The various embodiments described herein include methods, devices, and systems for operating superconducting circuitry. In one aspect, a programmable circuit includes: (1) a superconducting component arranged in a multi-dimensional array of alternating narrow and wide portions, the superconducting component having an input terminal at a first end and an output terminal at a second end opposite of the first end; and (2) control circuitry coupled to the narrow portions of the superconducting component, the control circuitry configured to transition the narrow portions between superconducting and non-superconducting states. In some implementations, the superconducting component and the control circuitry are formed on different layers of the programmable circuit.

The various embodiments described herein include methods, devices, and systems for operating superconducting circuitry. In one aspect, a programmable circuit includes: (1) a superconducting component arranged in a multi-dimensional array of alternating narrow and wide portions, the superconducting component having an input terminal at a first end and an output terminal at a second end opposite of the first end; and (2) control circuitry coupled to the narrow portions of the superconducting component, the control circuitry configured to transition the narrow portions between superconducting and non-superconducting states. In some implementations, the superconducting component and the control circuitry are formed on different layers of the programmable circuit.

A semiconductor device, able to be selectively configured to perform one or more user defined logic functions, includes a semiconductor die and a selectable power regulator. The semiconductor die, in one aspect, includes a first region and a second region. The first region is operatable to perform a first set of logic functions based on a first power domain having a first voltage. The second region is configured to perform a second set of logic functions based on a second power domain having a second voltage. The selectable power regulator, in one embodiment, provides the second voltage for facilitating the second power domain in the second region of the semiconductor die in response to at least one enabling input from the first region of the semiconductor die.

A semiconductor device, able to be selectively configured to perform one or more user defined logic functions, includes a semiconductor die and a selectable power regulator. The semiconductor die, in one aspect, includes a first region and a second region. The first region is operatable to perform a first set of logic functions based on a first power domain having a first voltage. The second region is configured to perform a second set of logic functions based on a second power domain having a second voltage. The selectable power regulator, in one embodiment, provides the second voltage for facilitating the second power domain in the second region of the semiconductor die in response to at least one enabling input from the first region of the semiconductor die.

Embodiments include a memory device with an improved calibration circuit. Memory device input/output pins include delay lines for adjusting the delay in each memory input/output signal path. The delay adjustment circuitry includes digital delay lines for adjusting this delay. Further, each digital delay line is calibrated via a digital delay line locked loop which enables adjustment of the delay through the digital delay line in fractions of a unit interval across variations due to differences in manufacturing process, operating voltage, and operating temperature. The disclosed techniques calibrate the digital delay lines by measuring both the high phase and the low phase of the clock signal. As a result, the disclosed techniques compensate for duty cycle distortion by combining the calibration results from both phases of the clock signal. The disclosed techniques thereby result in lower calibration error relative to approaches that measure only one phase of the clock signal.

Embodiments include a memory device with an improved calibration circuit. Memory device input/output pins include delay lines for adjusting the delay in each memory input/output signal path. The delay adjustment circuitry includes digital delay lines for adjusting this delay. Further, each digital delay line is calibrated via a digital delay line locked loop which enables adjustment of the delay through the digital delay line in fractions of a unit interval across variations due to differences in manufacturing process, operating voltage, and operating temperature. The disclosed techniques calibrate the digital delay lines by measuring both the high phase and the low phase of the clock signal. As a result, the disclosed techniques compensate for duty cycle distortion by combining the calibration results from both phases of the clock signal. The disclosed techniques thereby result in lower calibration error relative to approaches that measure only one phase of the clock signal.

Provided is a method and an apparatus for optimizing memory power and provide a method and an apparatus for optimizing memory power by minimizing power consumed by pins of a memory by using an SBR pattern. The method of optimizing memory power using a PAM-4 (Pulse-Amplitude Modulation-4) method includes: setting a ratio and sizes of a pull-up transistor and a pull-down transistor included in a driver according to a smallest size of a plurality of eyes included in an eye diagram of a memory; and setting a reference voltage of a sampler and a phase interpolator (PI) digital code value included in the memory by using a signal bit response (SBR) pattern.

Provided is a method and an apparatus for optimizing memory power and provide a method and an apparatus for optimizing memory power by minimizing power consumed by pins of a memory by using an SBR pattern. The method of optimizing memory power using a PAM-4 (Pulse-Amplitude Modulation-4) method includes: setting a ratio and sizes of a pull-up transistor and a pull-down transistor included in a driver according to a smallest size of a plurality of eyes included in an eye diagram of a memory; and setting a reference voltage of a sampler and a phase interpolator (PI) digital code value included in the memory by using a signal bit response (SBR) pattern.

Techniques and apparatus for reducing low frequency power supply spurs in clock signals. One example circuit generally includes a first power supply circuit configured to generate a first power supply voltage on a first power supply rail, a second power supply circuit configured to generate a second power supply voltage on a second power supply rail, a clock distribution network, and a feedback circuit coupled between the second power supply rail and at least one input of the first power supply circuit. The feedback circuit may be configured to sense the second power supply voltage, to process the sensed second power supply voltage, and to output at least one feedback signal to control the first power supply circuit based on the processed second power supply voltage. The clock distribution network may include first and second sets of clock drivers powered by the first and second power supply voltages, respectively.

Systems and methods for frequency reference generation are described. In an embodiment, a frequency reference circuit, includes: a bandgap proportional to temperature (PTAT) generator circuit that generates a bandgap PTAT current; a resistor complementary to temperature (CTAT) generator circuit that generates a resistor CTAT current; an adder that adds the PTAT current and the CTAT current to generate a constant current I.sub.cons; a switched-resistor (switched-R) circuit that receives the constant current I.sub.cons and a previously generated output clock and generates an output; a bandgap voltage reference generator circuit that generates a bandgap voltage V.sub.BG; an integrator circuit that receives the output of the switched-R circuit and the bandgap voltage V.sub.BG and generates an output; and a voltage-controlled oscillator (VCO) circuit that receives the output of the integrator circuit and generates a frequency reference.