing a second plurality of tile-to-tile interconnects in a second plurality of logic tiles. The start/end point of each tile-to-tile interconnect in the first plurality and the second plurality of tiles is independent of the start/end point of the other tile-to-tile interconnects in the first and second plurality, respectively. Routing the second plurality of tile-to-tile interconnects includes connecting at least one start/end point of each tile-to-tile interconnect in the second plurality of tiles to at least one start/end point of each interconnect in the first plurality of tiles.

A method of routing interconnects of a field programmable gate array including: a plurality of logic tiles, and a tile-to-tile interconnect network, having a plurality of tile-to-tile interconnects to interconnect logic tile networks of the logic tiles, the method comprises: routing a first plurality of tile-to-tile interconnects in a first plurality of logic tiles. After routing the first plurality of tile-to-tile interconnects, routing a second plurality of tile-to-tile interconnects in a second plurality of logic tiles. The start/end point of each tile-to-tile interconnect in the first plurality and the second plurality of tiles is independent of the start/end point of the other tile-to-tile interconnects in the first and second plurality, respectively. Routing the second plurality of tile-to-tile interconnects includes connecting at least one start/end point of each tile-to-tile interconnect in the second plurality of tiles to at least one start/end point of each interconnect in the first plurality of tiles.

An integrated circuit device with a single via layer, in which the via layer includes selectable via sites and/or jumpers. The selectable via sites and/or placement of jumpers may be used to configure and interconnect components and circuitry between distinct layers of multilayer circuits. In some implementations, selectively enabling via sites, such as by filling via opening and/or using jumpers, may form a deserializer circuit with a first via configuration or a first-in first-out (FIFO) circuit with a second via configuration.

An integrated circuit device with a single via layer, in which the via layer includes selectable via sites and/or jumpers. The selectable via sites and/or placement of jumpers may be used to configure and interconnect components and circuitry between distinct layers of multilayer circuits. In some implementations, selectively enabling via sites, such as by filling via opening and/or using jumpers, may form a deserializer circuit with a first via configuration or a first-in first-out (FIFO) circuit with a second via configuration.

Provided is a programmable logic integrated circuit wherein even if a failure occurs in any resistance-variable element, remedy would be possible and hence the improvement of reliability has been achieved. In a programmable logic integrated circuit comprising resistance-variable elements, when the states of the resistance-variable elements are to be changed according to externally inputted configuration information, a control means uses a reading means to read the states of the respective resistance-variable elements, and then uses a writing means to change only the states of resistance-changing elements that are different from a state indicated by the configuration information.

Provided is a programmable logic integrated circuit wherein even if a failure occurs in any resistance-variable element, remedy would be possible and hence the improvement of reliability has been achieved. In a programmable logic integrated circuit comprising resistance-variable elements, when the states of the resistance-variable elements are to be changed according to externally inputted configuration information, a control means uses a reading means to read the states of the respective resistance-variable elements, and then uses a writing means to change only the states of resistance-changing elements that are different from a state indicated by the configuration information.

Examples of the present disclosure provide apparatuses and methods for performing multi-variable bit-length multiplication operations in a memory. An example method comprises performing a multiplication operation on a first vector and a second vector. The first vector includes a number of first elements stored in a group of memory cells coupled to a first access line and a number of sense lines of a memory array. The second vector includes a number of second elements stored in a group of memory cells coupled to a second access line and the number of sense lines of the memory array. The example multiplication operation can include performing a number of AND operations, OR operations and SHIFT operations without transferring data via an input/output (I/O) line.