A heater assembly having a laminate heater plate and a shaft. The laminate heater plate is formed from a plurality of layers, wherein one or more layers may comprise one or more of a heating element, an RF electrode, a cooling channel, and an RTD sensor.

A wafer placement table includes a ceramic plate, an electrode embedded in the ceramic plate, a hollow ceramic shaft attached to a surface of the ceramic plate, a power-supplying member running inside the ceramic shaft and connected to a terminal of the electrode, a plate-side attaching site defined on the ceramic plate and to which the power-supplying member is attached, a power-source-side attaching site defined at a free end of the ceramic shaft and to which the power-supplying member is attached, and a redirecting member provided inside the ceramic shaft. The power-source-side attaching site is defined in correspondence with the plate-side attaching site and in such a manner as to be shifted from the plate-side attaching site in plan view. The redirecting member holds the power-supplying member such that the power-supplying member extending from the power-source-side attaching site is forcibly redirected toward the plate-side attaching site.

A ceramic heater with a shaft includes a ceramic plate in which an RF electrode and a resistance heating element are embedded; a hollow ceramic shaft provided on a surface on an opposite side of a wafer placement surface of the ceramic plate; an RF power supply rod which is housed in an inner space of the ceramic shaft, and a heating element power supply rod which is housed in the inner space of the ceramic shaft, wherein an outer circumferential surface of a portion of at least one of the RF power supply rod and the heating element power supply rod is covered with an insulating thin film which is an aerosol deposition film or a thermal spray film, the portion being located in the inner space of the ceramic shaft.

A ceramic heater with a shaft includes: a ceramic plate in which resistance heating elements are embedded; a hollow ceramic shaft bonded to a surface on an opposite side of a wafer placement surface of the ceramic plate; multiple vertical grooves provided in an internal circumferential surface of the ceramic shaft in an axial direction; conductive films provided in the multiple vertical grooves, respectively; and connection members that each electrically connect a terminal of the resistance heating elements to a corresponding one of the conductive films.

A heater includes a base body, terminal and joining layer. The base body is made of ceramic. The joining layer contains metal as a principal ingredient and is located between the base body and the terminal. The base body includes a first surface and second surface. The first surface faces an outer side of the base body and includes at least one of a region which is superimposed on the terminal and a region which is located on a periphery of the terminal. The second surface intersects with the first surface and is located on the side closer to an internal portion of the base body on the side away from the first surface. The joining layer extends from the terminal and first surface up to the second surface.

An apparatus for treating a substrate is provided. The apparatus includes: a support member provided in a process chamber and configured to support the substrate; and a heater heating element provided in the support member and configured to heat the substrate, wherein at least a part of the heater heating element comprises a first region to which a laser trimming process is applied, at least another part of the heater heating element comprises a second region on which a resistance adjusting material layer is implemented by an electrolytic plating process, and the amount of heat generated in the first region that is at least a part of the heater heating element is increased by performing the laser trimming process and the amount of heat generated in the second region that is at least another part of the heater heating element is decreased by forming the resistance adjusting material layer.

A ceramic heater includes: a ceramic plate having a wafer placement surface on a surface thereof; zone heaters embedded in the ceramic plate so as to correspond to zones defined by dividing the surface of the ceramic plate into multiple sections; terminals connected to ends of the zone heaters via internal wires of the ceramic plate; terminal collection regions in which the plurality of terminals are collectively arranged; and non-terminal regions in which no terminal is arranged. The ceramic heater includes, as the zone heaters, a terminal-collection-region zone heater provided in a zone corresponding to the terminal collection regions, and a non-terminal regions zone heater provided in a zone corresponding to the non-terminal regions.

Embodiments of the present disclosure generally relate to a pedestal for increasing temperature uniformity in a substrate supported thereon. The pedestal comprises a body having a heater embedded therein. The body comprises a patterned surface that includes a first region having a first plurality of posts extending from a base surface of the body at a first height, and a second region surrounding the central region having a second plurality of posts extending from the base surface at a second height that is greater than the first height, wherein an upper surface of each of the first plurality of posts and the second plurality of posts are substantially coplanar and define a substrate receiving surface.

A heater for a semiconductor processing chamber is disclosed that includes a ceramic body, and a resistive heating element embedded in the ceramic body, the resistive heating element disposed in a heater coil having an inner central sector and an outer central sector, the inner central sector having a plurality of first peaks and the outer central sector having a plurality of second peaks, wherein the number of first peaks is less than about fifty-six, and the number of second peaks is less than about eighty.

An electrode-embedded member includes a disc-shaped base that is formed of a ceramic sintered body, an electrode embedded in the base, and a plurality of pin-shaped projections projecting upward from an upper surface of the base. The upper surface of the base is a curved surface having a shape protruding toward a center. The plurality of pin-shaped projections include first pin-shaped projections whose heights from the upper surface to respective upper ends are substantially identical to each other, and second pin-shaped projections whose heights from the upper surface to respective upper ends are each lower than the height of each of the first pin-shaped projections.