A printed circuit board includes a plurality of layers including attachment layers and routing layers; first and second signal vias forming a differential signal pair, the first and second signal vias extending through the attachment layers and connecting to respective signal traces on a breakout layer of the routing layers; an antipad of a first type around and between the first and second signal vias in one or more of the attachment layers; and antipads of a second type around the first and second signal vias in at least one routing layer adjacent to the breakout layer.

A circuit board includes an insulating layer, a ground layer formed on a first surface of the insulating layer and including a plurality of openings arranged in first and second surface directions, each of the openings having a shape of a polygon having five or more sides, and a wiring layer formed on a second surface of the insulating layer opposite to the first surface.

Certain aspects of the present disclosure relate to methods and apparatus for allocating resources for the transmission of scheduling requests based on UE traffic profiles. In one embodiment, a base station determines, for one or more user equipments (UEs), a type of traffic to be exchanged between the one or more UEs and the base station. The base station allocates resources for the one or more UEs to use for sending a scheduling request based, at least in part, on the type of traffic associated with each of the one or more UEs. The base station signals an indication of the allocated resources to each of the one or more UEs.

A circuit board structure with selectively corresponding ground layers includes a first ground layer, a second ground layer, and a dielectric layer arranged between the first ground layer and the second ground layer to define a ground layer height difference between the first ground layer and the second ground layer. The first ground layer includes a plurality of non-electromagnetic shield areas. The circuit board includes a plurality of conductor wires formed thereon and selectively classified and divided into a first group of conductor wires and the second group of conductor wires. The first-group conductor wires are arranged to correspond to and electromagnetically couple to the first ground layer, and the second-group conductor wires are arranged to correspond to and electromagnetically couple to the second ground layer through the non-electromagnetic shield areas respectively, so that impedance value control is achieved.

An exemplary bridging inter-connector establishes electrical connections between conductors on a PCB and aligned conductors on a first board mounted to the PCB. A flexible non-conductive sheet covers at least a portion of these conductors. Separated conductive strips on the sheet that are dimensioned to align with and engage at least a portion of both the aligned conductors. A thin film of a bonding agent is disposed on the separated conductive strips and located to engage at least a portion of both aligned conductors to form a conductive connection.

A grounding structure of the high-frequency circuit board includes a dielectric substrate, a back surface ground electrode, an upper ground electrode, and a microstripline upper electrode. The dielectric substrate has a first surface and a second surface, and is provided with a first through-hole. A first opening of the first through-hole at the first surface is smaller than a second opening of the first through-hole at the second surface. A first grounding conductor layer is provided in the first through-hole. The back surface ground electrode is provided at the second surface and is connected with the first grounding conductor layer. The upper ground electrode is provided at the first surface and is connected with the first ground conductor layer. The microstripline upper electrode is provided at the first surface.

A first ground elimination portion 3a formed in a ground layer is formed in a size such that a characteristic impedance determined by the first ground elimination portion 3a and component pads 1a is higher than a characteristic impedance determined by a ground conductor 2a and a transmission line 1b. When an outer shapes of the component pads 1a are projected on the ground layer, the center of a region interposed between the conductor pads 1a is positioned at the center of the first ground elimination portion 3a.

A high-frequency circuit is configured so as to include a printed circuit board and a flexible circuit board connected to the printed circuit board, wherein the printed circuit board includes: a first dielectric layer having a first surface and a second surface, a first ground conductor being formed on the first surface; a second dielectric layer having a third surface and a fourth surface, a second ground conductor being formed on the fourth surface; and first signal lines wired between the second surface and the third surface, the flexible circuit board includes: a third dielectric layer having a fifth surface and a sixth surface, a third ground conductor being formed on the fifth surface; a fourth dielectric layer having a seventh surface and an eighth surface, a fourth ground conductor being formed on the eighth surface; and second signal lines wired between the sixth surface and the seventh surface, and a connecting portion between the printed circuit board and the flexible circuit board includes: a plurality of first connecting conductors each having a first end connected to each of the first signal lines and a second end exposed from the fourth surface in a non-conductive state with the second ground conductor; and a plurality of second connecting conductors each having a first end exposed from the fifth surface in a non-conductive state with the third ground conductor and connected to the second end of each of the first connecting conductors, and a second end connected to each of the second signal lines.

Apparatus and methods are provided for providing provide high-speed traces in inner layers of semiconductor packages or PCBs. In an exemplary embodiment, there is provided an circuit assembly that may comprise a first ground reference plane, a second ground reference plane and a dielectric layer between the first ground reference plane and the second ground reference plane. The dielectric layer may comprise a pair of traces embedded therein and the first ground reference plane may have an opening corresponding to the pair of traces. The opening may have a width equal to or larger than a width of the pair of traces, which may be equal to widths of respective traces of the pair of traces and a gap between the pair of traces.

A radio frequency connector includes a substrate, a first ground plane disposed upon the substrate, a signal conductor having a first contact point, with the first contact point being configured to electrically mate with a second contact point, and a first ground boundary configured to electrically mate with a second ground boundary, with the first ground boundary being formed as an electrically continuous conductor within the substrate.