A method for an FPGA includes coupling a first electrode of a first resistive element to a first input voltage, coupling a second electrode of a second resistive element to a second input voltage, applying a first programming voltage to a shared node of a second electrode of the first resistive element, a first electrode of the second resistive element, and to a gate of a transistor element, and changing a resistance state of the first resistive element to a low resistance state while maintaining a resistance state of the second resistive element, when a voltage difference between the first programming voltage at the second terminal and the first input voltage at the first terminal exceeds a programming voltage associated with the first resistive element.

The present invention relates to a computation cell and a self-healing, fault-tolerant FPGA architecture and, more particularly, to a computation cell and an FPGA including the same, which can detect a transient internal error or permanent internal error by inputting an original function and a spare function and comparing a prestored error detection code with a generated error detection code signal. The computation cell and the self-healing, fault-tolerant FPGA architecture of the present invention can reconfigure stem cells and look-up tables included in the computation cell and can output a normal output signal even if a transient error or a permanent error is generated in an computation cell such that the corresponding computation cell and an computation tile can be normally operated.

Methods and systems for operating a programmable logic fabric including a dynamic parameter scaling controller that tracks an operating parameter that functions at multiple operating conditions by maintaining the operating parameter while cycling through a multiple operating conditions during a calibration mode using the calibration configuration for the programmable logic fabric. The dynamic parameter scaling controller also stores one or more functional values for the operating parameter in a calibration table. The dynamic parameter scaling controller also operates the programmable logic fabric using a design configuration using dynamic values for the operating parameter based at least in part on the one or more operating conditions.

Systems for monitoring or control can include reconfigurable input and output channels. Such reconfigurable channels can include as few as a single terminal and a ground pin, or such channels can include three or four terminal configuration such as for use in four-terminal resistance measurements. Channel reconfiguration can be accomplished such as using software-enabled or firmware-enabled control of channel hardware. Such channel hardware can include analog-to-digital and digital-to-analog conversion capability, including use of a digital-to-analog converter to provide field power or biasing. In an example, the interface circuit can provide a selectable impedance.

Systems and methods for providing external bus protection for programmable logic devices (PLDs) are disclosed. An example system includes a programmable I/O bus configured to interface with a user device over an external bus interface coupled to a PLD; a bus protection circuit arrangement integrated with the programmable I/O interface and configured to provide I/O bus supply voltage protection for the programmable I/O interface; and a bus protection control signal generator. The bus protection control signal generator generates a default bus protection control signal for the bus protection circuit arrangement of the PLD prior to completion of a power ramp performed by the user device; an intermediate bus protection control signal for the PLD prior to completion of loading a PLD configuration into a PLD fabric of the PLD; and an operational bus protection control signal for the PLD.

Systems and methods for providing external bus protection for programmable logic devices (PLDs) are disclosed. An example system includes a programmable I/O bus configured to interface with a user device over an external bus interface coupled to a PLD; a bus protection circuit arrangement integrated with the programmable I/O interface and configured to provide I/O bus supply voltage protection for the programmable I/O interface; and a bus protection control signal generator. The bus protection control signal generator generates a default bus protection control signal for the bus protection circuit arrangement of the PLD prior to completion of a power ramp performed by the user device; an intermediate bus protection control signal for the PLD prior to completion of loading a PLD configuration into a PLD fabric of the PLD; and an operational bus protection control signal for the PLD.

Systems and methods for monitoring a number of operating conditions of a programmable device are disclosed. In some implementations, the system may include a root monitor including circuitry configured to generate a reference voltage, a plurality of sensors and satellite monitors distributed across the programmable device, and a network-on-chip (NoC) interconnect system coupled to the root monitor and to each of the plurality of satellite monitors. Each of the satellite monitors may be in a vicinity of and coupled to a corresponding one of the plurality of sensors via a local interconnect.

A method of handling integrated circuit dies with defects is provided. After forming a plurality of dies on one or more silicon wafers, test equipment may be used to identify defects on the dies and to create corresponding defect maps. The defect maps can be combined to form an aggregate defect map. Circuit design tools may create keep-out zones from the aggregate defect map and run learning experiments on each die, while respecting the keep-out zones, to compute design metrics. The circuit design tools may further create larger keep-out zones and run additional learning experiments on each die while respecting the larger keep-out zones to compute additional design metrics. The dies can be binned into different Stock Keeping Units (SKUs) based on one or more of the computed design metrics. Circuit design tools automatically respect the keep-out regions for these dies to program them correctly in the field.

A method of handling integrated circuit dies with defects is provided. After forming a plurality of dies on one or more silicon wafers, test equipment may be used to identify defects on the dies and to create corresponding defect maps. The defect maps can be combined to form an aggregate defect map. Circuit design tools may create keep-out zones from the aggregate defect map and run learning experiments on each die, while respecting the keep-out zones, to compute design metrics. The circuit design tools may further create larger keep-out zones and run additional learning experiments on each die while respecting the larger keep-out zones to compute additional design metrics. The dies can be binned into different Stock Keeping Units (SKUs) based on one or more of the computed design metrics. Circuit design tools automatically respect the keep-out regions for these dies to program them correctly in the field.

A system, may include a processor configured to receive circuit design data, identify one or more critical paths of the circuit design data, and generate one or more synthetic tunable replica circuits (STRCs) that may mimic the one or more critical paths. The processor may then compile the circuit design data and the one or more STRCs into program data. The system may also include an integrated circuit including a control circuit that may receive the program data from the processor, program a plurality of programmable logic regions of the integrated circuit to implement the circuit design data and the one or more STRCs, and adjust one or more operating parameters of at least one of the plurality of programmable logic regions based on the one or more STRCs.