A sound pickup device includes: a housing; a mount portion via which the housing on an object constituting a portion of a musical instrument; a sound pickup including a plurality of the microphones respectively oriented in different directions; a first output configured to output a sound signal indicating a sound input to the sound pickup; and an installer configured to install the sound pickup on the housing such that each of the plurality of microphones is oriented away from the object when the housing is mounted on the object via the mount portion.

A sound pickup device includes: a housing; a mount portion via which the housing is mounted on an object; a sound pickup including a microphone; a first output configured to output a sound signal indicating a sound input to the sound pickup; an installer configured to install the sound pickup on the housing; a sensor configured to detect a vibration transmitted to the housing; and a second output configured to output a vibration signal indicating the vibration detected by the sensor.

A loudspeaker and a method of operation which allow for the production and emphasis of extremely low bass tones. The loudspeaker generally is formed from a loudspeaker driver cone of conventional type which is placed in a very small enclosure with two waveguides attached thereto. A smaller balance waveguide is positioned forward of the face of the cone and a larger tuning waveguide is positioned to the side of the cone. The cross-sectional area of the aperture connections of both waveguides to the enclosure are small compared to the cross-sectional area of the loudspeaker driver cone.

This application relates to MEMS devices, especially MEMS capacitive transducers and to processes for forming such MEMS transducer that provide increased robustness and resilience to acoustic shock. The application describes a MEMS transducer having a flexible membrane (101) supported relative to a first surface of a substrate (105) which has one or more cavities therein, e.g. to provide an acoustic volume. A stop structure (401, 402) is positioned so as to be contactable by the membrane when deflected so as to limit the amount of deflection of the membrane. The stop structure defines one or more openings to the one or more substrate cavities and comprises at least one narrow support element (401, 402) within or between said one or more openings. The stop structure thus limits the amount of membrane deflection, thus reducing the stress experienced at the edges and prevents the membrane from contacting a sharp edge of a substrate cavity. As the stop structure comprises narrow support elements any performance impact on the transducer is limited.

A microphone and a method for producing a microphone are disclosed. The microphone includes a substrate, a spring element plastically elongated in a direction perpendicular to the substrate, a transducer element in electrical contact with the substrate by way of the spring element and a cover to which the transducer element is fastened, the cover is arranged in such a way that the transducer element is arranged between the cover and the substrate.

An electroacoustic transducer includes a diaphragm, a frame disposed to surround a rim portion of the diaphragm, a front support body and a rear support body that couple the diaphragm and the frame, and a magnetic circuit provided with an annular magnetic gap facing a rear face of the diaphragm. The electroacoustic transducer further includes a voice coil body having a rear end disposed in the magnetic gap and a front end coupled to the diaphragm.

The present disclosure relates to microphones and electronic devices having the same. A microphone may include a housing for receiving vibration signals; a converting component inside the housing for converting the vibration signals into electrical signals, and a processing circuit for processing the electrical signals. The converting component may include a transducer and at least one damping film attached to the transducer.

Provided is an electronic device that can be appropriately used as a type of electronic device that vibrates a panel attached to a housing. The electronic device includes a piezoelectric element, a panel, to which the piezoelectric element is attached, that vibrates due to the piezoelectric element to generate a vibration sound transmitted by vibrating a part of a human body, a housing supporting the panel with a first face, a microphone contained within the housing and disposed on a second face, and a buffer that damps vibration transmitted from the panel to the microphone through the first face and/or the second face, thereby reducing noise picked up by the microphone.

A surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphone package has a cover, and the MEMS microphone die is substrate-mounted and acoustically coupled to an acoustic port provided in the surface mount package. The substrate and the cover are joined together to form the MEMS microphone, and the substrate and cover cooperate to form an acoustic chamber for the substrate-mounted MEMS microphone die.

A single enclosure multi-channel loudspeaker product 100 uses a novel signal processing system and method to achieve a surprisingly effective psycho-acoustically expanded image breadth by inter-aural crosstalk cancellation, in a manner which relies on a new method for cancellation of apparent sources of inter-aural crosstalk. In the commonly owned Polk SDA (prior art) method, the optimal distance between stereo pair main and effect (SDA) loudspeakers was required to be substantially equal to the ear-to-ear width of a typical user's head. Compact SDA speaker system 100 employs digital signal processing generating selected time delays to acoustically simulate the optimal placement of an effects transducer relative to its main transducer for a physically compact configuration having each side's main transducer (e.g., 108LMS) spaced at less than 5.5 inches from the side's corresponding SDA (or effects) transducer (e.g., 108LSS), and this permits the system enclosure to be surprisingly compact, (e.g., width of as little as 341.2 mm).