The disclosure provides an electronic device. The electronic device includes a plurality of units. Each of the units includes an integrated substrate. The integrated substrate includes a first dielectric layer, a first conductive layer, a second dielectric layer, and a second conductive layer. The first dielectric layer has a first side and a second side opposite to the first side. The first conductive layer is disposed on the first side. The second dielectric layer has a third side facing the second side and a fourth side opposite to the third side. The second conductive layer is disposed on the fourth side. A loss tangent of at least one of the first dielectric layer and the second dielectric layer is less than or equal to 0.1 and greater than 0. The electronic device of an embodiment of the disclosure may improve product yield.

Various embodiments disclosed in the disclosure relate to a flexible connection member and an electronic device comprising same, the flexible connection member having an RF line for signal transmission formed therein, wherein an impedance of the RF line is prevented from being changed even when a flexible printed circuit board is bent. According to one embodiment, a connection member may be provided, the connection member comprising, a first conductive layer including a first logic line, and a second conductive layer in contact with the first conductive layer and including a bonding sheet layer, wherein the second conductive layer includes, a second logic line formed on part of the second conductive layer, and an RF line formed on other part of the second conductive layer, the bonding sheet layer includes, the second conductive layer adhered over the second logic line and the RF line, a first insulating layer formed between the first conductive layer and the second conductive layer, and pins formed on one side of the first conductive layer and the second conductive layer and configured to be electrically connected to connection pins of an external module, and the second conductive layer includes at least one via formed between the second logic line and the RF line so as to energize between the layers included in the second conductive layer. Such a flexible connection member may vary according to embodiments, and an electronic device comprising the flexible connection member may be provided according to various other embodiments.

A flexible wiring board includes a layer including an impedance control line capable of transmitting a high frequency signal and a conductive layer including a conductor positioned along the impedance control line. The flexible wiring board is capable of transmitting high frequency signals well.

A wiring circuit board includes a porous insulating layer, and a first conductive layer sequentially toward one side in the thickness direction. The first conductive layer includes a first signal wire and first ground wires. Each of the first ground wires is thicker than the first signal wire.

A multilayer printed circuit board having a stackup including an upper half of the stackup and a lower half of the stackup, the multilayer printed circuit board having a top exposed surface and a bottom exposed surface, a first trace and via structure, having one portion disposed on the top exposed surface and another portion disposed within the upper half of the stackup, a second trace and via structure, having one portion disposed on the top exposed surface and another portion disposed within the upper half of the stackup, and first electrical components and second electrical components disposed on the top exposed surface of the multilayer printed circuit board and associated, respectively, with the first trace and via structure and the second trace and via structure, wherein the first electrical components are mounted orthogonally with respect to the second electrical components.

To provide a wiring substrate, an electronic device, and an electronic module the size of which can be easily reduced and the strength of which can be maintained. A wiring substrate includes an insulation substrate and an electrical wiring structure. The insulation substrate includes a recess section in one surface. A frame portion of the insulation substrate that forms a side surface which connects an opened surface and a bottom surface of the recess section to each other includes a first conductive portion having a plate shape in the frame portion.

An object is to obtain a power conversion device that can suppress the generation of noise due to coupling and achieve the size reduction of a substrate. In a power conversion device, a main circuit wire for connecting main circuit components to form a main circuit includes a first main circuit wire and a second main circuit wire wired so as to be separated from each other on a substrate. A control wire is wired between the first main circuit wire and the second main circuit wire so as to be insulated therefrom, and the first main circuit wire and the second main circuit wire are connected to each other via the main circuit component placed so as to be separated from the control wire in the thickness direction of the substrate.

A low passive intermodulation (PIM) coaxial-to-printed circuit board (PCB) interface and method of constructing the same. According to one aspect, a coaxial-to-PCB interface couples signals between an electrical conductor trace in the PCB and an inner conductor of a coaxial structure having an insulator surrounded by an outer conductor. A metallic cylinder is inserted over the outer conductor of the coaxial structure and positioning the coaxial structure with respect to the PCB so that the outer conductor and insulator of the coaxial structure lie below a lower surface of the PCB. The inner conductor of the coaxial structure is inserted into a via extending from the lower surface of the PCB to an upper surface of the PCB. Solder is deposited in the via to provide an electrically conductive path between the electrical conductor trace of the PCB and the inner conductor of the coaxial structure.

Embodiments of the present disclosure relate to the field of communication device technology, which provide a circuit board including a first signal line and a second signal line that are disposed adjacent to each other, a ground plane, and a conductive layer connected to the ground plane. The conductive layer is disposed between the first signal line and the second signal line. Embodiments of the present disclosure further provide a communication device.

To provide a wiring substrate, an electronic device, and an electronic module the size of which can be easily reduced and the strength of which can be maintained. A wiring substrate includes an insulation substrate and an electrical wiring structure. The insulation substrate includes a recess section in one surface. A frame portion of the insulation substrate that forms a side surface which connects an opened surface and a bottom surface of the recess section to each other includes a first conductive portion having a plate shape in the frame portion.