An integrated circuit device may include programmable logic fabric disposed on a first integrated circuit die, such that the programmable logic fabric may include a first region of programmable logic fabric and a second region of programmable logic fabric. The first region of programmable logic fabric is configured to be programmed with a circuit design that operates on a first set of data. The integrated circuit may also include network on chip (NOC) circuitry disposed on a second integrated circuit die, such that the NOC circuitry is configured to communicate data between the first integrated circuit die and the second integrated circuit die.

An integrated circuit device may include programmable logic fabric disposed on a first integrated circuit die, such that the programmable logic fabric may include a first region of programmable logic fabric and a second region of programmable logic fabric. The first region of programmable logic fabric is configured to be programmed with a circuit design that operates on a first set of data. The integrated circuit may also include network on chip (NOC) circuitry disposed on a second integrated circuit die, such that the NOC circuitry is configured to communicate data between the first integrated circuit die and the second integrated circuit die.

An integrated circuit device may include programmable logic fabric disposed on a first integrated circuit die, such that the programmable logic fabric may include a first region of programmable logic fabric and a second region of programmable logic fabric. The first region of programmable logic fabric is configured to be programmed with a circuit design that operates on a first set of data. The integrated circuit may also include network on chip (NOC) circuitry disposed on a second integrated circuit die, such that the NOC circuitry is configured to communicate data between the first integrated circuit die and the second integrated circuit die.

This disclosure relates to integrated circuit devices that may include a network processor in a data processing die and an on-package memory in a base die. The data processing die may implement one or more network functionalities that may exchange data with low-latency memory, high capacity in the base die. The data processing die may be programmable fabric, which may be dynamically reconfigured during operation.

An information processing apparatus includes a processor connected to a programmable logic circuit. The processor is configured to: allow a first circuit reconfigured in a first region of the programmable logic circuit to execute a process; in parallel with the process of the first circuit, allow a second circuit to be reconfigured in a second region different from the first region; and adjust at least one of a clock frequency used in the process of the first circuit and a clock frequency used in reconfiguration of the second circuit so that a time point at which the process of the first circuit is completed and a time point at which the reconfiguration of the second circuit is completed will become closer to each other.

An information processing apparatus includes a processor connected to a programmable logic circuit. The processor is configured to: allow a first circuit reconfigured in a first region of the programmable logic circuit to execute a process; in parallel with the process of the first circuit, allow a second circuit to be reconfigured in a second region different from the first region; and adjust at least one of a clock frequency used in the process of the first circuit and a clock frequency used in reconfiguration of the second circuit so that a time point at which the process of the first circuit is completed and a time point at which the reconfiguration of the second circuit is completed will become closer to each other.

The present disclosure is directed to 3-D stacked architecture for Programmable Fabrics and Central Processing Units (CPUs). The 3-D stacked orientation enables reconfigurability of the fabric, and allows the fabric to function using coarse-grained and fine-grained acceleration for offloading CPU processing. Additionally, the programmable fabric may be able to function to interface with multiple other compute chiplet components in the 3-D stacked orientation. This enables multiple compute components to communicate without the need for offloading the data communications between the compute chiplets.

The present disclosure is directed to 3-D stacked architecture for Programmable Fabrics and Central Processing Units (CPUs). The 3-D stacked orientation enables reconfigurability of the fabric, and allows the fabric to function using coarse-grained and fine-grained acceleration for offloading CPU processing. Additionally, the programmable fabric may be able to function to interface with multiple other compute chiplet components in the 3-D stacked orientation. This enables multiple compute components to communicate without the need for offloading the data communications between the compute chiplets.

Various techniques are provided to implement fast boot for programmable logic devices (PLDs). In one example, a method includes receiving configuration data associated with a PLD. The PLD includes an array of configuration memory cells including logic block memory cells and input/output (I/O) block memory cells associated with the PLD's logic fabric and I/O fabric, respectively. The method further includes programming a subset of the I/O block memory cells with the configuration data, and providing a wakeup signal to activate functionality associated with a portion of the I/O fabric. The method further includes programming remaining configuration memory cells of the array with the configuration data, where the remaining configuration memory cells include at least a subset of the logic block memory cells. The method further includes providing a wakeup signal to activate functionality associated with at least a portion of the logic fabric. Related systems and devices are provided.

Various techniques are provided to implement fast boot for programmable logic devices (PLDs). In one example, a method includes receiving configuration data associated with a PLD. The PLD includes an array of configuration memory cells including logic block memory cells and input/output (I/O) block memory cells associated with the PLD's logic fabric and I/O fabric, respectively. The method further includes programming a subset of the I/O block memory cells with the configuration data, and providing a wakeup signal to activate functionality associated with a portion of the I/O fabric. The method further includes programming remaining configuration memory cells of the array with the configuration data, where the remaining configuration memory cells include at least a subset of the logic block memory cells. The method further includes providing a wakeup signal to activate functionality associated with at least a portion of the logic fabric. Related systems and devices are provided.